Datasheet MC10H644FNR2, MC100H644FNR2 Datasheet (MOTOROLA)

Page 1
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
2–1
11/93
REV 3
68030/040 PECL-TTL Clock Driver
Generates Clocks for 68030/040
Meets 68030/040 Skew Requirements
TTL or PECL Input Clock
Extra TTL and ECL Power/Ground Pins
Within Device Skew on Similar Paths is 0.5 ns
Asynchronous Reset
Single +5.0V Supply
The user has a choice of using either TTL or PECL (ECL referenced to +5.0V) for the input clock. TTL clocks are typically used in present MPU systems. However, as clock speeds increase to 50MHz and beyond, the inherent superiority of ECL (particularly differential ECL) as a means of clock signal distribution becomes increasingly evident. The H644 also uses differential ECL internally to achieve its superior skew characteristic.
The H644 includes divide–by–two and divide–by–four stages, both to achieve the necessary duty cycle and skew to generate MPU clocks as required. A typical 50MHz processor application would use an input clock running at 100MHz, thus obtaining output clocks at 50MHz and 25MHz (see Logic Symbol).
The 10H version is compatible with MECL 10H ECL logic levels, while the 100H version is compatible with 100K levels (referenced to +5.0V).
Function
Reset (R):
LOW on RESET forces all Q outputs LOW and all Q outputs HIGH.
Synchronized Outputs:
The device is designed to have the POS edges of the ÷2 and ÷4 outputs synchronized.
Select (SEL):
LOW selects the ECL input source (DE/DE). HIGH selects the TTL input source (DT).
The H644 also contains circuitry to force a stable state of the ECL input differential pair , should both sides be left open. In this
case, the DE side of the input is pulled LOW, and DE
goes HIGH.
GT Q3
GT
Q2 GT
Q4 VT Q5 GT R
VE DE
V
BB DE GE
Q1 VT Q0 SEL DT
19
181317 16 15 14
12
11
10
9
45678
20
1
2 3
Pinout: 20–Lead PLCC (Top View)
MECL 10H is a trademark of Motorola, Inc.
MC10H644
MC100H644
68030/040
PECL–TTL CLOCK
DRIVER
FN SUFFIX
PLASTIC PACKAGE
CASE 775–02
Page 2
÷4
VBB
TTL OUTPUTS
Q5
Q4
Q3
Q2
Q1
Q0
÷2
2:1 MUX
DE (ECL)
DE (ECL)
DT (TTL)
SEL (TTL)
R (TTL)
LOGIC DIAGRAM
MC10H644 MC100H644
MOTOROLA MECL Data
DL122 — Rev 6
2–2
PIN NAMES
PIN FUNCTION
GT VT VE GE DE, DE V
BB
DT Qn, Qn SEL R
TTL Ground (0V) TTL VCC (+5.0V) ECL VCC (+5.0V) ECL Ground (0V) ECL Signal Input (positive ECL) VBB Reference Output TTL Signal Input Signal Outputs (TTL) Input Select (TTL) Reset (TTL)
AC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
t
PLH
Propagation Delay ECL D to Output
All Outputs 5.8 6.8 5.7 6.7 6.1 7.1 ns CL = 50pF
t
PLH
Propagation Delay TTL D to Output
5.7 6.7 5.7 6.7 6.0 7.0 ns CL = 50pF
t
skwd
* Within–Device Skew Q0, 1, 4, 5 0.5 0.5 0.5 ns CL = 50pF
t
skwd
* Within–Device Skew Q2, Q3 0.5 0.5 0.5 ns CL = 50pF
t
skwd
* Within–Device Skew All Outputs 1.5 1.5 1.5 ns CL = 50pF
t
skp–p
* Part–to–Part Skew Q0, 1, 4, 5 1.0 1.0 1.0 ns CL = 50pF
t
PD
Propagation Delay R to Output
All Outputs 4.3 7.3 4.3 7.3 4.5 7.5 ns CL = 50pF
t
R
t
F
