Datasheet MC10H181FN, MC10H181L, MC10H181P Datasheet (Motorola)

Page 1

F
t
M is High C
M is Low C
is low
15
17
14
S0 S1 S2 S3
21
2
A0
F0
20
3
B0
18
A1
19
7
B1
F2
16
A2
11
B2
10
4
G
G
9
B3
225C
n
23 5MC
n+4
SEMICONDUCTOR TECHNICAL DATA
     
Arithmetic logic operations are selected by applying the appropriate binary word to the select inputs (S0 through S3) as indicated in the tables of arithmetic/logic functions. Group carry propagate (PG) and carry generate (GG) are provided to allow fast operations on very long words using a second order look–ahead. The internal carry is enabled by applying a low level voltage to the mode control input (M).
When used with the MC10H179, full–carry look–ahead, as a second order look–ahead block, the MC10H181 provides high–speed arithmetic operations on very long words.
This 10H part is a functional/pinout duplication of the standard MECL 10K family part with 100% improvement in propagation delay and no increase in power supply current.
Improved Noise Margin, 150 mV (Over Operating Voltage and Temperature Range)
Voltage Compensated MECL 10K – Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V Input Voltage (VCC = 0) V Output Current— Continuous
— Surge Operating Temperature Range T Storage Temperature Range— Plastic
— Ceramic
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
T
I
EE
I
out
A
stg
FUNCTION SELECT TABLE
LOGIC DIAGRAM
13 15 17 14
21 20 18 19 7 16 11 10 4
9 22 23
S0 S1 S2 S3
A0 B0 A1 B1 F2 A2 B2 A3 B3 C
n
MC
G
n+4
F0 F1
F3
G
P
G
unction Selec
S3 S2 S1 S0
L L L L F = A F = A L L L H F = A + B F = A plus (A B) L L H L F = A + B F = A plus (A B) L L H H F = Logical “1” F = A times 2 L H L L F = A B F = (A + B) plus 0 L H L H F = B F = (A + B) plus (A B)
2
L HHL L H H H F = A + B F = A plus (A + B) H LLL F = A • B F = (A + B) plus 0 H LLH
6
H L H L F = B F = (A + B) plus (A B) H L H H F = A + B F = A plus (A + B) H H L L F = Logical “0” F = minus 1 (two’s complement)
8
H H L H F = A B F = (A B) minus 1 H H H L F = A B F = (A B) minus 1 H HHH F = A F = A minus 1
Logic Functions
M is Hi
h C = D.C.
F
F = AB
F = A B
= D.C.
–8.0 to 0 Vdc 0 to V
EE
50
100
0 to +75 °C
–55 to +150 –55 to +165
Arithmetic Operation
M is Low C
F = A plus B
F = A minus B minus 1
is low
n
F
Vdc
mA
°C °C

