Datasheet MC10EP56DT, MC10EP56DTR2 Datasheet (MOTOROLA)

MC10EP56

Product Preview

Dual Differential
2:1 Multiplexer

The MC10EP56 is a dual, fully differential 2:1 multiplexer. The
differential data path makes the device ideal for multiplexing low
skew clock or other skew sensitive signals. Multiple VBB pins are
provided to ease AC coupling of input signals. If used, the VBB output
should be bypassed to ground with a 0.01µF capacitor .

The device features both individual and common select inputs to
address both data path and random logic applications.

• 350ps Typical Propagation Delays

• Typical Frequency 3.0GHz

• 20–Lead TSSOP Package

• PECL mode: 3.0V to 5.5V V

• ECL mode: 0V V

with VEE = –3.0V to –5.5V

CC

• Separate and Common Select

• Internal Input Resistors: Pulldown on D, D

• Q Output will default LOW with inputs open or at V

• ESD Protection: >4KV HBM, >200V MM

• V

BB

Outputs

• New Differential Input Common Mode Range

• Moisture Sensitivity Level 1, Indefinite Time Out of Drypack.

For Additional Information, See Application Note AND8003/D

• Flammability Rating: UL–94 code V–0 @ 1/8”,

Oxygen Index 28 to 34

• Transistor Count = 140 devices

Q0

VCC Q0

1920

SEL0 SEL1 VCC Q1 Q1 V

1718 16 15 14 13 12

with VEE = 0V

CC

COM_SEL

EE

EE
11

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20

1

TSSOP–20
DT SUFFIX

CASE 948E

MARKING DIAGRAM*

MC10

EP56

ALYW

*For additional information, see Application Note
AND8002/D

A = Assembly Location
L = Wafer Lot
Y = Y ear
W = Work Week

PIN DESCRIPTION

PIN

D0a–D1a
D0a

–D1a ECL Input Data a Invert

D0b–D1b

–D1b ECL Input Data b Invert

D0b

SEL0–SEL1

COM_SEL ECL Common Select Input

V

, V

BB0

BB1
Q0–Q1 ECL True Outputs
Q0–Q1 ECL Inverted Outputs

V

CC

V

EE

FUNCTION

ECL Input Data a

ECL Input Data b

ECL Indiv. Select Input

Output Reference Voltage

Positive Supply

Negative, 0 Supply

10 1 0

21

D0a

56789

43

D0bD0b D1aVBBO

D1aD0a

10

VBB1 D1bD1b

Figure 1. 20–Lead TSSOP (Top View) and Logic Diagram

This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.

 Semiconductor Components Industries, LLC, 1999

January , 2000 – Rev. 2

1 Publication Order Number:

TRUTH TABLE

SEL0

X
L
L
H
H

SEL1

X
L
H
H
L

COM_SEL

H

L
L
L
L

Q0,

Q0

a
b
b
a
a

Q1,

Q1

a
b
a
a
b

ORDERING INFORMATION

Device Package Shipping

MC10EP56DT TSSOP 75 Units/Rail
MC10EP56DTR2 TSSOP 2500 Tape & Reel

MC10EP56/D

MC10EP56

MAXIMUM RATINGS*

Symbol Parameter Value Unit

V

EE

V

CC

V

I

V

I

I

out

I

BB

T

A

T

stg

θ

JA

θ

JC

T

sol

* Maximum Ratings are those values beyond which damage to the device may occur.

{

Use for inputs of same package only.

DC CHARACTERISTICS, ECL/LVECL (VCC = 0V; VEE = –5.5V to –3.0V) (Note 4.)

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE

V

OH

V

OL

V

IH

V

IL

V

BB

V

IHCMR

I

IH

I

IL

NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The

1. VCC = 0V, VEE = V

2. All loading with 50 ohms to VCC–2.0 volts.

3. V

4. Input and output parameters vary 1:1 with VCC.

Power Supply Current
(Note 1.)

Output HIGH Voltage
(Note 2.)

Output LOW Voltage
(Note 2.)

Input HIGH Voltage
Single Ended

Input LOW Voltage
Single Ended

Output Voltage Reference –1510 –1410 –1310 –1445 –1345 –1245 –1385 –1285 –1185 mV
Input HIGH Voltage Common Mode

Range (Note 3.)
Input HIGH Current 150 150 150 µA
Input LOW Current

circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.

min varies 1:1 with VEE, max varies 1:1 with VCC.

IHCMR

Power Supply (VCC = 0V) –6.0 to 0 VDC
Power Supply (VEE = 0V) 6.0 to 0 VDC
Input Voltage (VCC = 0V, VI not more negative than VEE) –6.0 to 0 VDC
Input Voltage (VEE = 0V, VI not more positive than VCC) 6.0 to 0 VDC
Output Current Continuous

VBB Sink/Source Current
Operating Temperature Range –40 to +85 °C
Storage Temperature –65 to +150 °C
Thermal Resistance (Junction–to–Ambient) Still Air

Thermal Resistance (Junction–to–Case) 23 to 41 ± 5% °C/W
Solder Temperature (<2 to 3 Seconds: 245°C desired) 265 °C

SEL, COM_SEL, D

to V

EEmin

EEmax

{

–40°C 25°C 85°C

50 65 88 50 65 88 50 65 88 mA

–1135 –1060 –885 –1070 –945 –820 –1010 –885 –760 mV

–1935 –1810 –1685 –1870 –1745 –1620 –1810 –1685 –1560 mV

–1210 –885 –1145 –820 –1085 –760 mV

–1935 –1610 –1870 –1545 –1810 –1485 mV

VEE+2.0 0.0 VEE+2.0 0.0 VEE+2.0 0.0 V

0.5

D

, all other pins floating.

