The MC10SX1190 is a differential receiver, differential transmitter
specifically designed to drive coaxial cables. It incorporates the output
cable drive capability of the MC10EP89 Coaxial Cable Driver with
additional circuitry to multiplex the output cable drive source between
the cable receiver or the local transmitter inputs. The multiplexer
control circuitry is TTL compatible for ease of operation.
The MC10SX1190 is useful as a bypass element for Fibre
Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture
(SSA) applications, to create loop style interconnects with fault
tolerant, active switches at each device node. This device is
particularly useful for back panel applications where small size is
desirable.
The EP89 style drive circuitry produces swings approximately 70%
larger than a standard PECL output. When driving a coaxial cable,
proper termination is required at both ends of the line to minimize
reflections. The 1.4V output swings allow for proper termination at
both ends of the cable, while maintaining the required swing at the
receiving end of the cable. Because of the larger output swings, the
QT, QT
VCC– 3.0V instead of 50Ω to VCC– 2.0V.
• 2.5 Gbps Operation
• 425ps Propagation Delay
• 1.4V Output Swing on the Cable Driving Output
• PECL Mode: 3.0V to 5.5V V
• ECL Mode: 0V V
• 75kΩ Internal Input Pull Down Resistors
• >1000 Volt ESD Protection
outputs are terminated into the thevenin equivalent of 50Ω to
, with VEE = 0V
CC
, with VEE = –3.0V to –5.5V
CC
V
V
V
CC
QRQR
CC
19201817161514
EE
DTDTV
13
CC
VBBV
12911
EE
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20
1
TSSOP–20
DT SUFFIX
CASE 948E
MARKING DIAGRAM
10SX
1190
ALYW
*For additional information, see Application Note
AND8002/D
PIN DESCRIPTION
PIN
DR/DR
QR/QR ECL Buffered Differential Outputs from
DT/DT
QT/QT ECL Buffered Differential Output to
SEL
V
V
V
ECL Diff. Inputs from Receive Cable
Receive Cable
ECL Differential Input to Transmit Cable
Transmit Cable
TTL Multiplexer Control Signal
Reference Voltage Output
BB
ECL Positive Supply
CC
ECL Negative, 0 Supply
EE
A = Assembly Location
L = Wafer Lot
Y = Y ear
W = Work Week
FUNCTION
2134567
V
DRDR
EE
Figure 1. 20-Lead TSSOP Pinout: (Top View)
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Semiconductor Components Industries, LLC, 1999
December, 1999 – Rev. 1
VCCV
CC
QTQTV
8
EE
SEL V
10
CC
1Publication Order Number:
TRUTH TABLE
SELFunction
L
H
ORDERING INFORMATION
DevicePackageShipping
MC10SX1 190DTTSSOP–2075 Units/Rail
DR QT
DT QT
MC10SX1190/D
Page 2
MC10SX1190
LOGIC DIAGRAM
LOCAL
RECEIVE DATA
(ECL LEVELS)
LOCAL
TRANSMIT DATA
(ECL LEVELS)
QR
QR
V
BB
DT
DT
SEL (TTL)
DR
DR
1
0
QT
QT
ABSOLUTE MAXIMUM RATINGS*
SymbolParameterValueUnit
V
CC
V
EE
V
IN
V
IN
I
OUT
θJAThermal Resistance (Junction–to–Ambient)Still Air
θJCThermal Resistance (Junction–to–Case)30 to 35°C/W
T
A
T
STG
* Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to
the Recommended Operating Conditions.
Power Supply Voltage (VEE = 0V)0 to +6.0Vdc
Power Supply Voltage (VCC = 0V)–6.0 to 0Vdc
Input Voltage (VEE = 0V, VIN not more positive than VCC)0 to +6.0Vdc
Input Voltage (VCC = 0V, VIN not more negative than VEE)–6.0 to 0Vdc
Output CurrentContinuous
Surge
500 LFPM
Operating Temperature Range–40 to +85°C
Storage Temperature Range–50 to +150°C
1. 10SX circuits are designed to meet the DC specifications shown in the table after thermal equilibrium has been established. The circuit is mounted in a test socket
or mounted on a printed circuit board and transverse air greater than 500lfm is maintained.
