Datasheet MC10H141FN, MC10H141L, MC10H141P Datasheet (Motorola)

Page 1

SEMICONDUCTOR TECHNICAL DATA
   
Shift frequency , 250 MHz Min
Power Dissipation, 425 mW Typical
Improved Noise Margin 150 mV (over operating voltage and
temperature range)
Voltage Compensated
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V Input Voltage (VCC = 0) V Output Current— Continuous
— Surge Operating Temperature Range T Storage Temperature Range— Plastic
— Ceramic
T
I
EE
I
out
A
stg
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I Input Current High
Pins 5,6,9,11,12,13 Pins 7,10
Pin 4 Input Current Low I High Output Voltage V Low Output Voltage V High Input Voltage V Low Input Voltage V
I
E
inH
inL
OH
OL
IH
112 102 112 mA
405
416
510
— — —
0.5 0.5 0.3 µA –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
AC PARAMETERS
Propagation Delay t Hold Time —
Data, Select
Set–up Time
Data
t
hold
t
set
pd
Select Rise Time t Fall Time t Shift Frequency f
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50 ohm resistor to –2.0 volts.
shift
1.0 2.0 1.0 2.0 1.1 2.1 ns
1.0 1.0 1.0 ns
1.5
3.0——
0.5 2.4 0.5 2.4 0.5 2.4 ns
r
0.5 2.4 0.5 2.4 0.5 2.4 ns
f
1.5
3.0——
250 250 250 MHz
–8.0 to 0 Vdc 0 to V
EE
50
100
0 to +75 °C
–55 to +150 –55 to +165
255 260 320
— — —
1.5
3.0
Vdc
mA
°C °C
255 260 320
— —
µA
ns

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
TRUTH TABLE
SELECT
OPERATING
S1
S2 Q1n + 1Q2n + 1Q3n +
Parallel Entry
L
L
L
H Shift Right* Q1nQ2nQ3nDR
H L Shift Left* DL Q0nQ1nQ2
HQ2
H
Stop Shift Q0
* Outputs as exist after pulse appears at “C” input with
input conditions as shown (Pulse Positive transition of clock input).
MODE
Q0n +
D0 D1 D2 D3
DIP
PIN ASSIGNMENT
V
CC1
Q2 Q3
DR D3
S2
V
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
C
1 2 3 4 5 6 7 8
Book (DL122/D).
OUTPUTS
CC2
1
n
32
n
1
Q1
n
16 15 14 13 12 11 10
n
n
V Q1 Q0 DL D0 D1 S1 D2
9
9/96
Motorola, Inc. 1996
2–131
REV 6
Page 2
MC10H141
LOGIC DIAGRAM
S1
S2
1 OF 4
DECODER
DR
C
D3
PARALLEL ENTER
SHIFT RIGHT
SHIFT LEFT
HOLD
D2 D1 D0
DQ
C
Q3
V S
V
DQ
C
Q2 Q1 Q0
CC1 = PIN 1 CC2 = PIN 16
EE = PIN 8
DQ
C
DL
DQ
C
APPLICATION INFORMATION
The MC10H141 is a four–bit universal shift register which performs shift left, or shift right, serial/parallel in, and serial/parallel out operations with no external gating. Inputs S1 and S2 control the four possible operations of the register without external gating of the clock. The flip–flops shift
MOTOROLA MECL Data
2–132
information on the positive edge of the clock. The four operations are stop shift, shift left, shift right, and parallel entry of data. The other six inputs are all data type inputs; four for parallel entry data, and one for shifting in from the left (DL) and one for shifting in from the right (DR).
DL122 — Rev 6
Page 3
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
MC10H141
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
DL122 — Rev 6
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
2–133 MOTOROLAMECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES
Page 4
MC10H141
–T–
SEATING PLANE
F
18
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
N
E
G
16 PLD
0.25 (0.010) T
M
S
A
–A–
916
B
F
C
S
–T–
H
G
D
16 PL
0.25 (0.010) T
K
M
A
CASE 620–10
ISSUE V
L
K
16 PLJ
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
SEATING PLANE
J
M
M
0.25 (0.010) T
M
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L 0.300 BSC 7.62 BSC M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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MOTOROLA MECL Data
2–134
*MC10H141/D*
MC10H141/D
DL122 — Rev 6
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