Output Rise/Fall Time
0.8V – 2.0V
All Outputs 1.6 1.6 1.6 ns CL = 50pF
f
max
Maximum Input Frequency 135 135 135 MHz CL = 50pF TW Minimum Pulse Width Reset 1.5 1.5 1.5 ns t
rr
Reset Recovery Time 1.25 1.25 1.25 ns T
PW
Pulse Width Out High or
Low @ fin = 100 MHz
and CL = 50 pf
Q0, 1 9.5 10.5 9.5 10.5 9.5 10.5 ns CL = 50pf
Relative 1.5V
TS Setup Time
SEL to DE, DT
2.0 2.0 2.0
ns
TH Hold T ime
SEL to DE, DT
2.0 2.0 2.0
ns
* Skews are specified for Identical Edges
Page 3
MC10H644 MC100H644
2–3 MOTOROLAMECL Data
DL122 — Rev 6
DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
I
EE
Power Supply Current ECL 65 65 65 mA VE Pin
I
CC
TTL 85 85 85 mA Total all VT pins
TTL DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
V
IH
V
IL
Input HIGH Voltage Input LOW Voltage
2.0
0.8
2.0
0.8
2.0
0.8
V
I
IH
Input HIGH Current 20
100
20
100
20
100
µA VIN = 2.7 V
VIN = 7.0 V
I
IL
Input LOW Current –0.6 –0.6 –0.6 mA VIN = 0.5 V
V
OH
Output HIGH Voltage 2.5
2.0
2.5
2.0
2.5
2.0
V IOH = –3.0 mA
IOH = –24 mA
V
OL
Output LOW Voltage 0.5 0.5 0.5 V IOL = 24 mA
V
IK
Input Clamp Voltage –1.2 –1.2 –1.2 V IIN = –18 mA
I
OS
Output Short Circuit Current –100 –225 –100 –225 –100 –225 mA V
OUT
= 0 V
10H PECL DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
I
IH
I
IL
Input HIGH Current Input LOW Current
0.5
225
0.5
175
0.5
175 µA
VIH* VIL*
Input HIGH Voltage Input LOW Voltage
3.83
3.05
4.16
3.52
3.87
3.05
4.19
3.52
3.94
3.05
4.28
3.55
V VE = 5.0 V
VBB* Output Reference Voltage 3.62 3.73 3.65 3.75 3.69 3.81 V VE = 5.0 V
100H PECL DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
I
IH
I
IL
Input HIGH Current Input LOW Current
0.5
225
0.5
175
0.5
175 µA
VIH* VIL*
Input HIGH Voltage Input LOW Voltage
3.835
3.19
4.12
3.525
3.835
3.19
4.12
3.525
3.835
3.19
4.12
3.525
V VE = 5.0 V
VBB* Output Reference Voltage 3.62 3.74 3.62 3.74 3.62 3.74 V VE = 5.0 V
* NOTE: PECL levels are referenced to VCC and will vary 1:1 with the power supply. The values shown are for VCC = 5.0 V.
Only corresponds to ECL Clock Inputs.
Page 4
MC10H644 MC100H644
MOTOROLA MECL Data
DL122 — Rev 6
2–4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
–N–
–M–
–L–
V
W
D
D
Y BRK
28 1
VIEW S
S
L–M
S
0.010 (0.250) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
0.004 (0.100)
G1
G
J
C
Z
R
E
A
SEATING PLANE
S
L–M
M
0.007 (0.180) N
S
T
–T–
B
S
L–M
S
0.010 (0.250) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
U
S
L–M
M
0.007 (0.180) N
S
T
Z
G1X
VIEW D–D
S
L–M
M
0.007 (0.180) N
S
T
K1
VIEW S
H
K
F
S
L–M
M
0.007 (0.180) N
S
T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.485 0.495 12.32 12.57 B 0.485 0.495 12.32 12.57 C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.450 0.456 11.43 11.58 U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
G1 0.410 0.430 10.42 10.92 K1 0.040 ––– 1.02 –––
____
Page 5
MC10H644 MC100H644
2–5 MOTOROLAMECL Data
DL122 — Rev 6
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MC10H644/D
*MC10H644/D*
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