Page 1
SEMICONDUCTOR TECHNICAL DATA
The MC10H115 is a quad differential amplifier designed for use in sensing
differential signals over long lines. This 10H part is a functional/ pinout
duplication of the standard MECL 10K family part, with 100% improvement in
counting frequency and no increase in power–supply current.
The base bias supply (VBB) is made available at Pin 9 to make the device
useful as a Schmitt trigger, or in other applications where a stable reference
voltage is necessary. Active current sources provide the MC10H115 with
excellent common mode rejection. If any amplifier in a package is not used, one
input of that amplifier must be connected to VBB (Pin 9) to prevent upsetting the
current source bias network.
• Propagation Delay, 1.0 ns Typical
• Power Dissipation 1 10 mW Typ/Pkg (No Load)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current — Continuous
— Surge
Operating T emperature Range T
Storage T emperature Range — Plastic
— Ceramic
EE
I
I
out
A
T
stg
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (2)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I
Input Current High I
Input Leakage Current I
Reference Voltage V
High Output Voltage V
Low Output Voltage V
High Input Voltage (1) V
Low Input Voltage (1) V
Common Mode
Range (3)
Input Sensitivity (4) V
V
E
inH
CBO
BB
OH
OL
IH
CMR
PP
— 29 — 26 — 29 mA
— 150 — 95 — 95 µA
— 1.5 — 1.0 — 1.0 µA
–1.38 –1.27 –1.35 –1.25 –1.31 –1.19 Vdc
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
— — –2.85 to –0.8 — — Vdc
— — 150 typ — — mV
AC PARAMETERS
Propagation Delay t
Rise Time t
Fall Time t
NOTES:
1. When VBB is used as the reference voltage.
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mV
differential input required to obtain full logic swing on output.
p–p
pd
0.4 1.3 0.4 1.3 0.45 1.45 ns
0.5 1.4 0.5 1.5 0.5 1.6 ns
r
0.5 1.4 0.5 1.5 0.5 1.6 ns
f
–8.0 to 0 Vdc
0 to V
EE
50
100
0 to +75 °C
–55 to +150
–55 to +165
Vdc
mA
°C
°C
PP
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
LOGIC DIAGRAM
4
5
7
6
10
V
= Pin 1
CC1
V
= Pin 16
CC2
VEE = Pin 8
When input pin with
bubble goes positive
its respective output
pin with bubble goes
positive.
*VBB to be used to supply bias to the MC10H115 only
and bypassed (when used) with 0.01 µF to 0.1 µF
capacitor to ground (0 V). VBB can source < 1.0 mA.
The MC10H115 is designed to be used in sensing
differential signals over long lines. The bias supply
(VBB) is made available to make the device useful as a
Schmitt trigger, or in other applications where a stable
reference voltage is necessary.
Active current sources provide these receivers with
excellent common–mode noise rejection. If any
amplifier in a package is not used, one input of that
amplifier must be connected to VBB to prevent
unbalancing the current–source bias network.
The MC10H115 does not have internal–input pull–
down resistors. This provides high impedance to the
amplifier input and facilitates differential connections.
Applications:
• Low Level Receiver • Voltage Level
• Schmitt Trigger Interface
PIN ASSIGNMENT
V
CC1
A
OUT
B
OUT
A
IN
A
IN
B
IN
B
IN
V
EE
11
13
12
VBB*
DIP
1
16
V
15
14
13
12
11
10
CC2
D
OUT
C
OUT
D
IN
D
IN
C
IN
C
IN
9
VBB
2
3
4
5
6
7
8
2
3
14
15
9
3/93
Motorola, Inc. 1996
2–216
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
REV 5
Page 2
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
MC10H115
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
DL122 — Rev 6
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
2–217 MOTOROLAMECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES
Page 3
MC10H115
–T–
SEATING
PLANE
F
18
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
N
E
G
16 PLD
0.25 (0.010) T
M
S
A
–A–
916
B
F
C
S
–T–
H
G
D
16 PL
0.25 (0.010) T
K
M
A
CASE 620–10
ISSUE V
L
K
16 PLJ
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
SEATING
PLANE
J
M
M
0.25 (0.010) T
M
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L 0.300 BSC 7.62 BSC
M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
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MOTOROLA MECL Data
2–218
*MC10H115/D*
◊
MC10H115/D
DL122 — Rev 6
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