–150

Surge

500lfpm

0.5

–150

50

100

± 0.5 mA

140
100

0.5

–150

mA

°C/W

µA

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MC10EP56

DC CHARACTERISTICS, LVPECL (VCC = 3.3V ± 0.3V, VEE = 0V) (Note 8.)

–40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE

V

OH

V

OL

V

IH

V

IL

V

BB

V

IHCMR

I

IH

I

IL

NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The

5. VCC = 3.3V, VEE = 0V, all other pins floating.

6. All loading with 50 ohms to VCC–2.0 volts.

7. V

8. Input and output parameters vary 1:1 with VCC.

Power Supply Current
(Note 5.)

Output HIGH Voltage
(Note 6.)

Output LOW Voltage
(Note 6.)

Input HIGH Voltage
Single Ended

Input LOW Voltage
Single Ended

Output Voltage Reference 1790 1890 1990 1855 1955 2055 1915 2015 2115 mV
Input HIGH Voltage Common Mode

Range (Note 7.)
Input HIGH Current 150 150 150 µA
Input LOW Current

circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.

min varies 1:1 with VEE, max varies 1:1 with VCC.

IHCMR

SEL, COM_SEL, D

D

50 65 88 50 65 88 50 65 88 mA

2165 2240 2415 2230 2355 2480 2290 2415 2540 mV

1365 1490 1615 1430 1555 1680 1490 1615 1740 mV

2090 2415 2155 2480 2215 2540 mV

1365 1690 1430 1755 1490 1815 mV

2.0 3.3 2.0 3.3 2.0 3.3 V

0.5

–150

0.5

–150

0.5

–150

µA

DC CHARACTERISTICS, PECL (VCC = 5.0V ± 0.5V, VEE = 0V) (Note 12.)

–40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE

V

OH

V

OL

V

IH

V

IL

V

BB

V

IHCMR

I

IH

I

IL

NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The

9. VCC = 5.0V, VEE = 0V, all other pins floating.

10.All loading with 50 ohms to VCC–2.0 volts.

11. V

12.Input and output parameters vary 1:1 with VCC.

Power Supply Current
(Note 9.)

Output HIGH Voltage
(Note 10.)

Output LOW Voltage
(Note 10.)

Input HIGH Voltage
Single Ended

Input LOW Voltage
Single Ended

Output Voltage Reference 3490 3590 3690 3555 3655 3755 3615 3715 3815 mV
Input HIGH Voltage Common Mode

Range (Note 11.)
Input HIGH Current 150 150 150 µA
Input LOW Current

circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.

min varies 1:1 with VEE, max varies 1:1 with VCC.

IHCMR

SEL, COM_SEL, D

D

50 65 88 50 65 88 50 65 88 mA

3865 3940 4115 3930 4055 4180 3990 4115 4240 mV

3065 3190 3315 3130 3255 3380 3190 3315 3440 mV

3790 4115 3855 4180 3915 4240 mV

3065 3390 3130 3455 3190 3515 mV

2.0 5.0 2.0 5.0 2.0 5.0 V

0.5

–150

0.5

–150

0.5

–150

µA

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MC10EP56

AC CHARACTERISTICS (VCC = 0V; VEE = –3.0V to –5.5V) or (VCC = 3.0V to 5.5V; VEE =

–40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

f

max

t

PLH

t

PHL

t

SKEW

t

JITTER

V

PP

t

r

t

f

13.F

14.Within–Device Skew is defined as identical transitions on similar paths through a device.

15.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.

Maximum Toggle
Frequency (Note 13.)

,

Propagation Delay to
Output Differential

Within–Device Skew (Note 14.)
Duty Cycle Skew (Note 15.)

Cycle–to–Cycle Jitter TBD TBD TBD ps
Input Voltage Swing (Diff.) 150 800 1200 150 800 1200 150 800 1200 mV
Output Rise/Fall Times Q, Q

(20% – 80%)

guaranteed for functionality only.

max

D–>Q, Q

D–>Q, Q

COM_SEL–>Q, Q

(Diff)

(SE)

SEL–>Q, Q

250
250
200
200

100 150 200 100 150 200 100 160 220 ps

340
340
340
350

TBD
TBD

480
480
550
580

250
250
200
200

3.0 GHz

360
360
340
360

TBD
TBD

480
480
550
580

0V)

300
300
200
200

400
400
390
400

TBD
TBD

ps

520
520
650
675

ps

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MC10EP56

P ACKAGE DIMENSIONS

TSSOP–20
DT SUFFIX

20 PIN PLASTIC TSSOP PACKAGE

CASE 948E–02

ISSUE A

L

U0.15 (0.006) T

2X

L/2

PIN 1
IDENT

U0.15 (0.006) T

C

0.100 (0.004)

–T–

20X REFK

S

0.10 (0.004) V

M

S

U

T

1120

B

–U–

110

S

A

–V–

G

H

SEATING
PLANE

D

S

JJ1

N

N

DETAIL E

K

K1

SECTION N–N

0.25 (0.010)

M

F

DETAIL E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED

0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.

MILLIMETERS

–W–

DIMAMIN MAX MIN MAX

B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC
M 0 8 0 8

6.60 0.260

6.40 0.252
––– –––

____

INCHES

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Notes

MC10EP56

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Notes

MC10EP56

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MC10EP56

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MC10EP56/D

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