Datasheet MC10H123FN, MC10H123L, MC10H123P Datasheet (Motorola)



SEMICONDUCTOR TECHNICAL DATA

   

The MC10H123 is a triple 4–3–3–Input Bus Driver.

The MC10H123 consists of three NOR gates designed for bus driving
applications on card or between cards. Output low logic levels are specified with
VOL = –2.1 Vdc so that the bus may be terminated to –2.0 Vdc. The gate output,
when low, appears as a high impedance to the bus, because the output
emitter–followers of the MC10H123 are “turned–off.” This eliminates
discontinuities in the characteristic impedance of the bus.

The VOH level is specified when driving a 25–ohm load terminated to –2.0
Vdc, the equivalent of a 50–ohm bus terminated at both ends. Although 25
ohms is the lowest characteristic impedance that can be driven by the
MC10H123, higher impedance values may be used with this part. A typical
50–ohm bus is shown in Figure 1.

• Propagation Delay, 1.5 ns Typical

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous

— Surge
Operating Temperature Range T
Storage Temperature Range— Plastic

— Ceramic

T

I

EE

I

out

A

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I
Input Current High I
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V

E

inH

inL

OH

OL

IH

— 60 — 56 — 60 mA
— 495 — 310 — 310 µA

0.5 — 0.5 — 0.3 — µA

–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc

–2.1 –2.03 –2.1 –2.03 –2.1 –2.03 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

IL

AC PARAMETERS

Propagation Delay t
Rise Time t
Fall Time t

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.1 volts.

pd

0.7 1.5 0.7 1.6 0.7 1.7 ns

0.7 1.6 0.7 1.7 0.7 1.8 ns

r

0.7 1.6 0.7 1.7 0.7 1.8 ns

f

–8.0 to 0 Vdc
0 to V

EE

50

100

0 to +75 °C

–55 to +150
–55 to +165

Vdc

mA

°C
°C



L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

LOGIC DIAGRAM

4

5

6
7

9
10
11

12

13
14

DIP

PIN ASSIGNMENT

V

CC1

B

OUT

A

OUT

A

IN

A

IN

A

IN

A

IN

V

EE

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

1
2
3
4
5
6
7
8

Book (DL122/D).

3

2

V

= PIN 1

CC1

V

= PIN 16

CC2

VEE = PIN 8

15

16
15
14
13
12
11
10

9

V

CC2

C

OUT

C

IN

C

IN

C

IN

B

IN

B

IN

B

IN

3/93

 Motorola, Inc. 1996

2–41

REV 5

MC10H123

FIGURE 1 — 50–OHM BUS DRIVER (25–OHM LOAD)

ZO = 50

50

Ω

1/3 MC10H123

Ω

–2.0

VDC

1/3 MC10H123 1/3 MC10H123

RECEIVERS (MECL GATES)

–2.0

VDC

50

Ω

MOTOROLA MECL Data

2–42

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H123

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–43 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

MC10H123

–T–

SEATING
PLANE

F

18

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

–A–

16 9

–B–

18

C

N

E

G

16 PLD

0.25 (0.010) T

M

S

A

–A–

916

B

F

C

S

–T–

H

G

D

16 PL

0.25 (0.010) T

K

M

A

CASE 620–10

ISSUE V

L

K

16 PLJ

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

SEATING
PLANE

J

M

M

0.25 (0.010) T

M

L

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

DIM MIN MAX MIN MAX

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31

S

B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

L 0.300 BSC 7.62 BSC
M 0 15 0 15

____

N 0.020 0.040 0.51 1.01

Y14.5M, 1982.

FORMED PARALLEL.

DIM MIN MAX MIN MAX

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

MILLIMETERSINCHES

MILLIMETERSINCHES

____

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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Opportunity/Affirmative Action Employer.

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MOTOROLA MECL Data

2–44

*MC10H123/D*

◊

MC10H123/D

DL122 — Rev 6