Datasheet MC10H159ML1, MC10H159ML2, MC10H159MR1, MC10H159MEL, MC10H159L Datasheet (MOTOROLA)



SEMICONDUCTOR TECHNICAL DATA

2–242

REV 5

 Motorola, Inc. 1996

3/93

   



The MC10H159 is a quad 2–input multiplexer with enable. This MECL 10H
part is a functional/pinout duplication of the standard MECL 10K family part,
with 100% improvement in propagation delay and no increase in power–supply
current.

• Propagation Delay, 1.5 ns Typical

• Power Dissipation, 218 mW Typical

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V

EE

–8.0 to 0 Vdc

Input Voltage (VCC = 0) V

I

0 to V

EE

Vdc

Output Current— Continuous

— Surge

I

out

50

100

mA

Operating Temperature Range T

A

0 to +75 °C

Storage Temperature Range— Plastic

— Ceramic

T

stg

–55 to +150
–55 to +165

°C
°C

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I

E

— 58 — 53 — 58 mA

Input Current High

Pin 9
Pins 3–7 and 10–13

I

inH

——475

515——

295
320——

295
320

µA

Input Current Low I

inL

0.5 — 0.5 — 0.3 — µA

High Output Voltage V

OH

–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc

Low Output Voltage V

OL

–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc

High Input Voltage V

IH

–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc

Low Input Voltage V

IL

–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

AC PARAMETERS

Propagation Delay

Data
Select
Enable

t

pd

0.5

1.0

1.0

2.2

3.2

3.2

0.5

1.0

1.0

2.2

3.2

3.2

0.5

1.0

1.0

2.2

3.2

3.2

ns

Rise Time t

r

0.5 2.2 0.5 2.2 0.5 2.2 ns

Fall Time t

f

0.5 2.2 0.5 2.2 0.5 2.2 ns

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.

TRUTH TABLE



DIP

PIN ASSIGNMENT

Q0

Q1
D11
D10
D01
D00

ENABLE

V

EE

V

CC

Q2
Q3
D20
D21
D30
D31
SELECT

16
15
14
13
12
11
10

9

1
2
3
4
5
6
7
8

Select D0 D1 QEnable

LL LHX
LL HLX
LH XHL
LH XLH

HX XLX

L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

MC10H159

2–243 MOTOROLAMECL Data

DL122 — Rev 6

APPLICATION INFORMATION

The MC10H159 is a quad two channel multiplexer with
enable. It incorporates common enable and common
data select inputs. The select input determines which
data inputs are enabled. A high (H) level enables data

inputs D0 0, D1 0, D2 0, and D3 0. A low (L) level enables
data inputs D0 1, D1 1, D2 1, and D3 1. Any change on
the data inputs will be reflected at the outputs while the
enable is low. Input levels are inverted at the output.

LOGIC DIAGRAM

SELECT 9

D0 1 5

D0 0 6

D1 1 3

D1 0 4

D2 1 12

D2 0 13

D3 1 10

D3 0 11

1 Q0

2 Q1

15 Q2

14 Q3

ENABLE 7

VCC PIN 16
VEE PIN 8

MC10H159

MOTOROLA MECL Data

DL122 — Rev 6

2–244

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

–M–

–N–

–L–

Y BRK

W

V

D

D

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

X

G1

B

U

Z

VIEW D–D

20 1

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

C

G

VIEW S

E

J

R

Z

A

0.004 (0.100)

–T–

SEATING
PLANE

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

H

VIEW S

K

K1

F

G1

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21

W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50

Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

____

MC10H159

2–245 MOTOROLAMECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

916

K

PLANE

–T–

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

____

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620–10

ISSUE V

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

–A–

–B–

–T–

F

E

G

N

K

C

SEATING
PLANE

16 PLD

S

A

M

0.25 (0.010) T

16 PLJ

S

B

M

0.25 (0.010) T

M

L

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01

____

16 9

18

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MC10H159/D

*MC10H159/D*

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