Datasheet MC10H165FNR2, MC10H165L, MC10H165FN, MC10H165P Datasheet (Motorola)

Page 1

SEMICONDUCTOR TECHNICAL DATA
  
The MC10H165 is an 8–Input Priority Encoder. This 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increases in power– supply current.
Propagation Delay, Data–to–Output, 2.2 ns Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V Input Voltage (VCC = 0) V Output Current— Continuous
I
— Surge Operating Temperature Range T Storage Temperature Range— Plastic
T
— Ceramic
EE
I
out
A
stg
–8.0 to 0 Vdc 0 to V
EE
50
100
0 to +75 °C
–55 to +150 –55 to +165
Vdc
mA
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I Input Current High
Pin 4
Data Inputs Input Current Low I High Output Voltage V Low Output Voltage V High Input Voltage V Low Input Voltage V
I
E
inH
inL
OH
OL
IH
144 131 144 mA
——510
600——
320 370——
0.5 0.5 0.3 µA –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
µAdc 320 370
AC PARAMETERS
Propagation Delay
Data Input Output
Clock Input Output Set–up Time t Hold Time t Rise Time t Fall Time t
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
t
pd
0.7
3.4
0.7
3.4
0.7
2.2
0.7
3.0 3.0 3.0 ns
set
0.5 0.5 0.5 ns
hold
0.5 2.4 0.5 2.4 0.5 2.4 ns
r
0.5 2.4 0.5 2.4 0.5 2.4 ns
f
2.2
0.7
0.7
3.4
2.2
ns

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
TRUTH TABLE
DATA INPUTS OUTPUTS
D0
D1
D2
D3
D4
D5
D6
D7
Q3
Q2
Q1
H
X
X
X
X
X
X
X
H
L
L
H
X
X
X
X
X
L
L
H
X
L
L
L
L
L
L
L
L
L
L
L
L
X
L
H
X
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
X
X
X
X
X
X
X
X
X
X
H
X
X
L
H
X
L
L
H
L
L
L
DIP
PIN ASSIGNMENT
V
CC1
Q1 Q0
CLOCK
D0 D7 D1
V
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
1 2 3 4 5 6 7 8
Book (DL122/D).
16 15 14 13 12 11 10
9
L
H
L
L
H
L
H
H
L
H
H
H
L
H
H
L
H
H
H
H
H
H
L
L
L
V
CC2
Q2 Q3 D2 D5 D4 D3 D6
Q0
L H L H L H L H L
3/93
Motorola, Inc. 1996
2–261
REV 5
Page 2
MC10H165
8–INPUT PRIORITY ENCODER
The MC10H165 is a device designed to encode eight inputs to a binary coded output. The output code is that of the highest order input. Any input of lower priority is ignored. Each output incorporates a latch allowing synchronous operation. When the clock is low the outputs follow the inputs and latch when the clock goes high. This device is very useful for a variety of applications in checking system status in control processors, peripheral
C 4
D0 5
D1 7
D2 13
The input is active when high, (e.g., the three binary outputs are low when input D0 is high). The Q3 output is high when any input is high. This allows direct extension into another priority encoder when more than eight inputs are necessary. The MC10H165 can also be used to develop binary codes from random logic inputs, for addressing ROMs, RAMs, or for multiplexing data.
LOGIC DIAGRAM
controllers, and testing systems.
V V
VEE= PIN 8.
CC1 CC2
= PIN 1 = PIN 16
3 Q0
D3 10
D4 11
D5 12
D6 9
D7 6
Numbers at ends of terminals denote pin numbers for L and P packages.
2 Q1
15 Q2
14 Q3
MOTOROLA MECL Data
2–262
DL122 — Rev 6
Page 3
APPLICATION INFORMATION
MC10H165
A typical application of the MC10H165 is the decoding of system status on a priority basis. A 64–line priority encoder is shown in the figure below. System status lines are connected to this encoder such that, when a given condition exists, the respective input will be at a logic high level. This scheme will select the one of 64 different
64–LINE PRIORITY ENCODER
ZZZ
MC10H164 MC10H164
X0 X7. . . . . . . A B C X0 X7. . . . . . . A B C
System Clock
Highest Priority Input
Lowest Priority Input
1/2 MC10H101
C D0
MC10H165MC10H165MC10H165MC10H165MC10H165MC10H165MC10H165MC10H165
D7
C D0
D7
C D0
D7
C D0
D7
C D0
D7
C D0
D7
C D0
D7
C D0
D7
MC10H164
X0 X7. . . . . . . A B C
Q0 Q1 Q2 Q3
Q0 Q1 Q2 Q3
Q0 Q1
Q2 Q3
Q0 Q1 Q2 Q3
Q0 Q1 Q2 Q3
Q0 Q1 Q2 Q3
Q0 Q1 Q2 Q3
Q0 Q1 Q2 Q3
system conditions, as represented at the encoder inputs, which has priority in determining the next system operation to be performed. The binary code showing the address of the highest priority input present will appear at the encoder outputs to control other system logic functions.
LSB
Six bit output word yielding number of highest priority channel present at input
C
Q0
D0
Q1 Q2
D7
MSB
DL122 — Rev 6
2–263 MOTOROLAMECL Data
Page 4
MC10H165
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
MOTOROLA MECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
2–264
MILLIMETERSINCHES
DL122 — Rev 6
Page 5
OUTLINE DIMENSIONS
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
–T–
SEATING PLANE
E
F
G
16 PLD
0.25 (0.010) T
M
–A–
916
B
18
F
C
S
H
G
D
16 PL
0.25 (0.010) T
K
M
K
N
S
A
PLASTIC DIP PACKAGE
SEATING
–T–
PLANE
M
A
L SUFFIX
CASE 620–10
ISSUE V
L
M
16 PLJ
0.25 (0.010) T
P SUFFIX
CASE 648–08
ISSUE R
L
J
MC10H165
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31
M
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
M
L 0.300 BSC 7.62 BSC M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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MC10H165/D
DL122 — Rev 6
2–265 MOTOROLAMECL Data
*MC10H165/D*
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