Datasheet MC10H125FN, MC10H125P Datasheet (Motorola)

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pp y

SEMICONDUCTOR TECHNICAL DATA

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The MC10H125 is a quad translator for interfacing data and control signals
between the MECL section and saturated logic section of digital systems. The
10H part is a functional/pinout duplication of the standard MECL 10K family
part, with 100% improvement in propagation delay, and no increase in
power–supply current.

Outputs of unused translators will go to low state when their inputs are left
open.

• Propagation Delay, 2.5 ns Typical • Voltage Compensated

• Improved Noise Margin 150 mV • MECL 10K–Compatible

(Over Operating Voltage and Temperature Range)

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 5.0 V) V
Power Supply (VEE = –5.2 V) V
Input Voltage (VCC = 5.0 V) V
Operating Temperature Range T
Storage Temperature Range — Plastic

— Ceramic

EE
CC

I

A

T

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%; VCC = 5.0 V ± 5.0 %)
(See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Negative Power

Supply Drain
Current

Positive Power Supply

Drain Current

Input Current
Input Leakage Current
High Output Voltage

IOH = –1.0 mA

Low Output Voltage

IOL = +20 mA
High Input Voltage(1)
Low Input Voltage(1)
Short Circuit Current
Reference Voltage
Common Mode

Range (3)

Input Sensitivity (4)

I
I

I

V

I

CCH
CCL

I

inH

CBO

V

OH

V

V
V

I

OS

V

CMR

V

E

OL

IH

IL

BB

PP

— 44 — 40 — 44 mA

— 63 — 63 — 63 mA
— 40 — 40 — 40 mA
— 225 — 145 — 145 µA

— 1.5 — 1.0 — 1.0 µA

2.5 — 2.5 — 2.5 — Vdc

— 0.5 — 0.5 — 0.5 Vdc

–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

60 150 60 150 50 150 mA

–1.38 –1.27 –1.35 –1.25 –1.31 –1.19 Vdc

— — –2.85 to +0.3 V

Typical

150 mV

AC PARAMETERS

Propagation Delay
Rise Time(5)
Fall Time(5)

NOTES:

1. When VBB is used as the reference voltage.

2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained.

3. Differential input not to exceed 1.0 Vdc.

4. 150 mV

5. 1.0 V to 2.0 V w/25 pF into 500 W.

differential input required to obtain full logic swing on output.

p–p

t

pd

t
t

0.8 3.3 0.85 3.35 0.9 3.4 ns

0.3 1.2 0.3 1.2 0.3 1.2 ns

r

0.3 1.2 0.3 1.2 0.3 1.2 ns

f

–8.0 to 0 Vdc
0 to +7.0 Vdc
0 to V

EE

0 to +75 °C

–55 to +150
–55 to +165

Vdc

°C
°C



L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

LOGIC DIAGRAM

2
3

6
7

10
11

14
15

VBB*

GND = PIN 16
VCC ( +5.0 VDC)= PIN 9
VEE ( –5.2 VDC) = PIN 8

*VBB to be used to supply bias to the MC10H125

only and bypassed (when used) with 0.01 µF to

0.1 µF capacitor to ground (0 V). VBB can source
< 1.0 mA.

DIP

PIN ASSIGNMENT

V

BB

A

IN

A

IN

A

OUT

B

OUT

B

IN

B

IN

V

EE

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

1
2
3
4
5
6
7

16
15
14
13
12
11
10

8

Book (DL122/D).

4

5

12

13
1

GND
D

IN

D

IN

D

OUT

C

OUT

C

IN

C

IN

V

9

CC

9/96

 Motorola, Inc. 1996

2–29

REV 6

MC10H125

APPLICATION INFORMATION

The MC10H125 incorporates differential inputs and
Schottky TTL “totem pole” outputs. Differential inputs
allow for use as an inverting/non–inverting translator or
as a differential line receiver . The VBB reference voltage
is available on Pin 1 for use in single–ended input biasing.
The outputs of the MC10H125 go to a low–logic level
whenever the inputs are left floating, and a high–logic

output level is achieved with a minimum input level of 150
mV

.

p–p

An advantage of this device is that MECL–level
information can be received, via balanced twisted pair
lines, in the TTL equipment. This isolates the MECL–logic
from the noisy TTL environment. Power supply
requirements are ground, +5.0 volts and –5.2 volts.

MOTOROLA MECL Data

2–30

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H125

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–31 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

MC10H125

–T–

SEATING
PLANE

F

18

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

–A–

16 9

–B–

18

C

N

E

G

16 PLD

0.25 (0.010) T

M

S

A

–A–

916

B

F

C

S

–T–

H

G

D

16 PL

0.25 (0.010) T

K

M

A

CASE 620–10

ISSUE V

L

K

16 PLJ

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

SEATING
PLANE

J

M

M

0.25 (0.010) T

M

L

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

DIM MIN MAX MIN MAX

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31

S

B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

L 0.300 BSC 7.62 BSC
M 0 15 0 15

____

N 0.020 0.040 0.51 1.01

Y14.5M, 1982.

FORMED PARALLEL.

DIM MIN MAX MIN MAX

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

MILLIMETERSINCHES

MILLIMETERSINCHES

____

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MOTOROLA MECL Data

2–32

*MC10H125/D*

◊

MC10H125/D

DL122 — Rev 6