Datasheet MC10H350FNR2, MC10H350L, MC10H350M, MC10H350MEL, MC10H350ML1 Datasheet (MOTOROLA)

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Page 1

SEMICONDUCTOR TECHNICAL DATA
2–57
REV 6
Motorola, Inc. 1996
9/96
   
  " !# #
The MC10H350 is designed to be used primarily in systems incorporating both ECL and TTL logic operating off a common power supply. The separate VCC power pins are not connected internally and thus isolate the noisy TTL V
CC
runs from the relatively quiet ECL VCC runs on the printed circuit board. The differential inputs allow the H350 to be used as an inverting or noninverting translator, or a dif ferential line receiver . The H350 can also drive CMOS with the addition of a pullup resistor.
Propagation Delay, 3.5 ns Typical MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VEE = Gnd) V
CC
7.0 Vdc
Operating T emperature Range T
A
0 to +75 °C
Storage T emperature Range — Plastic
— Ceramic
T
stg
–55 to +150 –55 to +165
°C °C
ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±5%) (See Note 1)
TA = 0°C to 75°C
Characteristic Symbol Min Max Unit
Power Supply Current TTL
ECL
I
CC
— —
20 12
mA
Input Current High Pin 9
Others
I
IH
I
INH
— —
20 50
µA
Input Current Low Pin 9
Others
I
IL
I
INL
— —
–0.6
50
mA
µA
Input Voltage High Pin 9 V
IH
2.0 Vdc
Input Voltage Low Pin 9 V
IL
0.8 Vdc
Differential Input Voltage (1)
Pins 3–6, 11–14 (1)
V
DIFF
350 mV
Voltage Common Mode
Pins 3–6, 11–14
V
CM
2.8 V
CC
Vdc
Output Voltage High
IOH = 3.0 mA
V
OH
2.7 Vdc
Output Voltage Low
IOL = 20 mA
V
OL
0.5 Vdc
Short Circuit Current
V
OUT
= 0 V
I
OS
–60 –150 mA
Output Disable Current High
V
OUT
= 2.7 V
I
OZH
50 µA
Output Disable Current Low
V
OUT
= 0.5 V
I
OZL
–50 µA
(1) Common mode input voltage to pins 3–4, 5–6, 1 1–12, 13–14 must be between the values of 2.8
V and 5.0 V. This common mode input voltage range includes the differential input swing.
(2) For single ended use, apply 3.75 V (VBB) to either input depending on output polarity required.
Signal level range to other input is 3.3 V to 4.2 V.
(3) Any unused gates should have the inverting inputs tied to VCC and the non–inverting inputs tied
to ground to prevent output glitching.
(4) 1.0 V to 2.0 V w/50 pF into 500 ohms.
*Positive Emitter Coupled Logic
LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
ECL V
CC
A
OUT
A
IN
A
IN
B
IN
B
IN
B
OUT GND
TTL V
CC
C
OUT
C
IN
C
IN
D
IN
D
IN
D
OUT
OE
16 15 14 13 12 11 10
9
1 2 3 4 5 6 7 8
VCC (+5.0 VDC) = PINS 1 AND 16
GND = PIN 8
15
14
13
10
12
11
7
6
5
2
4
3
9

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
Page 2
MC10H350
MOTOROLA MECL Data
DL122 — Rev 6
2–58
ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±5%) (See Notes 1 & 4)
TA = 0°C to 75°C
Characteristic Symbol Min Max Unit
AC PARAMETERS (CL = 50 pF) (VCC = 5.0 ± 5%) (TA = 0°C to 75°C)
Propagation Delay
Data
t
pd
1.5 5.0 ns
Rise Time t
r
0.3 1.6 ns
Fall Time t
f
0.3 1.6 ns
Output Disable Time t
pdLZ
t
pdHZ
2.0
2.0
6.0
6.0
ns
Output Enable Time t
pdZL
t
pdZH
2.0
2.0
8.0
8.0
ns
T
PZL
0.3 V
OE
1.5 V1.5 V
1.5 V
T
PZH
T
PHZ
3–STATE OUTPUT HIGH ENABLE AND DISABLE TIMES
OE
V
OUT
0.3 V
V
OL
1.5 V1.5 V
1.5 V
T
PLZ
Q
VOH≈ 3.5 V
+7.0 V OPEN
ALL OTHERT
PZL
, T
PLZ
, O, C,
500
500
D.U.T .
50 PF
3–STATE SWITCHING WAVEFORMS
3–STATE OUTPUT LOW ENABLE AND DISABLE TIMES
TEST LOAD
*INCLUDES JIG AND PROBE CAPACITANCE
V
OUT
Application Note: Pin 9 is an OE and the 10H350 is disabled when OE is at VIH or higher.
Page 3
MC10H350
2–59 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
____
Page 4
MC10H350
MOTOROLA MECL Data
DL122 — Rev 6
2–60
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
____
16 9
18
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MC10H350/D
*MC10H350/D*
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