Datasheet MC10H640FNR2, MC100H640FNR2 Datasheet (MOTOROLA)

Page 1
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
68030/040 PECL-TTL Clock Driver
The user has a choice of using either TTL or PECL (ECL referenced to +5.0V) for the input clock. TTL clocks are typically used in present MPU systems. However, as clock speeds increase to 50MHz and beyond, the inherent superiority of ECL (particularly differential ECL) as a means of clock signal distribution becomes increasingly evident. The H640 also uses differential PECL internally to achieve its superior skew characteristic.
The H640 includes divide–by–two and divide–by–four stages, both to achieve the necessary duty cycle skew and to generate MPU clocks as required. A typical 50MHz processor application would use an input clock running at 100MHz, thus obtaining output clocks at 50MHz and 25MHz (see Logic Symbol).
The 10H version is compatible with MECL 10H ECL logic levels, while the 100H version is compatible with 100K levels (referenced to +5.0V).
Generates Clocks for 68030/040
Meets 030/040 Skew Requirements
TTL or PECL Input Clock
Extra TTL and PECL Power/Ground Pins
Asynchronous Reset
Single +5.0V Supply
MC10H640
MC100H640
68030/040
PECL–TTL CLOCK
DRIVER
FN SUFFIX
PLASTIC PACKAGE
CASE 776–02
Function
Reset (R):
Power–Up:
Select (SEL):
The H640 also contains circuitry to force a stable state of the ECL input differential pair, should both sides be left open. In this case, the DE side of the input is pulled LOW, and DE
LOW on RESET forces all Q outputs LOW and all Q outputs HIGH.
The device is designed to have the POS edges of the ÷2 and ÷4 outputs synchronized at power up.
LOW selects the ECL input source (DE/DE). HIGH selects the TTL input source (DT).
goes HIGH.
VT VT Q1 GT GT Q0 VT
25 24 23 22 21 20 19
18
Q2
GT
GT
VT
VT
Q3
26
27
28
1
2
3
4
Pinout: 28–Lead PLCC
(Top View)
567891011
Q1
GT GT Q4 Q5 VT SEL
V
BB
17
DE
16
DE
VE
15
R
14
GE
13
12
DTQ0
11/93
Motorola, Inc. 1996
2–1
REV 3
Page 2
MC10H640 MC100H640
LOGIC DIAGRAM
TTL Outputs
Q0
PIN NAMES
TTL/ECL Clock Inputs
V
BB
DE DE
DT
SEL
MUX
÷ 2
÷ 4
GT VT VE GE DE, DE V
BB
DT Qn, Qn SEL R
PIN FUNCTION
TTL Ground (0 V) TTL VCC (+5.0 V) ECL VCC (+5.0 V) ECL Ground (0 V) ECL Signal Input (positive ECL) VBB Reference Output TTL Signal Input Signal Outputs (TTL) Input Select (TTL) Reset (TTL)
TTL Control Inputs
R
AC CHARACTERISTICS (VT = VE = 5.0V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
t
PLH
t
PLH
tskwd* Within–Device Skew 0.5 0.5 0.5 ns CL = 25pF t
PLH
t
PLH
t
PLH
t
PLH
t
PD
t
R
t
F
f
max
t
pw
t
rr
* Within–Device Skew defined as identical transitions on similar paths through a device.
