Datasheet MC12022LVAD, MC12022LVAP, MC12022LVBD, MC12022LVBP Datasheet (Motorola)

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SEMICONDUCTOR

TECHNICAL DATA

MECL PLL COMPONENTS

÷64/65, ÷128/129

DUAL MODULUS PRESCALER

Order this document by MC12022LVA/D

P SUFFIX

PLASTIC PACKAGE

CASE 626

D SUFFIX

PLASTIC PACKAGE

CASE 751

(SO–8)

8

1

1

8

Device

Operating

Temp Range

Package

ORDERING INFORMATION

MC12022LVAD
MC12022LVAP

TA =

–40° to +85°C

SO–8

Plastic

PIN CONNECTIONS

IN

(Top View)

8

IN

V

CC

SW

OUT

NC
MC

Gnd

7
6
5

1
2
3
4

MC12022LVBD
MC12022LVBP

SO–8

Plastic

  
  

The MC12022LVA can be used with CMOS synthesizers requiring
positive edges to trigger internal counters such as Motorola’s MC145XXX
series in a PLL to provide tuning signals up to 1.1 GHz in programmable
frequency steps.

The MC12022LVB can be used with CMOS synthesizers requiring
negative edges to trigger internal counters.

A Divide Ratio Control (SW) permits selection of a 64/65 or 128/129 divide
ratio as desired.

The Modulus Control (MC) selects the proper divide number after SW has
been biased to select the desired divide ratio.

NOTE: The “B” Version Is Not Recommended for New Designs

• 1.1 GHz Toggle Frequency

• Supply Voltage of 2.7 to 5.0 V

• Low–Power 4.0 mA Typical at V

CC

= 2.7 V

• Operating Temperature Range of –40 to 85°C

• Short Setup Time (t

set

) 16ns Maximum @ 1.1 GHz

• Modulus Control Input Level Is Compatible With Standard CMOS

and TTL

FUNCTIONAL TABLE

SW MC Divide Ratio

H H 64
H L 65
L H 128
L L 129

NOTES: 1.SW: H = VCC, L = Open. A logic L can also be applied by grouunding this pin,

but this is not recommended due to increased power soncumption.

2.MC: H = 2.0 V to VCC, L = GND to 0.8 V.

DESIGN GUIDE

Criteria Value Unit

Internal Gate Count* 67 ea
Internal Gate Propagation Delay 200 ps
Internal Gate Power Dissipation 0.75 mW
Speed Power Product 0.15 pJ

NOTE: * Equivalent to a two–input NAND gate

 Motorola, Inc. 1997 Rev 3

MC12022LVA MC12022LVB

2

MOTOROLA RF/IF DEVICE DATA

MAXIMUM RATINGS

Rating Symbol Value Unit

Power Supply Voltage, Pin 2 V

CC

–0.5 to 7.0 Vdc

Operating Temperature Range T

A

–40 to 85 °C

Storage Temperature Range T

stg

–65 to 150 °C

Modulus Control Input, Pin 6 MC –0.5 to 6.5 Vdc

NOTE; ESD data available upon request.

ELECTRICAL CHARACTERISTICS (V

CC

= 4.5 to 5.5 V; TA = –40°C to 85°C, unless otherwise noted.)

Characteristic

Symbol Min Typ Max Unit

Toggle Frequency (Sine Wave Input) f

t

0.1 1.4 1.1 GHz

Supply Current Output Unloaded (Pin 2) I

CC

– 4.7 6.5 mA

Supply Current Output Unloaded (Pin 2) at 5.0 Vdc I

CCH

5.8 8.0 mA

Modulus Control Input High (MC) V

IH1

2.0 – V

CC

V

Modulus Control Input Low (MC) V

IL1

– – 0.8 V

Divide Ratio Control Input High (SW) V

IH2

V

CC

V

CC

V

CC

Vdc

Divide Ratio Control Input Low (SW) V

IL2

Open Open Open –

Output Voltage Swing (CL = 12 pF; RL = 1.1 kΩ at 2.7 Vdc) V

out

0.8 1.0 – V

pp

Output Voltage Swing (CL = 12 pF; RL = 2.2 kΩ at 5.0 Vdc) V

out

1.0 1.6 – V

pp

Modulus Setup Time MC to Out t

set

– 11 16 ns

Input Voltage Sensitivity 250–1100 MHz

100–250 MHz

V

in(min)

