Datasheet MC10H115FNR2, MC10H115M, MC10H115MEL, MC10H115ML1, MC10H115ML2 Datasheet (MOTOROLA)



SEMICONDUCTOR TECHNICAL DATA

2–216

REV 5

 Motorola, Inc. 1996

3/93

  

The MC10H115 is a quad differential amplifier designed for use in sensing
differential signals over long lines. This 10H part is a functional/ pinout
duplication of the standard MECL 10K family part, with 100% improvement in
counting frequency and no increase in power–supply current.

The base bias supply (VBB) is made available at Pin 9 to make the device
useful as a Schmitt trigger, or in other applications where a stable reference
voltage is necessary. Active current sources provide the MC10H115 with
excellent common mode rejection. If any amplifier in a package is not used, one
input of that amplifier must be connected to VBB (Pin 9) to prevent upsetting the
current source bias network.

• Propagation Delay, 1.0 ns Typical

• Power Dissipation 110 mW Typ/Pkg (No Load)

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V

EE

–8.0 to 0 Vdc

Input Voltage (VCC = 0) V

I

0 to V

EE

Vdc

Output Current — Continuous

— Surge

I

out

50

100

mA

Operating T emperature Range T

A

0 to +75 °C

Storage T emperature Range — Plastic

— Ceramic

T

stg

–55 to +150
–55 to +165

°C
°C

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (2)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I

E

— 29 — 26 — 29 mA

Input Current High I

inH

— 150 — 95 — 95 µA

Input Leakage Current I

CBO

— 1.5 — 1.0 — 1.0 µA

Reference Voltage V

BB

–1.38 –1.27 –1.35 –1.25 –1.31 –1.19 Vdc

High Output Voltage V

OH

–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc

Low Output Voltage V

OL

–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc

High Input Voltage (1) V

IH

–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc

Low Input Voltage (1) V

IL

–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

Common Mode

Range (3)

V

CMR

— — –2.85 to –0.8 — — Vdc

Input Sensitivity (4) V

PP

— — 150 typ — — mV

PP

AC PARAMETERS

Propagation Delay t

pd

0.4 1.3 0.4 1.3 0.45 1.45 ns

Rise Time t

r

0.5 1.4 0.5 1.5 0.5 1.6 ns

Fall Time t

f

0.5 1.4 0.5 1.5 0.5 1.6 ns

NOTES:

1. When VBB is used as the reference voltage.

2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.

3. Differential input not to exceed 1.0 Vdc.

4. 150 mV

p–p

differential input required to obtain full logic swing on output.



LOGIC DIAGRAM

DIP

PIN ASSIGNMENT

V

CC1

A

OUT

B

OUT

A

IN

A

IN

B

IN

B

IN

V

EE

V

CC2

D

OUT

C

OUT

D

IN

D

IN

C

IN

C

IN

VBB

16
15
14
13
12
11
10

9

1
2
3
4
5
6
7
8

2

5

4

3

6

7

14

11

10

15

12

13

9

*VBB to be used to supply bias to the MC10H115 only

and bypassed (when used) with 0.01 µF to 0.1 µF
capacitor to ground (0 V). VBB can source < 1.0 mA.

The MC10H115 is designed to be used in sensing
differential signals over long lines. The bias supply
(VBB) is made available to make the device useful as a
Schmitt trigger, or in other applications where a stable
reference voltage is necessary.

Active current sources provide these receivers with
excellent common–mode noise rejection. If any
amplifier in a package is not used, one input of that
amplifier must be connected to VBB to prevent
unbalancing the current–source bias network.

The MC10H115 does not have internal–input pull–
down resistors. This provides high impedance to the
amplifier input and facilitates differential connections.

Applications:

• Low Level Receiver • Voltage Level

• Schmitt Trigger Interface

VBB*

When input pin with
bubble goes positive
its respective output
pin with bubble goes
positive.

V

CC1

= Pin 1

V

CC2

= Pin 16

VEE = Pin 8

L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

MC10H115

2–217 MOTOROLAMECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

–M–

–N–

–L–

Y BRK

W

V

D

D

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

X

G1

B

U

Z

VIEW D–D

20 1

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

C

G

VIEW S

E

J

R

Z

A

0.004 (0.100)

–T–

SEATING
PLANE

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

H

VIEW S

K

K1

F

G1

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50

Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

____

MC10H115

MOTOROLA MECL Data

DL122 — Rev 6

2–218

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

916

K

PLANE

–T–

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC

J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

____

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620–10

ISSUE V

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

–A–

–B–

–T–

F

E

G

N

K

C

SEATING
PLANE

16 PLD

S

A

M

0.25 (0.010) T

16 PLJ

S

B

M

0.25 (0.010) T

M

L

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01

____

16 9

18

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MC10H115/D

*MC10H115/D*

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