Propagation Delay ECL D to Output
Propagation Delay TTL D to Output
Propagation Delay ECL D to Output
Propagation Delay TTL D to Output
Propagation Delay ECL D to Output
Propagation Delay TTL D to Output
Propagation Delay R to Output
Output Rise/Fall Time
0.8 V – 2.0 V Maximum Input Frequency 135 135 135 MHz CL = 25pF Minimum Pulse Width 1.50 1.50 1.50 ns Reset Recovery Time 1.25 1.25 1.25 ns
Q0–Q3 4.9 5.9 4.9 5.9 5.2 6.2 ns CL = 25pF
5.0 6.0 5.0 6.0 5.3 6.3 ns CL = 25pF
Q0, Q1 4.9 5.9 4.9 5.9 5.2 6.2 ns CL = 25pF
5.0 6.0 5.0 6.0 5.3 6.3 ns CL = 25pF
Q4, Q5 4.9 5.9 4.9 5.9 5.2 6.2 ns CL = 25pF
5.0 6.0 5.0 6.0 5.3 6.3 ns CL = 25pF
All Outputs
All Outputs
4.3 6.3 4.3 6.3 5.0 7.0 ns CL = 25pF
2.5
2.5
2.5
2.5
2.5
2.5
ns CL = 25pF
Q1
Q2
Q3
Q0
Q1
Q4
Q5
MOTOROLA MECL Data
2–2
DL122 — Rev 6
Page 3
MC10H640 MC100H640
VCC and CLOAD RANGES TO MEET DUTY CYCLE REQUIREMENTS (0°C TA 85°C Output Duty Cycle Measured
Relative to 1.5V)
Symbol Characteristic Min Nom Max Unit Condition
Range of VCC and CL to meet minimum pulse width (HIGH or LOW) = 11.5 ns at f
Range of VCC and CL to meet minimum pulse width (HIGH or LOW) = 9.5 ns at 40 < f
40 MHz
out
out
50 MHz
DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
I
EE
I
CCH
I
CCL
Power Supply Current ECL 57 57 57 mA VE Pin
TTL 30 30 30 mA Total all VT pins
V
CC
CL
V
CC
CL
30 30 30 mA
4.75 10
4.875155.0 5.125
5.0 5.25 50
27
V
pF
V
pF
Q0–Q3
–Q1
Q0 Q0–Q3
TTL DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
V V
I
I V
V V I
IH IL
IH
IL
OH
OL IK
OS
Input HIGH Voltage Input LOW Voltage
Input HIGH Current 20
Input LOW Current –0.6 –0.6 –0.6 mA VIN = 0.5V Output HIGH Voltage 2.5
Output LOW Voltage 0.5 0.5 0.5 V IOL = 24mA Input Clamp Voltage –1.2 –1.2 –1.2 V IIN = –18mA Output Short Circuit Current –100 –225 –100 –225 –100 –225 mA V
2.0
2.0
0.8
100
2.0
2.5
2.0
0.8 20
100
2.0
2.5
2.0
0.8 20
100
V
µA VIN = 2.7V
VIN = 7.0V
V IOH = –3.0mA
IOH = –15mA
= 0V
OUT
DL122 — Rev 6
2–3 MOTOROLAMECL Data
Page 4
MC10H640 MC100H640
10H PECL DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
0°C 25°C 85°C
Symbol Characteristic Min Max Min Max Min Max Unit Condition
I
IH
I
IL
VIH* VIL*
VBB* Output Reference Voltage 3.62 3.73 3.65 3.75 3.69 3.81 V
*NOTE: PECL levels are referenced to VCC and will vary 1:1 with the power supply. The values shown are for VCC = 5.0V.
100H PECL DC CHARACTERISTICS (VT = VE = 5.0 V ±5%)
Symbol Characteristic Min Max Min Max Min Max Unit Condition
I
IH
I
IL
VIH* VIL*
VBB* Output Reference Voltage 3.62 3.74 3.62 3.74 3.62 3.74 V
*NOTE: PECL levels are referenced to VCC and will vary 1:1 with the power supply. The values shown are for VCC = 5.0V.
Input HIGH Current Input LOW Current
Input HIGH Voltage Input LOW Voltage
Input HIGH Current Input LOW Current
Input HIGH Voltage Input LOW Voltage
0.5
3.83
3.05
0.5
3.835
3.19
225
4.16
3.52
0°C 25°C 85°C
225
4.12
3.525
0.5
3.87
3.05
0.5
3.835
3.19
175
4.19
3.52
175
4.12
3.525
0.5
3.94
3.05
0.5
3.835
3.19
175 µA
4.28
3.555
175 µA
4.12
3.525
V VE = 5.0V
V VE = 5.0V
10/100H640
DUTY CYCLE CONTROL
T o maintain a duty cycle of ±5% at 50MHz, limit the load capacitance and/or power supply variation as shown in Figures 1 and 2. For a ±2.5% duty cycle limit, see Figures 3 and 4. Figures 5 and 6 show duty cycle variation with temperature. Figure 7 shows typical TPD versus load. Figure 8 shows reset recovery time. Figure 9 shows output states after power up.
