Datasheet MC12095D, MC12095SD Datasheet (Motorola)

Page 1

SEMICONDUCTOR
TECHNICAL DATA
MECL PLL COMPONENTS
÷2, ÷4 LOW POWER
PRESCALER
WITH STAND–BY MODE
Order this document by MC12095/D
PLASTIC PACKAGE
CASE 940 (SSOP–8)
PIN CONNECTIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
8
1
1
8
IN
(Top View)
8
IN
V
CC NC
OUT
SB SW
Gnd
7 6 5
1 2 3 4
Device
Operating
Temp Range
Package
ORDERING INFORMATION
MC12095D MC12095SD
TA =
–40° to +85°C
SO–8
SSOP–8
       
The MC12095 is a single modulus prescaler for low power frequency division of a 2.5 GHz high frequency input signal. Motorola’s advanced MOSAIC V technology is utilized to acheive low power dissipation of 24 mW at a minimum supply voltage of 2.7 V.
On–chip output termination provides output current to drive a 2.0 pF (typical) high impedance load. If additional drive is required for the prescaler output, an external resistor can be added in parallel from the OUT pin to GND to increase the output power. Care must be taken not to exceed the maximum allowable current through the output.
Divide ratio control input (SW) selects the required divide ratio of ÷2 or ÷4. Stand–By mode is available to reduce current drain to 100µA typical when the standby pin SB is switched LOW disabling the prescaler.
2.5 GHz Toggle Frequency
Supply Voltage 2.7 V to 5.5 Vdc
Low Power 8.7 mA Typical
Operating Temperature –40 to 85°C
Divide by 2 or 4 Selected by the SW Pin
NOTE: For applications up to 1.1 GHz, please consult the MC12093 datasheet.
MOSAIC V is a trademark of Motorola
FUNCTIONAL TABLE
SW Divide Ratio
H 2 L 4
NOTES: 1.SW: H = (VCC – 0.4 V) to VCC; L = OPEN
2.SB: H = 2.0 V to VCC; L = GND to 0.8 V
Motorola, Inc. 1997 Rev 3
AC Test Circuit
SB
SW
OUT
GND
C4
IN
IN
50
C2
C1
V
CC
C3
EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1
µ
F
C4 = 2.0 pF
VCC = 2.7 to 5.5 V
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MC12095
2
MOTOROLA RF/IF DEVICE DATA
MAXIMUM RATINGS
Parameter
Symbol Value Unit
Power Supply Voltage, Pin 2 V
CC
–0.5 to 6.0 Vdc
Operating Temperature Range T
A
–40 to 85 °C Storage Temperature Range Tstg –65 to 150 °C Maximum Output Current, Pin 4 I
O
8.0 mA
NOTE: ESD data available upon request.
ELECTRICAL CHARACTERISTICS (V
CC
= 2.7 to 5.5 V; TA = –40 to 85°C, unless otherwise noted.)
Parameter
Symbol Min Typ Max Unit
Toggle Frequency (Sine Wave) f
t
500 3.0 2.5 GHz
Supply Current I
CC
8.7 14 mA Stand–By Current ISB 100 200 µA Stand–By Input HIGH (SB) V
IH1
2.0 VCC + 0.5 V V
Stand–By Input LOW (SB) V
IL1
GND 0.8 V
Divide Ratio Control Input HIGH (SW) V
IH2
VCC – 0.4 V
CC
VCC + 0.5 V V
Divide Ratio Control Input LOW (SW) V
IL2
OPEN OPEN OPEN
Output Voltage Swing (2pF Load) 500–1000 MHz Input
1000–1500 MHz Input 1500–2500 MHz Input
V
OUT
800 400 200
– 450 250
– – –
mVpp
Input Voltage Sensitivity V
IN
200 1000 mVpp
Figure 1. Typical Minimum Input Sensitivity versus Input Frequency
–40
–30
–20
–10
0
500 700 900 1100 1300 1500 1700 1900 2100 2300 2500
Input Frequency (MHz)
Input Power Level (dBm)
(Divide By 2 Mode, T = 25°C, VCC = 2.7 V)
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MC12095
3
MOTOROLA RF/IF DEVICE DATA
Figure 2. Typical Output Amplitude versus Frequency over Temperature
0
200
400
600
800
1000
1200
1400
1600
1800
500 750 1000 1250 1500 1750 2000 2250 2500
Input Frequency (MHz)
Output Amplitude (mVpp)
SPEC
Figure 3. Typical Output Amplitude versus Frequency over Temperature
0
200
400
600
800
1000
1200
1400
1600
1800
500 750 1000 1250 1500 1750 2000 2250 2500
Input Frequency (MHz)
Output Amplitude (mVpp)
SPEC
–40°C +25
°
C
+85
°
C
–40°C +25
°
C
+85°C
(Divide By 2 Mode, VCC = 2.7 V)
(Divide By 4 Mode, VCC = 2.7 V)
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MC12095
4
MOTOROLA RF/IF DEVICE DATA
Figure 4. Input Impedance versus Frequency
0
25
50
75
100
125
150
500 700 900 1100 1300 1500 1700 1900 2100 2300 2500
Input Frequency (MHz)
R (Ohms)
Figure 5. Input Impedance versus Frequency
–200
–150
–100
–50
0
50
100
500 700 900 1100 1300 1500 1700 1900 2100 2300 2500
Input Frequency (MHz)
jX (Ohms)
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MC12095
5
MOTOROLA RF/IF DEVICE DATA
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SO–8)
ISSUE T
SEATING PLANE
1
4
58
A0.25MCB
SS
0.25MB
M
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49 C 0.19 0.25 D 4.80 5.00 E
1.27 BSCe
3.80 4.00
H 5.80 6.20 h
0 7
L 0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
OUTLINE DIMENSIONS
PLASTIC PACKAGE
CASE 940–03
(SSOP–8)
ISSUE B
DIMAMIN MAX MIN MAX
INCHES
2.87 3.13 0.113 0.123
MILLIMETERS
B 5.20 5.38 0.205 0.212 C 1.73 1.99 0.068 0.078 D 0.05 0.21 0.002 0.008 F 0.63 0.95 0.024 0.037 G 0.65 BSC 0.026 BSC H 0.44 0.60 0.017 0.023
J 0.09 0.20 0.003 0.008 J1 0.09 0.16 0.003 0.006 K 0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
H
A
B
85
41
F
M
K8X REF
S
U
M
0.12 (0.005) V
S
T
L
L/2
PIN 1 IDENT
S
U
M
0.20 (0.008) T
–V–
–U–
D
C
0.076 (0.003)
G
–T–
SEATING PLANE
DETAIL E
DETAIL E
–W–
N
N
0.25 (0.010)
K
J
J1
K1
SECTION N–N
L 7.65 7.90 0.301 0.311 M 0 8 0 8
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MC12095
6
MOTOROLA RF/IF DEVICE DATA
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MC12095/D
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