Datasheet MC10H424FN, MC10H424FNR2, MC10H424L, MC10H424P Datasheet (Motorola)

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SEMICONDUCTOR TECHNICAL DATA

  
  

The MC10H424 is a Quad TTL–to–ECL translator with an ECL strobe.

Power supply requirements are ground, +5.0 volts, and –5.2 volts.

• Propagation Delay, 1.5 ns Typical

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K — Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 5.0 V) V
Power Supply (VEE = – 5.2 V) V
Input Voltage (ECL) V
Input Voltage (TTL) V
Output Current — Continuous

— Surge
Operating T emperature Range T
Storage T emperature Range — Plastic

— Ceramic

EE
CC

I
I

I

out

A

T

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ± 5%, VCC = 5.0 V ± 5.0%)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Negative Power Supply

Drain Current

Positive Power Supply

Drain Current

Reverse Current Pin
5,7,10,1 1

Forward Current Pin
5,7,10,1 1

Input HIGH Current Pin 6 I
Input LOW Current Pin 6 I
Input Breakdown Voltage V
Input Clamp Voltage V
High Output Voltage V
Low Output Voltage V
High Input Voltage Pin

5,7,10,1 1
Low Input Voltage Pin

5,7,10,1 1
High Input Voltage Pin 6 V
Low Input Voltage Pin 6 V

I

E

I

CCH

I

CCL

I

R

I

F

inH
inL

(BR)in

I

OH

OL

V

IH

V

IL

IH

IL

— 72 — 66 — 72 mAdc

— 16 — 16 — 18 mAdc
— 25 — 25 — 25 mAdc
— 50 — 50 — 50 µAdc

— –3.2 — –3.2 — –3.2 mAdc

— 450 — 310 — 310 µAdc

0.5 — 0.5 — 0.3 — µAdc

5.5 — 5.5 — 5.5 — Vdc
— –1.5 — –1.5 — –1.5 Vdc

–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc

2.0 — 2.0 — +2.0 — Vdc

— 0.8 — 0.8 — 0.8 Vdc

–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

–8.0 to 0 Vdc
0 to +7.0 Vdc
0 to V

EE

0 to V

CC

50

100

0 to +75 °C

–55 to +150
–55 to +165

Vdc
Vdc

mA

°C



CERAMIC PACKAGE

PLASTIC PACKAGE

LOGIC DIAGRAM

5
6

7

10

11

GND = PIN 16

DIP

1
2
3
4
5
6
7
8

B

OUT

A

OUT

B

OUT

A

OUT

A

IN

COMMON

STROBE

B

IN

V

EE

VCC (+5.0 VDC) = PIN 9
VEE (–5.2 VDC) = PIN 8

PIN ASSIGNMENT

L SUFFIX

CASE 620–10

P SUFFIX

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

16
15
14
13
12
11
10

GND
C
D
D
C
D
C
V

9

4
2

3
1

12
15

13
14

OUT
OUT
OUT
OUT
IN
IN
CC

3/93

 Motorola, Inc. 1996

2–117

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

REV 5

MC10H424

AC PARAMETERS

Propaga­tion Delay

Data

Strobe
Rise Time tr0.5 2.0 0.5 2.0 0.5 2.2 ns
Fall Time tf0.5 2.0 0.5 2.0 0.5 2.2 ns

t

pd

0.5

2.2

0.5

2.3

0.5

2.2

0.5

2.3

0.5

0.5

ns

2.4

2.4

APPLICATIONS INFORMATION

The MC10H424 has TTL–compatible inputs, an ECL strobe
and MECL complementary open–emitter outputs that allow
use as an inverting/non–inverting translator or as a differential
line driver. When the common strobe input is at the low–logic
level, it forces all true outputs to a MECL low–logic state and

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications
shown in the test table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 Ifpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.1 volts.

all inverting outputs to a MECL high–logic state.

An advantage of this device is that TTL–level information
can be transmitted differentially, via balanced twisted pair
lines, to MECL equipment, where the signal can be received
by the MC10H1 15 or MC10H116 differential line receivers.

MOTOROLA MECL Data

2–118

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H424

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–119 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

MC10H424

–T–

SEATING
PLANE

F

18

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

–A–

16 9

–B–

18

C

N

E

G

16 PLD

0.25 (0.010) T

M

S

A

–A–

916

B

F

C

S

–T–

H

G

D

16 PL

0.25 (0.010) T

K

M

A

CASE 620–10

ISSUE V

L

K

16 PLJ

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

SEATING
PLANE

J

M

M

0.25 (0.010) T

M

L

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

DIM MIN MAX MIN MAX

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31

S

B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

L 0.300 BSC 7.62 BSC
M 0 15 0 15

____

N 0.020 0.040 0.51 1.01

Y14.5M, 1982.

FORMED PARALLEL.

DIM MIN MAX MIN MAX

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

MILLIMETERSINCHES

MILLIMETERSINCHES

____

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MOTOROLA MECL Data

2–120

*MC10H424/D*

◊

MC10H424/D

DL122 — Rev 6