Best duty cycle control is obtained with a single µP load and minimum line length.
MOTOROLA MECL Data
2–4
DL122 — Rev 6
Page 5
MC10H640 MC100H640
11
11
OS
T
VE
LSE
DT
OS
T
VE
LSE
DT
5.25 V
CC
5 V
CC
4.75 V
CC
10
PW (ns)
9
10
9
NEGATIVE PULSE WIDTH (ns)
4.75 V 5 V
CC
5.25 V
CC
CC
0 25507585
LOAD (pF)
Figure 1. Positive Pulse Width at
25°C Ambient and 50 MHz Out
11
5.125 V
CC
5 V
CC
4.875 V
H (ns)
10
WI
PU I
I P
9
025507585
LOAD (pF)
CC
Figure 3. Positive Pulse Width at
25°C Ambient at 50 MHz Out
025507585
LOAD (pF)
Figure 2. Negative Pulse Width @ 50 MHz
Out and 25°C Ambient
11
10
4.875 V
CC
5 V
CC
5.125 V
9
NEGATIVE PULSE WIDTH (ns)
025507585
LOAD (pF)
CC
Figure 4. Negative Pulse Width @ 50 MHz
Out and 25°C Ambient
11
50 pF
H (ns)
10
WI
PU I
I P
9
0° 25° 50° 75° 85°
TEMPERATURE (°C)
25 pF
10 pF
Figure 5. T emperature versus Positive Pulse W idth
for 100H640 at 50 MHz and +5.0 V V
DL122 — Rev 6
CC
11
10 pF
10
9
NEGATIVE PULSE WIDTH (ns)
0°
25°
TEMPERATURE (°C)
25 pF
50° 75° 85°
Figure 6. T emperature versus Negative Pulse W idth
for MC100H640 @ 50 MHz and +5.0 V V
2–5 MOTOROLAMECL Data
CC
Page 6
MC10H640 MC100H640
6.2
TP (ns)
D++
6.0
5.8
5.6
5.4
4.75 V 5 V
5.25 V
DT
RESET, R
Q0, Q1, Q2, Q3
Q0
, Q1
Q4, Q5
5.2
0
25
50 75 85
C
(pF)
LOAD
Figure 7. TP versus Load T ypical at TA = 25°C
R
R
tpw
trec
Figure 8. MC10H/100H640 Clock Phase and Reset Recovery Time After Reset Pulse
D
in
Q0 Q
3
Q
Q
1
2
Q4 & Q
5
AFTER POWER UP OUTPUTS Q4 & Q5 WILL SYN WITH POSITIVE EDGES OF Din & Q0 Q3 & NEGATIVE EDGES OF Q
0
& Q
1
Figure 9. Output Timing Diagram
MOTOROLA MECL Data
2–6
DL122 — Rev 6
Page 7
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
MC10H640 MC100H640
–L–
–N–
28 1
Z
C
G
G1
S
0.010 (0.250) N
L–M
T
S
L–M
T
M
S
S
L–M
T
S
Y BRK
0.007 (0.180) N
B
0.007 (0.180) N
U
M
D
Z
–M–
W
D
V
0.010 (0.250) N
G1X
S
S
L–M
T
S
VIEW D–D
A
0.007 (0.180) N
0.007 (0.180) N
R
E
M
M
S
L–M
T
L–M
T
S
S
S
H
0.007 (0.180) N
M
S
L–M
T
S
K1
0.004 (0.100)
SEATING
J
–T–
PLANE
VIEW S
S
S
K
VIEW S
0.007 (0.180) N
F
M
S
L–M
T
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
A 0.485 0.495 12.32 12.57 B 0.485 0.495 12.32 12.57 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.450 0.456 11.43 11.58 U 0.450 0.456 11.43 11.58 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.410 0.430 10.42 10.92 K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES
DL122 — Rev 6
2–7 MOTOROLAMECL Data
Page 8
MC10H640 MC100H640
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MOTOROLA MECL Data
2–8
*MC10H640/D*
MC10H640/D
DL122 — Rev 6
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