Datasheet MC12093D, MC12093SD Datasheet (Motorola)

Page 1

SEMICONDUCTOR
TECHNICAL DATA
MECL PLL COMPONENTS
÷2, ÷4, ÷8 LOW POWER
PRESCALER
WITH STAND–BY MODE
Order this document by MC12093/D
PLASTIC PACKAGE
CASE 940 (SSOP–8)
PIN CONNECTIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
8
1
1
8
IN
(Top View)
8
IN
V
CC
SW2 OUT
SB SW1
Gnd
7 6 5
1 2 3 4
Device
Operating
Temp Range
Package
ORDERING INFORMATION
MC12093D MC12093SD
TA =
–40° to +85°C
SO–8
SSOP–8
A LOW on the Stand–By Pin 7 disables the device.
÷
 ÷ ÷ "   
  ! 
The MC12093 is a single modulus prescaler for low power frequency division of a 1.1 GHz high frequency input signal. Motorola’s advanced MOSAIC V technology is utilized to acheive low power dissipation of
6.75 mW at a minimum supply voltage of 2.7 V.
On–chip output termination provides output current to drive a 2.0 pF (typical) high impedance load. If additional drive is required for the prescaler output, an external resistor can be added parallel from the OUT pin to GND to increase the output power. Care must be taken not to exceed the maximum allowable current through the output.
Divide ratio control inputs SW1 and SW2 select the required divide ratio of ÷2, ÷4, or ÷8.
Stand–By mode is featured to reduce current drain to 50 µA typical when the standby pin SB is switched LOW disabling the prescaler.
1.1 GHz Toggle Frequency
Supply Voltage 2.7 V to 5.5 Vdc
Low Power 3.0 mA Typical
Operating Temperature –40 to 85°C
Divide by 2, 4 or 8 Selected by SW1 and SW2 Pins
On–Chip Termination
MOSAIC V is a trademark of Motorola
FUNCTIONAL TABLE
SW SW2 Divide Ratio
L L 8 H L 4 L H 4 H H 2
NOTES: 1.SW1 & SW2: H = (VCC – 0.5 V) to VCC; L = Open.
2.SB: H = 2.0 V to VCC, L = GND to 0.8 V.
Motorola, Inc. 1997 Rev 3
IN
÷2
÷4
÷8
Function Chart
Page 2
MC12093
2
MOTOROLA RF/IF DEVICE DATA
Figure 1. AC Test Circuit
SB SW1 SW2 OUT
GND
C4
IN
IN
50
C2
C1
V
CC
C3
EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1
µ
F
C4 = 2.0 pF Load
VCC = 2.7 to 5.5 V
MAXIMUM RATINGS
Parameter
Symbol Value Unit
Power Supply Voltage, Pin 2 V
CC
–0.5 to 6.0 Vdc
Operating Temperature Range T
A
–40 to 85 °C Storage Temperature Range Tstg –65 to 150 °C Maximum Output Current, Pin 4 I
O
4.0 mA
NOTE: ESD data available upon request.
ELECTRICAL CHARACTERISTICS (V
CC
= 2.7 to 5.5 V; TA = –40 to 85°C)
Parameter
Symbol Min Typ Max Unit
Toggle Frequency (Sine Wave) ft 0.1 1.4 1.1 GHz Supply Current I
CC
3.0 4.5 mA Stand–By Current ISB 120 200 µA Stand–By Input HIGH (SB) V
IH1
2.0 V
CC
V
Stand–By Input LOW (SB) V
IL1
Gnd 0.8 V
Divide Ratio Control Input HIGH (SW1 & SW2) V
IH2
VCC – 0.5 V
CC
VCC + 0.5 V
Divide Ratio Control Input LOW (SW1 & SW2) V
IL2
OPEN OPEN OPEN
Output Voltage Swing (2.0 pF Load)
Output Frequency 12.5–350 MHz (Note 1)
Output Frequency 350–400 MHz (Note 2) Output Frequency 400–450 MHz (Note 3) Output Frequency 450–550 MHz (Note 4)
V
OUT
0.6
0.5
0.4
0.3
0.80
0.70
0.55
0.45
– – – –
V
pp
Input Voltage Sensitivity 250–1 100 MHz
100–250 MHz
V
IN
100 400
– –
1000 1000
mVpp
NOTES: 1.Input frequency 1.1 GHz, ÷8, minimum output frequency of 12.5 MHz.
2.Input frequency 700–800 MHz, ÷2.
3.Input frequency 800–900 MHz, ÷2.
4.Input frequency 900–1100 MHz, ÷2.
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MC12093
3
MOTOROLA RF/IF DEVICE DATA
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SO–8)
ISSUE T
SEATING PLANE
1
4
58
A0.25MCB
SS
0.25MB
M
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49 C 0.19 0.25 D 4.80 5.00 E
1.27 BSCe
3.80 4.00
H 5.80 6.20 h
0 7
L 0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
OUTLINE DIMENSIONS
PLASTIC PACKAGE
CASE 940–03
(SSOP–8)
ISSUE B
DIMAMIN MAX MIN MAX
INCHES
2.87 3.13 0.113 0.123
MILLIMETERS
B 5.20 5.38 0.205 0.212 C 1.73 1.99 0.068 0.078 D 0.05 0.21 0.002 0.008 F 0.63 0.95 0.024 0.037 G 0.65 BSC 0.026 BSC H 0.44 0.60 0.017 0.023 J 0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K 0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
H
A
B
85
41
F
M
K8X REF
S
U
M
0.12 (0.005) V
S
T
L
L/2
PIN 1 IDENT
S
U
M
0.20 (0.008) T
–V–
–U–
D
C
0.076 (0.003)
G
–T–
SEATING PLANE
DETAIL E
DETAIL E
–W–
N
N
0.25 (0.010)
K
J
J1
K1
SECTION N–N
L 7.65 7.90 0.301 0.311
M 0 8 0 8
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MC12093
4
MOTOROLA RF/IF DEVICE DATA
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MC12093/D
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