100
400

–
–

1500
1500

mVpp

Output Current (CL = 12 pF; RL = 2.2 kΩ at 2.7 Vdc) I

O

– 1.2 4.0 mA

Output Current (CL = 12 pF; RL = 2.2 kΩ at 5.0 Vdc) I

O

– 1.2 4.0 mA

MC12022LVA MC12022LVB

3

MOTOROLA RF/IF DEVICE DATA

A

HGFED

In

MC

In

SW

Out

Q

S

Q

C

QBD

QC

QBD

QBC

QD

C

QBD

QBC

QD

QBC

QD

B

QBC

QD

C

QB

C

QD

M

Modulus setup time MC to out is the MC
setup or MC release plus the prop delay.

Prop. Delay

In

Out

MC

MC Setup

MC Release

Figure 1. Logic Diagram (MC12022LVA) Figure 2. Modulus Setup Time

Figure 3. Typical Output Waveforms

(÷128, 1.1GHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded)(÷64, 500MHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded)

500 m

20 ns

≈

500 m

20 ns

≈

Figure 4. AC Test Circuit

EXTERNAL COMPONENTS
C1 = C2 = 1000pF
C3 = 0.1

µ

F
CL = 12pF (Including Scope
and jig capacitance)
RL = 2.2k

Ω

(at +5.0Vdc)

RL = 1.1k

Ω

(at +2.7Vdc)

C

L

MC Input

C2

C1

C3

VCC = 2.7 to 5.0Vdc

50

Ω

Sine Wave Generator

SWV

CC

OUT

GND

MC

IN

IN

R

L

MC12022LVA MC12022LVB

4

MOTOROLA RF/IF DEVICE DATA

0

Figure 5. Input Signal Amplitude versus Input Frequency

+15.0
+10.0

+5.0

0

–5.0
–10.0
–15.0
–20.0
–25.0
–30.0
–35.0
–40.0
–45.0
–50.0

+1250

+0.71

+1.25

+2.25

+4.0

+7.1

+12.8

+22.5

+40.0

+71.0

+125

+225

+400

+710

0

FREQUENCY (MHz)

AMPLITUDE (dBm)

mVrms

FREQUENCY (MHz)

0

1000

2000

3000

4000

5000

mVpp

Figure 6. Output Amplitude versus Input Frequency

250 500 750 1000 1250 1500 1750 2000

250 500 750 1000 1250 1500 1750 2000

Divide Ratio = 128; VCC = 5.0 V; TA = 25°C

MC12022LVA MC12022LVB

5

MOTOROLA RF/IF DEVICE DATA

Figure 7. Typical Input Impedance versus Input Frequency

GHz

0

1400

1200

1000

800

600

400

200

OHMS

jX

R

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3

–100

–200

–300

–400

–500

–600

–700

–800

–900

–1000

MC12022LVA MC12022LVB

6

MOTOROLA RF/IF DEVICE DATA

P SUFFIX

PLASTIC PACKAGE

CASE 626–05

ISSUE K

D SUFFIX

PLASTIC PACKAGE

CASE 751–06

(SO–8)

ISSUE T

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

14

58

F

NOTE 2

–A–

–B–

–T–

SEATING
PLANE

H

J

G

D

K

N

C

L

M

M

A

M

0.13 (0.005) B

M

T

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L 7.62 BSC 0.300 BSC
M ––– 10 ––– 10
N 0.76 1.01 0.030 0.040

__

OUTLINE DIMENSIONS

SEATING
PLANE

1

4

58

A0.25MCB

SS

0.25MB

M

h

q

C

X 45

_

L

DIM MIN MAX

MILLIMETERS

A 1.35 1.75

A1 0.10 0.25

B 0.35 0.49
C 0.19 0.25
D 4.80 5.00
E

1.27 BSCe

3.80 4.00

H 5.80 6.20

h

0 7

L 0.40 1.25

q

0.25 0.50

__

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETER.

3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.

D

E

H

A

B

e

B

A1

C

A

0.10

MC12022LVA MC12022LVB

7

MOTOROLA RF/IF DEVICE DATA

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
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MC12022L VA/D

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