Page 1
SEMICONDUCTOR TECHNICAL DATA
1
REV 1
Motorola, Inc. 1996
7/93
The MC12074 is a divide by 256 prescaler. Typical frequency
synthesis applications include elctronically tuned TV/CATV and
communication systems as well as instrumentation.
An internal preamplifier is included which isolates the differential inputs
and provides gain for the input signal. Differential PECL outputs are
provided.
• 1.1GHz Toggle Frequency
• Operating Supply Voltage of 4.5 to 5.5V
• Low–Power 23mA Typical at V
CC
= 5.0V
• High Input Sensitivity, 20mV
rms
at VCC = 5.0 ± 10%, TA = 0°C to +70°C
• 800mV Minimum Peak–to–Peak Output Swing
• Differential PECL Outputs
MAXIMUM RATINGS
Symbol Characteristic Range Unit
V
CC
Power Supply Voltage 7.0 Vdc
T
A
Operating Temperature Range 0 to +70 °C
T
stg
Storage Temperature Range –65 to +175 °C
ELECTRICAL CHARACTERISTICS (V
CC
= 4.5 to 5.5V; TA = 0 to +70°C)
Symbol Characteristic Min Typ* Max Unit
f
max
1
f
min
Toggle Frequency
(Sine Wave Input)
1.1 1.3
90
GHz
MHz
I
CC
Supply Current at 5.5V 23 30 mA
V
out
Output Voltage
(Load =10pF)
0.8 1.2 V
PP
Vin
min
Input Voltage Sensitivity
150–1 100MHz
90MHz
10 20
30
mV
rms
Vin
max
Input Overload 200 400 mV
rms
* Typical measured at +25°C, 5.0V
1. See Figure 1
MECL PLL COMPONENTS
÷256
PRESCALER
Pinout: 8–Lead Plastic (Top View)
8
1
V
CC
NC
72635
4
NC
GND
Output
Input
P SUFFIX
8–LEAD PLASTIC PACKAGE
CASE 626–05
D SUFFIX
8–LEAD PLASTIC SOIC PACKAGE
CASE 751–05
Page 2
MC12074
MOTOROLA HIPERCOMM
BR1334 — Rev 4
2
6
4
32
÷
256
0.001µF0.001µF
Signal
Input
V
CC
8
Output
GND
PRESCALER BLOCK DIAGRAM
7
550
Ω
550
Ω
Figure 1. Divide Ratio = 256
(Maximum Toggle Frequency: Min = 1357, Mean = 1357, Max = 1357
Temp = 25°C, VCC = 5.0V, Number of Devices = 1)
15
10
5
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
1250
710
400
225
125
71
40
22.5
12.8
7.1
4
2.25
1.25
0.71
2400
2000
1600
1200
800
0
1500130011009007005002000
FREQUENCY (MHz)
AMPLITUDE (dBm)
OUTPUT
RMS
MILLIVOL TS
400
100 300 400 600 800 1000 1200 1400
INPUT
PP
200
30
20
90 150
Page 3
MC12074
HIPERCOMM
BR1334 — Rev 4
3 MOTOROLA
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE R
SEATING
PLANE
1
4
58
A0.25MCB
SS
0.25MB
M
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49
C 0.18 0.25
D 4.80 5.00
E
1.27 BSCe
3.80 4.00
H 5.80 6.20
h
0 7
L 0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2
–A–
–B–
–T–
SEATING
PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005) B
M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L 7.62 BSC 0.300 BSC
M ––– 10 ––– 10
N 0.76 1.01 0.030 0.040
__
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MC12074/D
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