Datasheet MC10H125L, MC10H125M, MC10H125MEL, MC10H125ML1, MC10H125ML2 Datasheet (MOTOROLA)

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Page 1

SEMICONDUCTOR TECHNICAL DATA
2–29
REV 6
Motorola, Inc. 1996
9/96
  
The MC10H125 is a quad translator for interfacing data and control signals between the MECL section and saturated logic section of digital systems. The 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power–supply current.
Outputs of unused translators will go to low state when their inputs are left open.
Propagation Delay, 2.5 ns Typical • Voltage Compensated
Improved Noise Margin 150 mV • MECL 10K–Compatible
(Over Operating Voltage and Temperature Range)
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 5.0 V) V
EE
–8.0 to 0 Vdc
Power Supply (VEE = –5.2 V) V
CC
0 to +7.0 Vdc
Input Voltage (VCC = 5.0 V) V
I
0 to V
EE
Vdc
Operating Temperature Range T
A
0 to +75 °C
Storage Temperature Range — Plastic
— Ceramic
T
stg
–55 to +150 –55 to +165
°C °C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%; VCC = 5.0 V ± 5.0 %) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Negative Power
Supply Drain Current
I
E
44 40 44 mA
Positive Power Supply
I
CCH
63 63 63 mA
pp y
Drain Current
I
CCL
40 40 40 mA
Input Current
I
inH
225 145 145 µA
Input Leakage Current
I
CBO
1.5 1.0 1.0 µA
High Output Voltage
IOH = –1.0 mA
V
OH
2.5 2.5 2.5 Vdc
Low Output Voltage
IOL = +20 mA
V
OL
0.5 0.5 0.5 Vdc
High Input Voltage(1)
V
IH
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
Low Input Voltage(1)
V
IL
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
Short Circuit Current
I
OS
60 150 60 150 50 150 mA
Reference Voltage
V
BB
–1.38 –1.27 –1.35 –1.25 –1.31 –1.19 Vdc
Common Mode Range (3)
V
CMR
–2.85 to +0.3 V
Typical
Input Sensitivity (4)
V
PP
150 mV
AC PARAMETERS
Propagation Delay
t
pd
0.8 3.3 0.85 3.35 0.9 3.4 ns
Rise Time(5)
t
r
0.3 1.2 0.3 1.2 0.3 1.2 ns
Fall Time(5)
t
f
0.3 1.2 0.3 1.2 0.3 1.2 ns
NOTES:
1. When VBB is used as the reference voltage.
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mV
p–p
differential input required to obtain full logic swing on output.
5. 1.0 V to 2.0 V w/25 pF into 500 W.
LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
V
BB
A
IN
A
IN
A
OUT
B
OUT
B
IN
B
IN
V
EE
GND D
IN
D
IN
D
OUT
C
OUT
C
IN
C
IN
V
CC
16 15 14 13 12 11 10
9
1 2 3 4 5 6 7 8
4
3
2
5
7
6
12
11
10
13
15
14
1
GND = PIN 16 VCC ( +5.0 VDC)= PIN 9 VEE ( –5.2 VDC) = PIN 8
*VBB to be used to supply bias to the MC10H125
only and bypassed (when used) with 0.01 µF to
0.1 µF capacitor to ground (0 V). VBB can source < 1.0 mA.
VBB*

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
Page 2
MC10H125
MOTOROLA MECL Data
DL122 — Rev 6
2–30
APPLICATION INFORMATION
The MC10H125 incorporates differential inputs and Schottky TTL “totem pole” outputs. Differential inputs allow for use as an inverting/non–inverting translator or as a differential line receiver . The VBB reference voltage is available on Pin 1 for use in single–ended input biasing. The outputs of the MC10H125 go to a low–logic level whenever the inputs are left floating, and a high–logic
output level is achieved with a minimum input level of 150 mV
p–p
.
An advantage of this device is that MECL–level information can be received, via balanced twisted pair lines, in the TTL equipment. This isolates the MECL–logic from the noisy TTL environment. Power supply requirements are ground, +5.0 volts and –5.2 volts.
Page 3
MC10H125
2–31 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50
Z 2 10 2 10 G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
____
Page 4
MC10H125
MOTOROLA MECL Data
DL122 — Rev 6
2–32
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
____
16 9
18
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MC10H125/D
*MC10H125/D*
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