Datasheet MC12076D, MC12076P Datasheet (Motorola)

Page 1
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SEMICONDUCTOR TECHNICAL DATA
1
REV 1
Motorola, Inc. 1996
7/93
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The MC12076 is a divide by 256 prescaler. Typical frequency synthesis applications include elctronically tuned TV/CATV and communication systems as well as instrumentation.
An internal preamplifier is included which isolates the differential inputs and provides gain for the input signal. Differential PECL outputs are provided.
1.3GHz Toggle Frequency
Operating Supply Voltage of 4.5 to 5.5V
Low–Power 36mA Typical at V
CC
= 5.0V
Operating Temperature Range of 0°C to +85°C
High Input Sensitivity
800mV Minimum Peak–to–Peak Output Swing
Differential PECL Outputs
DESIGN GUIDE
Criteria Value Unit
Internal Gate Count* 62 ea Internal Gate Propagation Delay 250 ps Internal Gate Power Dissipation 10 mW Speed Power Product 2.5 pJ
* Equivalent to a two–input NAND gate
MAXIMUM RATINGS
Symbol Characteristic Range Unit
V
CC
Power Supply Voltage 7.0 Vdc
T
A
Operating Temperature Range 0 to +85 °C
T
stg
Storage Temperature Range –65 to +175 °C
ELECTRICAL CHARACTERISTICS (V
CC
= 4.5 to 5.5V; TA = 0 to +85°C)
Symbol
Characteristic Min Typ* Max Unit
f
max
1
f
min
Toggle Frequency (Sine Wave Input)
1.3 1.6 70
GHz MHz
I
CC
Supply Current at 5.5V 36 50 mA
V
out
Output Voltage (Load =10pF)
0.8 1.2 V
PP
Vin
min
Input Voltage 70MHz Sensitivity 150–1100MHz
1.2GHz
1.3GHz
10
1.0
1.5
3.0
20
4.0 15 20
mV
rms
Vin
max
Input 70–1300MHz Overload
400 mV
rms
* Typical measured at +25°C, 5.0V
1. See Figure 1
MECL PLL COMPONENTS
÷256
PRESCALER

Pinout: 8–Lead Plastic (Top View)
8
1
V
CC
NC
72635
4
NC
GND
Output
Input
P SUFFIX
8–LEAD PLASTIC PACKAGE
CASE 626–05
D SUFFIX
8–LEAD PLASTIC SOIC PACKAGE
CASE 751–05
Page 2
MC12076
MOTOROLA HIPERCOMM
BR1334 — Rev 4
2
6
4
32
÷
256
0.001µF0.001µF
Signal
Input
V
CC
8
Output
GND
PRESCALER BLOCK DIAGRAM
7
625
625
Figure 1. MC12076 Input Signal Amplitude versus Input Frequency
15 10
5 0
–5 –10 –15
–20 –25 –30 –35 –40 –45 –50
1250 710 400 225 125 71 40
22.5
12.8
7.1 4
2.25
1.25
0.71 2000
1600 1200 800
0
2000180016002000
FREQUENCY (MHz)
AMPLITUDE (dBm)
OUTPUT
RMS
MILLIVOL TS
400
400 600 800 1000 1200 1400
INPUT
PP
200
20
SPECIFICATION
Page 3
MC12076
HIPERCOMM BR1334 — Rev 4
3 MOTOROLA
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE R
SEATING PLANE
1
4
58
A0.25MCB
SS
0.25MB
M
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49 C 0.18 0.25 D 4.80 5.00 E
1.27 BSCe
3.80 4.00
H 5.80 6.20 h
0 7
L 0.40 1.25
q
0.25 0.50
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NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
14
58
F
NOTE 2
–A–
–B–
–T–
SEATING PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005) B
M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC M ––– 10 ––– 10 N 0.76 1.01 0.030 0.040
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MC12076/D
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