L SUFFIX
CERAMIC PACKAGE
CASE 758–02
P SUFFIX
PLASTIC PACKAGE
CASE 724–03
FN SUFFIX
PLCC
CASE 776–02
DIP
PIN ASSIGNMENT
V
CC1
F0 F1
G
G
CN +
F3 F2
P
G
B3 A3 B2
V
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
4
Book (DL122/D).
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
V M C A0 B0 B1 A1 S1 A2 S2 S0 S3
CC2
N
9/96
Motorola, Inc. 1996
2–275
REV 6
Page 2
MC10H181
S3 13 S2 15 S1 17 S0 14
B0 20
A0 21
B1 19
A1 18
LOGIC DIAGRAM
2 F0
3 F1
B2 11
A2 16
B3 9
A3 10
Cn 22
7 F2
6 F3
8 P
4 G
5 C
G
G
n+4
M 23
V
= Pin 1
CC1
V
= Pin 24
CC2
VEE= Pin 12
MOTOROLA MECL Data
2–276
DL122 — Rev 6
Page 3
MC10H181
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5.0%) (See Note)
0° +25° +75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I Input Current High
Pin 22
I
E
inH
Pins 14,23 Pins 13,15,17 Pins 10,16,18,21 Pins 9,11,19,20
Input Current Low
Pins 9–11, 13–22 High Output Voltage V Low Output Voltage V High Input Voltage V Low Input Voltage V
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
I
inL
OH OL
IH
IL
AC PARAMETERS
Characteristic Symbol Input Output
Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time Propagation Delay
Rise Time, Fall Time
† Logic high level (+1.11 Vdc) applied to pins listed. All other
input pins are left floating or tied to +0.31 Vdc. V
= V
CC1
= +2.0 Vdc, VEE = –3.2 Vdc
CC2
t+ +, t– –
t+, t–
t+ +, t+ –,
t– +, t– –
t+, t–
t+ +, t+ –,
t– +, t– –
t+, t–
t+ +, t– –
t+, t–
t+ +, t– –
t+, t–
t+ –, t– +
t+, t–
t+ +, t– +
t+, t–
t+ +, t– –
t+, t–
t+ +, t– –
t+, t–
t+ –, t– +
t+, t–
t+ +, t+ –
t+, t–
t+ –, t– +
t+, t–
t– +, t+ –
t+, t–
t+ –, t– +
t+, t–
t+ –, t– +
t+, t–
159 145 159 mA
— — — — —
720 405 515 475 465
— — — — —
450 255 320 300 275
— — — — —
450 255 320 300 275
0.5 0.5 0.3 µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
AC Switching Characteristics
0°C +25°C +75°C
Min Max Min Max Min Max Unit
0.7
2.0
0.7
0.6
2.0
1.0
3.0
0.7
2.2
1.5
3.7
0.7
2.0
1.5
3.7
0.9
2.4
1.5
0.7
1.5
0.5
2.0
0.7
1.5
0.7
1.5
0.7
2.0
0.5
1.5
0.8
1.5
0.7
1.5
0.7
1.5
0.7
1.3
0.5
3.7
2.2
3.6
2.0
4.5
2.3
3.8
2.2
3.7
2.2
4.0
2.0
4.2
2.3
4.5
2.0
4.0
2.0
4.1
2.2
4.5
3.2
n n
n n
n n
n n
n n
0.6
1.0
0.7
1.5
0.7
1.5
0.9
1.5
0.7
1.5
0.5
2.0
0.7
1.5
0.7
1.5
0.7
2.0
0.5
1.5
0.8
1.5
0.7
1.5
0.7
1.5
0.7
1.3
0.5
2.0
2.0
3.0
2.2
3.7
2.0
3.7
2.4
3.7
2.2
3.6
2.0
4.5
2.3
3.8
2.2
3.7
2.2
4.0
2.2
4.2
2.3
4.5
2.0
4.0
2.2
4.1
2.2
4.5
3.2
0.7
0.7
1.2
0.7
1.6
0.7
1.6
0.9
1.6
0.7
1.6
0.5
2.1
0.7
1.6
0.7
1.6
0.7
2.1
0.5
1.6
0.8
1.6
0.7
1.6
0.7
1.6
0.7
1.4
0.5
2.2
2.2nsns
3.3
2.4
4.0
2.2
4.0
2.6nsns
3.9
2.4nsns
3.9
2.2nsns
4.8
2.5nsns
4.0
2.4nsns
4.0
2.4nsns
4.3
2.2nsns
4.5
2.5nsns
4.8
2.2nsns
4.3
2.4nsns
4.4
2.4nsns
4.8
3.4nsns
C C
C C C
A1 A1 A1
A1 A1
A1 A1
A1 A1
B1 B1
B1 B1
B1 B1
B1 B1
S1 S1
S1 S1
S1 S1
S1 S1
Conditions
C
n
C
n n
n n
n+4 n+4 F1 F1 F1
A0,A1,A2,A3 A0,A1,A2,A3
A0
F1 F1 F1
P
G
P
G
G
G
G
G
C
n+4
C
n+4 F1
F
P
G
P
G
G
G
G
G
C
n+4
C
M M
n+4 F1 F1
F1 F1
P
G
P
G
C
n+4
C
n+4
G
G
G
G
S0,S3 S0,S3
A0,A2,A3,C A0,A2,A3,C
A0,A2,A3,C A0,A2,A3,C
S3,C S3,C
S0,A1 S0,A1
S3,C S3,C
S3,C S3,C
— —
A1,B1 A1,B1
A3,B3 A3,B3
A3,B3 A3,B3
A3,B3 A3,B3
µA
ns
ns
DL122 — Rev 6
2–277 MOTOROLAMECL Data
Page 4
MC10H181
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
–L–
–N–
28 1
Z
C
G
G1
S
0.010 (0.250) N
L–M
T
S
L–M
T
M
S
S
L–M
T
S
Y BRK
0.007 (0.180) N
B
0.007 (0.180) N
U
M
D
Z
–M–
W
D
V
0.010 (0.250) N
G1X
S
S
L–M
T
S
VIEW D–D
A
0.007 (0.180) N
0.007 (0.180) N
R
E
M
M
S
L–M
T
L–M
T
S
S
S
H
0.007 (0.180) N
M
S
L–M
T
S
K1
0.004 (0.100)
SEATING
J
–T–
PLANE
VIEW S
S
S
K
VIEW S
0.007 (0.180) N
F
T
L–M
S
S
M
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
A 0.485 0.495 12.32 12.57 B 0.485 0.495 12.32 12.57 C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.450 0.456 11.43 11.58 U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
____
G1 0.410 0.430 10.42 10.92 K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES
MOTOROLA MECL Data
2–278
DL122 — Rev 6
Page 5
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 758–02
ISSUE A
MC10H181
24
1
D 24 PL
0.25 (0.010)MTA
24 13
1
–T–
SEATING PLANE
B
13
12
–A–
N
C
K
G
F
M
–A–
12
PLASTIC DIP PACKAGE
–B–
C
K
E
G
F
D
N
24 PL
0.25 (0.010) T
M
L P
J
SEATING
–T–
PLANE
P SUFFIX
CASE 724–03
ISSUE D
L
24 PLJ
0.25 (0.010) T
M
A
NOTE 1
M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
INCHES
DIMAMIN MAX MIN MAX
1.240 1.285 31.50 32.64
B 0.285 0.305 7.24 7.75 C 0.160 0.200 4.07 5.08 D 0.015 0.021 0.38 0.53 F 0.045 0.062 1.14 1.57 G 0.100 BSC 2.54 BSC J 0.008 0.013 0.20 0.33 K 0.100 0.165 2.54 4.19 L 0.300 0.310 7.62 7.87 N 0.020 0.050 0.51 1.27 P 0.360 0.400 9.14 10.16
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
A 1.230 1.265 31.25 32.13 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.020 0.38 0.51 E 0.050 BSC 1.27 BSC
F 0.040 0.060 1.02 1.52
G 0.100 BSC 2.54 BSC
J 0.007 0.012 0.18 0.30
M
B
K 0.110 0.140 2.80 3.55
L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
MILLIMETERS
____
MILLIMETERSINCHES
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MC10H181/D
DL122 — Rev 6
2–279 MOTOROLAMECL Data
*MC10H181/D*
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