Datasheet MC10H334FNR2 Datasheet (MOTOROLA)



SEMICONDUCTOR TECHNICAL DATA

   
   

The MC10H334 is a Quad Bus Driver/Receiver with transmit and receiver
latches. When disabled, (OE
be transmitted or received is passed through its respective latch when the
respective latch enable (DLE
on the positive transition of DLE
25 Ω loading on the bus drivers and 50 Ω loads on the receivers.

• Propagation Delay, 1.6 ns Typical Data–to–Output

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous

Operating Temperature Range T
Storage Temperature Range— Plastic

— Surge

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I
Input Current High

Pins 5,6,15,16
Pins 7,14

Pin 17
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V

AC PARAMETERS

Propagation Delay

Data–to–Bus Output

DLE

–to–Bus Output

OE

–to–Bus Output
Bus–to–R0
RLE

–to–R0

Data–to–Receiver

R0
Rise Time t
Fall Time t

= high) the bus outputs will fall to –2.0 V. Data to

and RLE) is at a low level. Information is latched

and RLE. The parameters specified are with

EE

I

I

out

A

T

397
460
520

2.5

2.7

2.5

1.9

2.1

3.8

stg

—
—
—

0.5

1.0

0.5

0.5

0.5

1.0

— Ceramic

0° 25° 75°

— 161 — 161 — 161 mA

—
—
—

0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

IL

0.5

1.0

0.5

0.5

0.5

1.0

0.5 2.2 0.5 2.2 0.5 2.2 ns

r

0.5 2.2 0.5 2.2 0.5 2.2 ns

f

I

t

E

inH

inL

OH

OL

IH

pd

–8.0 to 0 Vdc
0 to V

EE

50

100

0 to +75 °C

–55 to +150
–55 to +165

273
297
357

2.5

2.7

2.5

1.9

2.1

3.8

—
—
—

0.5

1.0

0.5

0.5

0.5

1.0

Vdc

mA

°C
°C

273
297
357

2.5

2.7

2.5

1.9

2.1

3.8

µA

ns



L SUFFIX

CERAMIC PACKAGE

CASE 732–03

P SUFFIX

PLASTIC PACKAGE

CASE 738–03

FN SUFFIX

PLCC

CASE 775–02

DIP & PLCC

PIN ASSIGNMENT

V

CC

BUS1
BUS0

VCC02

D1
D0

DLE

R0
R1

V

EE

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

NOTE:

Each MECL 10H series circuit has been designed
to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than
500 Ifpm is maintained. Receiver outputs are
terminated through a 50–ohm resistor to –2.0 volts
dc. Bus outputs are terminated through a 25–ohm
resistor to –2.0 volts dc.

1
2
3
4
5
6
7
8
9
10

Book (DL122/D).

20
19
18
17
16
15
14

13

12
11

V

CC03

BUS2
BUS3

OE
D2

D3
RLE
R3
R2
V

CC02

3/93

 Motorola, Inc. 1996

2–37

REV 5

MC10H334

17

LOGIC DIAGRAM

OE

16

15

14

12

13

10

11

20

7

DLE

D0

6

D1

5

D2

D3

RLE

8

R0

R1

9

R2

R3

V

EE

1

V

CC

V

4

CC01

V

CC02

V

CC03

G

DQ

DQ

DQ

DQ

OUTPUT

LATCH

D DLE Bus

X X H –2.0 V
DL L D

X H L Bus

G

QD

QD

QD

QD

RECEIVER

LATCH

OE

n+1

n

BUS0

BUS1

BUS2

BUS3

RECEIVER TRUTH TABLEDRIVER TRUTH TABLE

Bus RLE R

Bus

X

L

H

19

18

n+1

Bus

R

3

2

n

MOTOROLA MECL Data

2–38

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H334

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–39 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21

W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

MC10H334

H

–T–

SEATING
PLANE

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

CASE 732–03

20

110

11

B

A

F

C

N

K

D

SEATING
PLANE

G

PLASTIC DIP PACKAGE

–A–

20

1

E

FG

11

10

N

D

20 PL

0.25 (0.010) T

B

K

ISSUE E

L

J

M

P SUFFIX

CASE 738–03

ISSUE E

C

M

M

A

L

J 20 PL

0.25 (0.010) T

NOTES:

1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

3. DIMENSIONS A AND B INCLUDE MENISCUS.

INCHES

DIM MIN MAX

A 0.940 0.990
B 0.260 0.295
C 0.150 0.200
D 0.015 0.022
F 0.055 0.065
G 0.100 BSC
H 0.020 0.050
J 0.008 0.012
K 0.125 0.160
L 0.300 BSC
M 0 15

__

N 0.010 0.040

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.

DIM MIN MAX MIN MAX

A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022

M

M

B

E
F
G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC

M

M 0 15 0 15

N 0.51 1.010.020 0.040

MILLIMETERSINCHES

1.27 BSC0.050 BSC

1.27 1.770.050 0.070

____

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MOTOROLA MECL Data

2–40

*MC10H334/D*

◊

MC10H334/D

DL122 — Rev 6