Datasheet MC12019D, MC12019P Datasheet (Motorola)

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The MC12019 is a divide by 20 and 21 dual modulus prescaler. It will
divide by 20 when the modulus control input is HIGH and divide by 21 when
the modulus control input is LOW.

• 225 MHz Toggle Frequency

• Low-Power 7.5 mA Maximum at 5.5 V

• Control Input is Compatible with Standard Motorola CMOS Synthesizers

• Emitter Follower Output

Order this document by MC12019/D



MECL PLL COMPONENTS

÷20/21 DUAL MODULUS

PRESCALER

SEMICONDUCTOR

TECHNICAL DATA

8

1

D SUFFIX

PLASTIC PACKAGE

CASE 751

(SO–8)

SIMPLIFIED BLOCK DIAGRAM

Control

Input

1

0.001 µF

Signal

Input

Signal

Gnd

0.001 µF

0.1 µF

5

÷

6

7

V

CC

N / N+1

Gnd

8

1

P SUFFIX

PLASTIC PACKAGE

CASE 626

PIN CONNECTIONS

(Top View)

8

NC

7

V

CC

6

S

Gnd

5

S

IN

Package

SO–8

Plastic

1

IN

2

NE

3

3
Output

4

10 k

Device

MC12019D
MC12019P

Out

4

Gnd

ORDERING INFORMATION

Operating

Temperature Range

TA = – 40° to +85°C

 Motorola, Inc. 1997 Rev 2

MAXIMUM RATINGS

Rating Symbol Value Unit

Power Supply Voltage, Pin 7 V
Operating Temperature Range T
Storage Temperature Range T

NOTE; ESD data available upon request.

MC12019

CC

A

stg

8.0 Vdc

–40 to +85 °C

–65 to +175 °C

ELECTRICAL CHARACTERISTICS (V

Characteristic

Toggle Frequency (Sine Wave Input) f

Supply Current I
Control Input HIGH (÷20) V
Control Input LOW (÷21) V
Output Swing Voltage (10 kΩ to ground) V
Input Voltage Sensitivity V

20 MHz to 225 MHz 200 – 800

PLL Response Time (Notes 1 and 2) t

NOTES: 1. t

(50%) to ensure proper modulus selection.

= the period of time the PLL has from the prescaler rising output tranistion (50%) to the modulus control input edge transition

PLL

2.t

= period of output waveform.

out

= 4.5 to 5.5 V; TA = –40 to 85°C), unless otherwise noted.)

CC

Symbol Min Typ Max Unit

max

f

min
CC

out

PLL

IH

IL

in

225

–
– – 7.5 mA

2.0 – – V
– – 0.8 V

600 – 1200 mVpp

– – t

–
–

–

20

–70 ns

out

MHz

mV

PP

2

MOTOROLA RF/IF DEVICE DATA

NOTE 2

A

E

B

C

A1

-T-

SEATING

PLANE

MC12019

OUTLINE DIMENSIONS

P SUFFIX

58

-B-

1

4

PLASTIC PACKAGE

CASE 626–05

ISSUE K

F

-A­L

C

J

N

D

H

G

0.13 (0.005)

K

M M M

AB

T

M

D SUFFIX

PLASTIC PACKAGE

CASE 751–06

(SO–8)

ISSUE T

D

58

0.25MB

1

H

4

e

M

h

X 45

_

q

C

A

SEATING
PLANE

0.10

L

B

SS

A0.25MCB

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

MILLIMETERS INCHES

MIN MINMAX MAX

DIM

A
B
C
D
F
G
H
J
K
L
M
N

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETER.

3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.

10.16

9.40

6.60

6.10

4.45

3.94

0.51

0.38

1.78

1.02

2.54 BSC

1.27

0.76

0.30

0.20

3.43

2.92

7.62 BSC

—

°

10

1.01

0.76

MILLIMETERS

DIM MIN MAX

A 1.35 1.75

A1 0.10 0.25

B 0.35 0.49
C 0.19 0.25
D 4.80 5.00

E

3.80 4.00

1.27 BSCe

H 5.80 6.20

h

0.25 0.50

L 0.40 1.25

0 7

q

0.370

0.240

0.155

0.015

0.040

0.100 BSC

0.030

0.008

0.115

0.300 BSC
—

0.030

__

0.400

0.260

0.175

0.020

0.070

0.050

0.012

0.135
10

0.040

°

MOTOROLA RF/IF DEVICE DATA

3

MC12019

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MOTOROLA RF/IF DEVICE DATA

MC12019/D