2. Values will track 1:1 with the VCC supply.
3. Outputs loaded with 50Ω to +3.0V
4. Outputs loaded with 50Ω to +2.0V
5. Outputs open circuited.
6. TTL signal threshold is 1.5V above VEE.
AC CHARACTERISTICS (Note 1 & 7)
t
PLH
t
PLH
tr,
t
f
tr,
t
f
t
skew
V
V
f
max
1. 10SX circuits are designed to meet the AC specifications shown in the table after thermal equilibrium has been established. The circuit is mounted in a test socket
or mounted on a printed circuit board and transverse air greater than 500lfm is maintained.
2. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output
signals.
3. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
4. Duty cycle skew is the difference between t
5. Minimum input swing for which AC parameters are guaranteed.
6. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range
and the peak-to-peak voltage lies between VPP
7. Data taken at V
Output Voltage High (QR,QR)
OH
OL
OH
OL
IH
IL
IH
IL
BB
VCC = 5.0V, VEE = 0V (Notes 2,3)
Output Voltage Low (QR,QR)
VCC = 5.0V, VEE = 0V (Notes 2,3)
Output Voltage High (QT,QT)
VCC = 5.0V, VEE = 0V (Notes 2,4)
Output Voltage Low (QT,QT)
VCC = 5.0V, VEE = 0V (Notes 2,4)
Quiescent Supply Current (Note 5)55mA
Input Voltage High (DR,DR & DT,DT)
VCC = 5.0V, VEE = 0V (Note 2)
Input Voltage Low (DR,DR & DT,DT)
VCC = 5.0V, VEE = 0V (Note 2)
Input Voltage High SEL (Note 6)2.02.02.02.0V
Input Voltage Low SEL (Note 6)0.80.80.80.8V
Output Reference Voltage
Propagation Delay SEL QT,QT450600850500650800ps1.5V to 50% Pt
PHL
Rise TimeQR,QR
Fall Time
Rise TimeQT,QT
Fall Time
240
240
425
425
425
425
118
118
230
230
psNote 2
ps20% to 80%
ps20% to 80%
Note 3
80% to 20%
80% to 20%
Within Device Skew1515psNote 4
PP
CMR
Minimum Input Swing200200mVNote 5
Common Mode Range3.04.353.04.35VNote 6
Maximum Operation Frequency2.52.5Gb/s
CC, nom
= 3.3V.
PLH
and t
propagation delay through a device.
PHL
and 1.0V.
Min
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3
Page 4
MC10SX1190
V
EE
R
pd
QT
QT
R
pd
V
SX1190
QR
QR
Typical value for Rpd is 160W to 260W, depending on the application. The minimum value of Rpd should not be less than 50W.
EE
V
EE
R
pd
R
pd
V
EE
Z
O
R
Z
O
Z
O
Z
O
t
R
t
Rt = Z
O
SX1190
V
TT1
R
t
R
t
V
TT1
V
TT2
R
t
R
t
V
TT2
Rt = ZO/2
QT
QT
QR
QR
Z
O
Z
O
Z
O
Z
O
Figure 2. SX1190 Termination Configuration
V
TT1
V
TT2
= VCC – 3V
= VCC – 2V
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Page 5
MC10SX1190
P ACKAGE DIMENSIONS
DT SUFFIX
PLASTIC PACKAGE
CASE 948E–02
ISSUE A
20X REFK
S
U0.15 (0.006) T
0.10 (0.004)V
M
S
U
T
S
K
2X
L/2
L
PIN 1
IDENT
110
1120
B
JJ1
–U–
N
S
U0.15 (0.006) T
A
K1
SECTION N–N
0.25 (0.010)
M
–V–
N
F
DETAIL E
C
G
H
DETAIL E
0.100 (0.004)
–T–
SEATING
PLANE
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability ,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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MC10SX1190/D
8
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