Datasheet MC10E112FN, MC100E112FN, MC100E112FNR2, MC10E112FNR2 Datasheet (Motorola)

LOGIC DIAGRAM

V

CCO

D

3

D

2

V

EE

D

1

D

0

EN

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

Q

3bQ3a

Q3bQ3aV

CCO

Q2bQ

2a

Q

2b

Q

2a

V

CC

Q

1b

Q

1a

Q

1b

Q

1a

NC V

CCOQ0aQ0b

Q

0aQ0b

V

CCO

D

0

D

1

D

2

D

3

EN

Q

0a

Q

0b

Q

0a

Q

0b

Q

1a

Q

1b

Q

1a

Q

1b

Q

2a

Q

2b

Q

2a

Q

2b

Q

3a

Q

3b

Q

3a

Q

3b

1

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 2

 Motorola, Inc. 1996

12/93

 

The MC10E/100E112 is a quad driver with two pairs of OR/NOR
outputs from each gate, and a common, buffered enable input. Using the
data inputs the device can serve as an ECL memory address fan-out
driver. Using just the enable input, the device serves as a clock driver,
although the MC10E/100E111 is designed specifically for this purpose,
and offers lower skew than the E112. For memory address driver
applications where scan capabilities are required, please refer to the
E212 device.

• 600ps Max. Propagation Delay

• Common Enable Input

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

PIN NAMES

Pin Function

D0 – D

3

Data Inputs

EN Enable Input
Qna, Q

nb

True Outputs

Qna, Q

nb

Inverting Outputs





QUAD DRIVER

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

MC10E112 MC100E112

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

I

IH

Input HIGH Current µA

D 200 200 200
EN 200 200 200

I

EE

Power Supply Current mA

10E 47 56 47 56 47 56
100E 47 56 47 56 54 65

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

t

PLH

Propagation Delay to Output ps

t

PHL

D 200 400 600 200 400 600 200 400 600
EN 275 450 675 275 450 675 275 450 675

t

SKEW

Within-Device Skew ps

Dn to Qn, Qn 80 80 80 1
Qna to Qnb 40 40 40 2

t

r

Rise/Fall Times ps

t

f

20 - 80% 275 425 700 275 425 700 275 425 700

1. Within-device skew is defined as identical transitions on similar paths through a device.

2. Skew defined between common OR or common NOR outputs of a single gate.

MC10E112 MC100E112

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E112 MC100E112

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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MC10E112/D

*MC10E112/D*

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