Datasheet MC10H334L, MC10H334P, MC10H334FN Datasheet (Motorola)



SEMICONDUCTOR TECHNICAL DATA

2–37

REV 5

 Motorola, Inc. 1996

3/93

   
   

The MC10H334 is a Quad Bus Driver/Receiver with transmit and receiver

latches. When disabled, (OE

= high) the bus outputs will fall to –2.0 V . Data to
be transmitted or received is passed through its respective latch when the
respective latch enable (DLE

and RLE) is at a low level. Information is latched

on the positive transition of DLE

and RLE. The parameters specified are with

25 Ω loading on the bus drivers and 50 Ω loads on the receivers.

• Propagation Delay, 1.6 ns Typical Data–to–Output

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V

EE

–8.0 to 0 Vdc

Input Voltage (VCC = 0) V

I

0 to V

EE

Vdc

Output Current— Continuous

— Surge

I

out

50

100

mA

Operating Temperature Range T

A

0 to +75 °C

Storage Temperature Range— Plastic

— Ceramic

T

stg

–55 to +150
–55 to +165

°C
°C

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I

E

— 161 — 161 — 161 mA

Input Current High

Pins 5,6,15,16
Pins 7,14
Pin 17

I

inH

—
—
—

397
460
520

—
—
—

273
297
357

—
—
—

273
297
357

µA

Input Current Low I

inL

0.5 — 0.5 — 0.3 — µA

High Output Voltage V

OH

–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc

Low Output Voltage V

OL

–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc

High Input Voltage V

IH

–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc

Low Input Voltage V

IL

–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

AC PARAMETERS

Propagation Delay

Data–to–Bus Output
DLE

–to–Bus Output

OE

–to–Bus Output
Bus–to–R0
RLE

–to–R0

Data–to–Receiver

R0

t

pd

0.5

1.0

0.5

0.5

0.5

1.0

2.5

2.7

2.5

1.9

2.1

3.8

0.5

1.0

0.5

0.5

0.5

1.0

2.5

2.7

2.5

1.9

2.1

3.8

0.5

1.0

0.5

0.5

0.5

1.0

2.5

2.7

2.5

1.9

2.1

3.8

ns

Rise Time t

r

0.5 2.2 0.5 2.2 0.5 2.2 ns

Fall Time t

f

0.5 2.2 0.5 2.2 0.5 2.2 ns



DIP & PLCC

PIN ASSIGNMENT

V

CC

BUS1
BUS0

VCC02

D1
D0

DLE

R0

V

CC03

BUS2
BUS3

OE
D2
D3
RLE
R3

20
19
18
17
16
15
14

13

1
2
3
4
5
6
7
8

R1

V

EE

R2
V

CC02

12
11

9
10

NOTE:

Each MECL 10H series circuit has been designed
to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than
500 Ifpm is maintained. Receiver outputs are
terminated through a 50–ohm resistor to –2.0 volts
dc. Bus outputs are terminated through a 25–ohm
resistor to –2.0 volts dc.

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

L SUFFIX

CERAMIC PACKAGE

CASE 732–03

P SUFFIX

PLASTIC PACKAGE

CASE 738–03

FN SUFFIX

PLCC

CASE 775–02

MC10H334

MOTOROLA MECL Data

DL122 — Rev 6

2–38

OE

QD

RECEIVER TRUTH TABLEDRIVER TRUTH TABLE

D DLE Bus

n+1

BUS0

BUS1

BUS2

BUS3

V

CC02

D1

D0

DLE

R0

R1

V

EE

OE

D2

D3

RLE

R3

R2

V

CC03

V

CC

V

CC01

QD

OUTPUT

LATCH

RECEIVER

LATCH

7

6

5

16

15

8

14

9

12

13

10

1

4

11

20

3

2

19

18

QD

QD

G

DQ

DQ

DQ

DQ

G

LOGIC DIAGRAM

17

X X H –2.0 V
DL L D

X H L Bus

n

Bus RLE R

n+1

Bus

X

L
H

Bus

R

n

MC10H334

2–39 MOTOROLAMECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

–M–

–N–

–L–

Y BRK

W

V

D

D

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

X

G1

B

U

Z

VIEW D–D

20 1

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

C

G

VIEW S

E

J

R

Z

A

0.004 (0.100)

–T–

SEATING
PLANE

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

H

VIEW S

K

K1

F

G1

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21

W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50

Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

____

MC10H334

MOTOROLA MECL Data

DL122 — Rev 6

2–40

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 738–03

ISSUE E

L SUFFIX

CERAMIC DIP PACKAGE

CASE 732–03

ISSUE E

NOTES:

1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

3. DIMENSIONS A AND B INCLUDE MENISCUS.

DIM MIN MAX

INCHES

A 0.940 0.990
B 0.260 0.295
C 0.150 0.200
D 0.015 0.022

F 0.055 0.065
G 0.100 BSC
H 0.020 0.050
J 0.008 0.012
K 0.125 0.160
L 0.300 BSC
M 0 15
N 0.010 0.040

__

A

20

110

11

B

F

C

SEATING
PLANE

D

H

G

K

N

J

M

L

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.

M

L

J 20 PL

M

B

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022

G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC
M 0 15 0 15
N 0.51 1.010.020 0.040

____

E

1.27 1.770.050 0.070

1

11

10

20

–A–

SEATING
PLANE

K

N

FG

D

20 PL

–T–

M

A

M

0.25 (0.010) T

E

B

C

F

1.27 BSC0.050 BSC

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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MC10H334/D

*MC10H334/D*

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