Datasheet MC12028AD, MC12028AP, MC12028BD, MC12028BP Datasheet (Motorola)

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 
Order this document by MC12028A/D
SEMICONDUCTOR
TECHNICAL DATA
MECL PLL COMPONENTS
÷64/65, ÷128/129
DUAL MODULUS PRESCALER
PLASTIC PACKAGE
CASE 626
PIN CONNECTIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
8
1
1
8
IN
(Top View)
8
IN
V
CC
SW
OUT
NC MC
Gnd
7 6 5
1 2 3 4
Device
Operating
Temp Range
Package
ORDERING INFORMATION
MC12028AD MC12028AP
TA =–40° to +85°C
SO–8
Plastic MC12028BD MC120228BP
SO–8
Plastic
    
The MC12028A can be used with CMOS synthesizers requiring positive edges to trigger internal counters such as Motorola’s MC145XXX series in a PLL to provide tuning signals up to 1.1 GHz in programmable frequency steps.
The MC12028B can be used with CMOS synthesizers requiring negative edges to trigger internal counters.
A Divide Ratio Control (SW) permits selection of a 32/33 or 64/65 divide ratio as desired.
The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio.
NOTE: The “B” Version Is Not Recommended for New Designs
1.1 GHz Toggle Frequency
MC12028A for Positive Edge Triggered Synthesizers
6.5 mA Maximum, –40 to 85°C, V
CC
= 5.5 Vdc
Modulus Control Input Level Is Compatible With
Standard CMOS and TTL
Low–Power 4.0 mA Typical
FUNCTIONAL TABLE
SW MC Divide Ratio
H H 32 H L 33 L H 64 L L 65
NOTES: 1.SW: H = VCC, L = Open. A logic L can also be applied by grouunding this pin,
but this is not recommended due to increased power soncumption.
2.MC: H = 2.0 V to VCC, L = GND to 0.8 V.
DESIGN GUIDE
Criteria Value Unit
Internal Gate Count* 67 ea Internal Gate Propagation Delay 200 ps Internal Gate Power Dissipation 0.75 mW Speed Power Product 0.15 pJ
NOTE: * Equivalent to a two–input NAND gate
MAXIMUM RATINGS
Characteristic Symbol Range Unit
Power Supply Voltage, Pin 2 V
CC
–0.5 to 7.0 Vdc
Operating Temperature Range T
A
–40 to 85 °C
Storage Temperature Range T
stg
–65 to 150 °C
Modulus Control Input, Pin 6 MC –0.5 to 6.5 Vdc
NOTE: ESD data available upon request.
Motorola, Inc. 1997 Rev 3
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MC12028A MC12028B
2
MOTOROLA RF/IF DEVICE DATA
ELECTRICAL CHARACTERISTICS
(VCC = 4.5 to 5.5V; TA = –40 to 85°C, unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
Toggle Frequency (Sine Wave Input) f
t
0.1 1.4 1.1 GHz
Supply Current Output Unloaded (Pin 2) I
CC
4.0 6.5 mA
Modulus Control Input High (MC) V
IH1
2.0 V
CC
V
Modulus Control Input Low (MC) V
IL1
0.8 V
Divide Ratio Control Input High (SW) V
IH2
V
CC
V
CC
V
CC
Vdc
Divide Ratio Control Input Low (SW) V
IL2
Open Open Open
Output Voltage Swing (CL = 12 pF; RL = 2.2 k) V
out
1.0 1.6 V
pp
Modulus Setup Time MC to Out t
set
11 16 ns
Input Voltage Sensitivity 250–1100 MHz
100–250 MHz
V
in
100 400
– –
1500 1500
mVpp
Output Current (CL = 12 pF; RL = 2.2 k) I
O
1.5 4.0 mA
A
HGFED
In
MC
In
SW
Out
Q
S
Q
C
QBD
QC
QBD
QBC
QD
C
QBD
QBC
QD
QBC
QD
B
QBC
QD
C
QB
C
QD
M
Modulus setup time MC to out is the MC setup or MC release plus the prop delay.
Prop. Delay
In
Out
MC
MC Setup
MC Release
Figure 1. Logic Diagram (MC12028A) Figure 2. Modulus Setup Time
Figure 3. Typical Output Waveform
500 m
20 ns
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MC12028A MC12028B
3
MOTOROLA RF/IF DEVICE DATA
Figure 4. AC Test Circuit
EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1
µ
F CL = 12 pF (Including Scope and jig capacitance) RL = 2.2 k
C
L
MC Input
C2
C1
C3
VCC = 4.5 to 5.5 V
50
Sine Wave Generator
SWV
CC
OUT
GND
MC
IN
IN
R
L
Figure 5. Typical Input Impedance versus Input Frequency
1000
GHz
0
–100
–200
–300
–400
–500
–600
900 800 700 600 500 400 300 200 100
OHMS
jX
R
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
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MC12028A MC12028B
4
MOTOROLA RF/IF DEVICE DATA
Figure 6. Input Signal Amplitude versus Input Frequency
15 10
5 0
–5 –10 –15
–20 –25 –30 –35 –40 –45 –50
1250 710 400 225 125 71 40
22.5
12.8
7.1 4
2.25
1.25
0.71
2000 1600 1200 800 400 0
16001400120010008006004002000
FREQUENCY (MHz)
Amplitude (dBm)
mVrmsmVpp
Divide Ratio = 32
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MC12028A MC12028B
5
MOTOROLA RF/IF DEVICE DATA
PLASTIC PACKAGE
CASE 626–05
ISSUE K
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SO–8)
ISSUE T
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
14
58
F
NOTE 2
–A–
–B–
–T–
SEATING PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005) B
M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC M ––– 10 ––– 10 N 0.76 1.01 0.030 0.040
__
SEATING PLANE
1
4
58
A0.25MCB
SS
0.25MB
M
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49 C 0.19 0.25 D 4.80 5.00 E
1.27 BSCe
3.80 4.00
H 5.80 6.20 h
0 7
L 0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
OUTLINE DIMENSIONS
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MC12028A/D
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