Datasheet MC10H135L, MC10H135P Datasheet (Motorola)



SEMICONDUCTOR TECHNICAL DATA

  


The MC10H135 is a dual J–K master–slave flip–flop. The device is provided
with an asynchronous set(s) and reset(R). These set and reset inputs overide
the clock.

A common clock is provided with separate J
static, the JK

inputs do not effect the output. The output states of the flip flop

change on the positive transition of the clock.

• Propagation delay, 1.5 ns Typical • Improved Noise Margin 150

• Power Dissipation, 280 mW mV (Over Operating Voltage

Typical/Pkg. (No Load) and Temperature Range)

• f

250 MHz Max• Voltage Compensated

tog

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous

— Surge
Operating Temperature Range T
Storage Temperature Range— Plastic

— Ceramic

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I
Input Current High

Pins 6, 7, 10, 11
Pins 4, 5, 12, 13

Pin 9
Input Current Low Ii
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V

I

E

inH

nL

OH

OL

IH

— 75 — 68 — 75 mA

—

460

—

800

—

675

0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

IL

AC PARAMETERS

Propagation Delay

Set, Reset, Clock
Rise Time t
Fall Time t
Set–up Time t
Hold Time t
Toggle Frequency f

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.

t

pd

r
f

set

hold

tog

0.7 2.6 0.7 2.6 0.7 2.6 ns

0.7 2.2 0.7 2.2 0.7 2.2 ns

0.7 2.2 0.7 2.2 0.7 2.2 ns

1.5 — 1.5 — 1.5 — ns

1.0 — 1.0 — 1.0 — ns

250 — 250 — 250 — MHz

–K inputs. When the clock is

• MECL 10K–Compatible

–8.0 to 0 Vdc
0 to V

EE

50

100

0 to +75 °C

–55 to +150
–55 to +165

285
500
420

—
—
—

T

I

EE

I

out

A

stg

—
—
—

Vdc

mA

°C
°C

285
500
420

µA



L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

LOGIC DIAGRAM

S1 5

1 7

J

1 6

K

R1 4

C 9

S2 12

J2 10

2 11

K

R2 13

RS TRUTH TABLE

RSQ
L

L

L

H
L

H

H

H

N.D. = Not Defined

n

Q

N.D.

Q1

Q1

Q2

Q

CLOCK J–K TRUTH TABLE*

J K Qn +

+

1

L

n

H
L

HLL
L
H

*Output states change on

positive transition of clock
for J
present.

DIP PIN ASSIGNMENT

1

V

CC1

Q1
Q

1

R1

S1
K

1

J

1

V

EE

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

16

2

15

3

14

4

13

5

12

6

11

7

10

8

9

2

3

V

= PIN 1

CC1

V

= PIN 16

CC2

VEE= PIN 8

15

14

2

H
H

–K input condition

V

CC2

Q2
Q2
R2
S2
K2
J2
C

Q

n

L

H

Q

n

1

9/96

 Motorola, Inc. 1996

2–89

REV 6

MC10H135

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

MOTOROLA MECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21

W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

2–90

MILLIMETERSINCHES

DL122 — Rev 6

OUTLINE DIMENSIONS

CERAMIC DIP PACKAGE

–A–

16 9

–B–

18

C

–T–

SEATING
PLANE

E

F

G

16 PLD

0.25 (0.010) T

M

–A–

916

B

18

F

C

S

H

G

D

16 PL

0.25 (0.010) T

K

M

K

N

S

A

PLASTIC DIP PACKAGE

SEATING

–T–

PLANE

M

A

L SUFFIX

CASE 620–10

ISSUE V

L

M

16 PLJ

0.25 (0.010) T

P SUFFIX

CASE 648–08

ISSUE R

L

J

MC10H135

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

DIM MIN MAX MIN MAX

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31

M

S

B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

M

L 0.300 BSC 7.62 BSC

M 0 15 0 15

____

N 0.020 0.040 0.51 1.01

Y14.5M, 1982.

FORMED PARALLEL.

DIM MIN MAX MIN MAX

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

MILLIMETERSINCHES

MILLIMETERSINCHES

____

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.

How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,

P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315

MFAX: RMF [e-mail] – T OUCHTONE 602–244–6609 ASIA/P ACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://Design–NET .com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

MC10H135/D

DL122 — Rev 6

◊

2–91 MOTOROLAMECL Data

*MC10H135/D*