Datasheet MC10H330FNR2, MC10H330L, MC10H330P, MC10H330FN Datasheet (Motorola)



SEMICONDUCTOR TECHNICAL DATA

     !
  "

The MC10H330 is a Quad Bus Driver/Receiver with two–to–one output
multiplexers. These multiplexers have a common select and output enable.
When disabled, (OE
brought to a low state (VOL) by applying a high level to the receiver enable (RE
= High). The parameters specified are with 25 Ω loading on the bus drivers and
50 Ω loads on the receivers.

• Propagation Delay, 1.5 ns Typical Data–to–Output

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous

Operating Temperature Range T
Storage Temperature Range— Plastic

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I
Input Current High

Pins 5–8, 17–20
Pins 16, 21

Pin 9
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V

AC PARAMETERS

Propagation Delay

Select–to–Input

Data–to–Bus Output

Select–to–Bus

Output

OE

–to–Bus Output
Bus–to–Input
RE

–to–Input
Data–to–Receiver

Input
Rise Time t
Fall Time t

= high) the bus outputs go to –2.0 V. Their output can be

Characteristic Symbol Rating Unit

–8.0 to 0 Vdc
0 to V

EE

50

100

0 to +75 °C

–55 to +150
–55 to +165

417
321
297

5.3

2.0

3.2

2.2

2.1

2.2

4.0

—
—
—

1.8

0.5

1.0

0.8

0.8

0.5

1.3

Vdc

mA

°C
°C

417
321
297

5.3

2.0

3.2

2.2

2.4

2.2

4.0

— Surge

EE

I

I

out

A

T

667
514
475

5.3

2.0

3.2

2.2

2.1

2.2

4.0

stg

—
—
—

1.8

0.5

1.0

0.8

0.8

0.5

1.3

— Ceramic

0° 25° 75°

— 157 — 143 — 157 mA

—
—
—

0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

IL

1.8

0.5

1.0

0.8

0.8

0.5

1.3

0.5 2.0 0.5 2.0 0.5 2.0 ns

r

0.5 2.0 0.5 2.0 0.5 2.0 ns

f

I

t

E

inH

inL

OH

OL

IH

pd

µA

ns



L SUFFIX

CERAMIC PACKAGE

CASE 758–02

P SUFFIX

PLASTIC PACKAGE

CASE 724–03

FN SUFFIX

PLCC

CASE 776–02

DIP

PIN ASSIGNMENT

V

CC

X

BUS

W

BUS

V

CC0

X1

X0
W1
W0

W

IN

X

IN

V

EE

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

NOTE:

Each MECL 10H series circuit has been designed
to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than
500 Ifpm is maintained. Receiver outputs are
terminated through a 50–ohm resistor to –2.0 volts
dc. Bus outputs are terminated through a 25–ohm
resistor to –2.0 volts dc.

S

1
2
3
4
5
6
7
8
9
10
11
12

Book (DL122/D).

24
23
22
21
20
19
18
17
16
15
14
13

V

CC0

Y

BUS

Z

BUS

OE
Y0

Y1
Z0
Z1
RE
Z

IN

Y

IN

VCC0

3/93

 Motorola, Inc. 1996

2–299

REV 5

MC10H330

OE
S

W0

W1
W

X0

X1
X

Y0

Y1
Y

Z0

LOGIC DIAGRAM

V

= PIN 24

21

9

8

7

10

IN

6

5

11

IN

20

19
14

IN

18

CC0

VCC= PIN 1
V

= PIN 13

CC0

V

= PIN 4

CC0

VEE= PIN 12

23

22

W

3

BUS

X

2

BUS

Y

BUS

Z

BUS

17

Z1

15

Z

IN

RE

16

MULTIPLEXER TRUTH TABLE RECEIVER TRUTH TABLE

OE SW

H

L
L

BusXBusYBusZBus

X

–2.0 V

L

W0

H

W1

–2.0 V

X0
X1

–2.0 V

Y0
Y1

–2.0 V

Z0
Z1

RE W

H

L

W

in

L

Bus

X

X

Bus

in

L

Y

Y

L

Bus

Z

in

in

L

Z

Bus

MOTOROLA MECL Data

2–300

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

MC10H330

–L–

–N–

28 1

Z

C

G

G1

S

0.010 (0.250) N

L–M

T

Y BRK

0.007 (0.180) N

B

0.007 (0.180) N

U

M

T

L–M

M

S

S

S

L–M

T

S

D

Z

–M–

W

D

V

0.010 (0.250) N

G1X

S

S

L–M

T

S

VIEW D–D

A

0.007 (0.180) N

0.007 (0.180) N

R

E

M

M

S

L–M

T

L–M

T

S

S

S

H

0.007 (0.180) N

M

S

L–M

T

S

K1

0.004 (0.100)

SEATING

J

–T–

PLANE

VIEW S

S

S

K

VIEW S

0.007 (0.180) N

F

T

L–M

S

S

M

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS

0.010 (0.250) PER SIDE.

4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

DIM MIN MAX MIN MAX

A 0.485 0.495 12.32 12.57
B 0.485 0.495 12.32 12.57
C 0.165 0.180 4.20 4.57

E 0.090 0.110 2.29 2.79

F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81

J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58

V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42

Y ––– 0.020 ––– 0.50

Z 2 10 2 10

____

G1 0.410 0.430 10.42 10.92
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

DL122 — Rev 6

2–301 MOTOROLAMECL Data

MC10H330

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

CASE 758–02

ISSUE A

24

1

D 24 PL

0.25 (0.010)MTA

24 13

1

–T–

SEATING
PLANE

B

13

12

–A–

N

C

K

G

F

M

–A–

12

PLASTIC DIP PACKAGE

–B–

C

K

E

G

F

D

N

24 PL

0.25 (0.010) T

M

L P

J

SEATING

–T–

PLANE

P SUFFIX

CASE 724–03

ISSUE D

L

24 PLJ

0.25 (0.010) T

M

A

NOTE 1

M

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

INCHES

DIMAMIN MAX MIN MAX

1.240 1.285 31.50 32.64

B 0.285 0.305 7.24 7.75
C 0.160 0.200 4.07 5.08
D 0.015 0.021 0.38 0.53
F 0.045 0.062 1.14 1.57
G 0.100 BSC 2.54 BSC
J 0.008 0.013 0.20 0.33
K 0.100 0.165 2.54 4.19
L 0.300 0.310 7.62 7.87
N 0.020 0.050 0.51 1.27
P 0.360 0.400 9.14 10.16

NOTES:

1. CHAMFERED CONTOUR OPTIONAL.

2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

4. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.230 1.265 31.25 32.13
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.020 0.38 0.51
E 0.050 BSC 1.27 BSC
F 0.040 0.060 1.02 1.52
G 0.100 BSC 2.54 BSC
J 0.007 0.012 0.18 0.30

M

B

K 0.110 0.140 2.80 3.55
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01

MILLIMETERS

____

MILLIMETERSINCHES

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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Opportunity/Affirmative Action Employer.

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MOTOROLA MECL Data

2–302

*MC10H330/D*

◊

MC10H330/D

DL122 — Rev 6