Datasheet MC10216L, MC10216FNR2 Datasheet (MOTOROLA)



SEMICONDUCTOR TECHNICAL DATA

3–197

REV 5

 Motorola, Inc. 1996

3/93

   


The MC10216 is a high speed triple differential amplifier designed for use in
sensing differential signals over long lines. The base bias supply (VBB) is made
available at pin 11 to make the device useful as a Schmitt trigger, or in other
applications where a stable reference voltage is necessary.

Active current sources provide the MC10216 with excellent common mode
noise rejection. If any amplifier in a package is not used, one input of that
amplifier must be connected to VBB (pin 11) to prevent upsetting the current
source bias network.

Complementary outputs are provided to allow driving twisted pair lines, to
enable cascading of several amplifiers in a chain, or simply to provide
complement outputs of the input logic function.

PD = 100 mW typ/pkg (No Load)
tpd = 1.8 ns typ (Single ended)

= 1.5 ns typ (Differential)

tr, tf = 1.5 ns typ (20%–80%)

LOGIC DIAGRAM

V

CC1

= PIN 1

V

CC2

= PIN 16

VEE= PIN 8

5

4

11

3

2

10

9

7

6

13

12

15

14

V

BB

*VBB to be used to supply bias to the MC10216 only and bypassed (when used)

with 0.01 µF to 0.1 µF capacitor.

When the input pin with bubble goes positive, it’s respective output pin with bubble
goes positive.



DIP

PIN ASSIGNMENT

V

CC1

A

OUT

A

OUT

A

IN

A

IN

B

OUT

B

OUT

V

EE

V

CC2

C

OUT

C

OUT

C

IN

C

IN

V

BB

B

IN

B

IN

16
15
14
13
12
11
10

9

1
2
3
4
5
6
7
8

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–36 of the Motorola MECL Data

Book (DL122/D).

L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

MC10216

MOTOROLA MECL Data

DL122 — Rev 6

3–198

ELECTRICAL CHARACTERISTICS

Test Limits

Pin

Under

–30°C +25°C +85°C

Characteristic Symbol

Under

Test

Min Max Min Typ Max Min Max

Unit

Power Supply Drain Current I

E

8 27 20 25 27 mAdc

Input Current I

inH

4 180 115 115 µAdc

I

CBO

4
9

1.5

1.5

1.0

1.0

1.0

1.0

µAdc

Output Voltage Logic 1 V

OH

2
3

–1.060
–1.060

–0.890
–0.890

–0.960
–0.960

–0.810
–0.810

–0.890
–0.890

–0.700
–0.700

Vdc

Output Voltage Logic 0 V

OL

2
3

–1.890
–1.890

–1.675
–1.675

–1.850
–1.850

–1.650
–1.650

–1.825
–1.825

–1.615
–1.615

Vdc

Threshold Voltage Logic 1 V

OHA

2
3

–1.080
–1.080

–0.980
–0.980

–0.910
–0.910

Vdc

Threshold Voltage Logic 0 V

OLA

2
3

–1.655
–1.655

–1.630
–1.630

–1.595
–1.595

Vdc

Reference Voltage V

BB

11 –1.420 –1.280 –1.350 –1.230 –1.295 –1.150 Vdc
Switching Times (50Ω Load) ns
Propagation Delay t

4+2+

t

4–2–

t

4+3–

t

4–3+

2
2
3
3

1.0

1.0

1.0

1.0

2.6

2.6

2.6

2.6

1.0

1.0

1.0

1.0

1.8*

1.8*

1.8*

1.8*

2.5

2.5

2.5

2.5

1.0

1.0

1.0

1.0

2.8

2.8

2.8

2.8

Rise Time (20 to 80%) t

2+

t

3+

2
3

1.0

1.0

2.6

2.6

1.0

1.0

1.5

1.5

2.5

2.5

1.0

1.0

2.8

2.8

Fall Time (20 to 80%) t

2–

t

3–

2
3

1.0

1.0

2.6

2.6

1.0

1.0

1.5

1.5

2.5

2.5

1.0

1.0

2.8

2.8

* Delay is 1.5ns when inputs are driven differentially.

Delay is 1.8ns when inputs are driven single ended.

MC10216

3–199 MOTOROLAMECL Data

DL122 — Rev 6

ELECTRICAL CHARACTERISTICS (continued)

TEST VOLTAGE VALUES (Volts)

@ Test Temperature V

IHmaxVILminVIHAminVILAmax

V

BB

V

EE

–30°C –0.890 –1.890 –1.205 –1.500

From

–5.2

+25°C –0.810 –1.850 –1.105 –1.475

From

Pin

–5.2

+85°C –0.700 –1.825 –1.035 –1.440

11

–5.2

Pin

TEST VOLTAGE APPLIED TO PINS LISTED BELOW

Characteristic Symbol

Und

er

Test

V

IHmaxVILminVIHAminVILAmax

V

BB

V

EE

(VCC)

Gnd

Power Supply Drain Current I

E

8 4, 9, 12 5, 10, 13 8 1, 16

Input Current I

inH

4 4 9, 12 5, 10, 13 8 1, 16

I

CBO

4
9

9, 12
4, 12

5, 10, 13
5, 10, 13

8, 4
8, 9

1, 16

Output Voltage Logic 1 V

OH

2
3

4

9, 12

9, 12

4

5, 10, 13
5, 10, 13

8
8

1, 16
1, 16

Output Voltage Logic 0 V

OL

2
3

9, 12

4

4

9, 12

5, 10, 13
5, 10, 13

8
8

1, 16
1, 16

Threshold Voltage Logic 1 V

OHA

2
3

9, 12

9, 12 4

4

5, 10, 13
5, 10, 13

8
8

1, 16
1, 16

Threshold Voltage Logic 0 V

OLA

2
3

9, 12

9, 12

4

4 5, 10, 13

5, 10, 13

8
8

1, 16
1, 16

Reference Voltage V

BB

11 5, 10, 13 8 1, 16

Switching Times (50Ω Load) Pulse In

Pulse Out

–3.2 V +2.0 V

Propagation Delay t

4+2+

t

4–2–

t

4+3–

t

4–3+

2
2
3
3

4
4
4
4

2
2
3
3

5, 10, 13
5, 10, 13
5, 10, 13
5, 10, 13

8
8
8
8

1, 16
1, 16
1, 16
1, 16

Rise Time (20 to 80%) t

2+

t

3+

2
3

4
4

2
3

5, 10, 13
5, 10, 13

8
8

1, 16
1, 16

Fall Time (20 to 80%) t

2–

t

3–

2
3

4
4

2
3

5, 10, 13
5, 10, 13

8
8

1, 16
1, 16

Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.

MC10216

MOTOROLA MECL Data

DL122 — Rev 6

3–200

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

–M–

–N–

–L–

Y BRK

W

V

D

D

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

X

G1

B

U

Z

VIEW D–D

20 1

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

C

G

VIEW S

E

J

R

Z

A

0.004 (0.100)

–T–

SEATING
PLANE

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

H

VIEW S

K

K1

F

G1

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50

Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

____

MC10216

3–201 MOTOROLAMECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

916

K

PLANE

–T–

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

____

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620–10

ISSUE V

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

–A–

–B–

–T–

F

E

G

N

K

C

SEATING
PLANE

16 PLD

S

A

M

0.25 (0.010) T

16 PLJ

S

B

M

0.25 (0.010) T

M

L

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01

____

16 9

18

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MC10216/D

*MC10216/D*

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