Datasheet MC12038BP, MC12038AD, MC12038AP, MC12038BD Datasheet (Motorola)

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Order this document by MC12038A/D

SEMICONDUCTOR

TECHNICAL DATA

MECL PLL COMPONENTS

÷127/128, ÷255/256

DUAL MODULUS PRESCALER

P SUFFIX

PLASTIC PACKAGE

CASE 626

PIN CONNECTIONS

D SUFFIX

PLASTIC PACKAGE

CASE 751

(SO–8)

(Top View)

OUT

NC MC

Gnd

7 6 5

1 2 3 4

Device

Operating

Temperature Range

Package

ORDERING INFORMATION

MC12038AD MC12038AP

TA = – 40° to +85°C

SO–8

Plastic

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The MC12038A can be used with CMOS synthesizers requiring positive edges to trigger internal counters such as Motorola’s MC145XXX series in a PLL to provide tuning signals up to 1.1 GHz in programmable frequency steps.

A Divide Ratio Control (SW) permits selection of a 127/128 or 255/256 divide ratio as desired.

The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio.

• 1.1 GHz Toggle Frequency

• Supply Voltage of 4.5 to 5.5 V

• Low–Power 4.8 mA Typical

• Operating Temperature Range of –40 to 85°C

• Short Setup Time (t

set

) 16ns Maximum @ 1.1 GHz

• Modulus Control Input Level Is Compatible With Standard

CMOS and TTL

• On–Chip Output Termination

FUNCTIONAL TABLE

SW MC Divide Ratio

H H 127 H L 128 L H 255 L L 256

NOTES: 1. SW: H = VCC, L = Open. A logic L can also be applied by grounding this pin,

but this is not recommended due to increased power consumption.

2.MC: H = 2.0 V to VCC, L = GND to 0.8 V.

DESIGN GUIDE

Criteria Value Unit

Internal Gate Count* 67 ea Internal Gate Propagation Delay 200 ps Internal Gate Power Dissipation 0.75 mW Speed Power Product 0.15 pJ

NOTE: * Equivalent to a two–input NAND gate

MAXIMUM RATINGS

Characteristic Symbol Range Unit

Power Supply Voltage, Pin 2 V

–0.5 to 7.0 Vdc

Operating Temperature Range T

–40 to 85 °C

Storage Temperature Range T

stg

–65 to 150 °C

Modulus Control Input, Pin 6 MC –0.5 to 6.5 Vdc

NOTE: ESD data available upon request.

 Motorola, Inc. 1997 Rev 2

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MC12038A

MOTOROLA RF/IF DEVICE DATA

ELECTRICAL CHARACTERISTICS

(VCC = 4.5 to 5.5V; TA = –40 to 85°C, unless otherwise noted.)

Characteristic

Symbol Min Typ Max Unit

Toggle Frequency (Sine Wave Input) f

0.1 1.4 1.1 GHz

Supply Current Output Unloaded (Pin 2) at 5.0 Vdc I

– 4.8 6.5 mA

Modulus Control Input High (MC) V

IH1

2.0 – V

Modulus Control Input Low (MC) V

IL1

– – 0.8 V

Divide Ratio Control Input High (SW) V

IH2

Vdc

Divide Ratio Control Input Low (SW) V

IL2

Open Open Open –

Output Voltage Swing (CL = 8.0 pF) V

out

1.0 1.6 – V

Modulus Setup Time MC to Out t

set

– 11 16 ns

Input Voltage Sensitivity 250–1100 MHz

100–250 MHz

in(min)

100 400

– –

1500 1500

mVpp

HGFED

Out

QBD

QBC

QBD

QBC

Modulus setup time MC to out is the MC setup or MC release plus the prop delay.

Prop. Delay

Out

MC Setup

MC Release

Figure 1. Logic Diagram (MC12038A) Figure 2. Modulus Setup Time

Figure 3. Typical Output Waveforms

(÷128, 1.1 GHz Input Frequency, VCC = 5.0 V, TA = 25°C, Output Loaded)

500 m

20 ns

≈

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MC12038A

MOTOROLA RF/IF DEVICE DATA

Figure 4. AC Test Circuit

EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1

F CL = 8.0 pF (Including Scope and jig capacitance)

MC Input

VCC = 4.5 to 5.5 Vdc

Ω

Sine Wave Generator

SWV

OUT

GND

0 250 500 750 1000 1250 1500

Figure 5. Input Signal Amplitude versus Input Frequency

+15.0 +10.0

+5.0

–5.0 –10.0 –15.0 –20.0 –25.0 –30.0 –35.0 –40.0 –45.0 –50.0

+1250

+0.71

+1.25

+2.25

+4.0

+7.1

+12.8

+22.5

+40.0

+71.0

+125

+225

+400

+710

FREQUENCY (MHz)

AMPLITUDE (dBm)

mVrms

FREQUENCY (MHz)

1000

2000

3000

4000

5000

mVpp

Figure 6. Output Amplitude versus Input Frequency

250 500 750 1000 1250 1500

Divide Ratio = 128; VCC = 5.0 V; TA = 25°C

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MC12038A

MOTOROLA RF/IF DEVICE DATA

–650

–600

–550

–500

–450

–400

–350

–300

–250

–200

–150

–100

–50

100

150

200

100 200 300 400 500 600 700 800 900 1000 1100 1200

Figure 7. Typical Input Impedance versus Input Frequency

MHz

OHMS

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MC12038A

MOTOROLA RF/IF DEVICE DATA

P SUFFIX

PLASTIC PACKAGE

CASE 626–05

ISSUE K

D SUFFIX

PLASTIC PACKAGE

CASE 751–06

(SO–8)

ISSUE T

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

NOTE 2

–A–

–B–

–T–

SEATING PLANE

0.13 (0.005) B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC M ––– 10 ––– 10 N 0.76 1.01 0.030 0.040

SEATING PLANE

A0.25MCB

0.25MB

X 45

DIM MIN MAX

MILLIMETERS

A 1.35 1.75

A1 0.10 0.25

B 0.35 0.49 C 0.19 0.25 D 4.80 5.00 E

1.27 BSCe

3.80 4.00

H 5.80 6.20 h

0 7

L 0.40 1.25

0.25 0.50

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETER.

3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION.

0.10

OUTLINE DIMENSIONS

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MC12038A/D

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