Page 1
SEMICONDUCTOR TECHNICAL DATA
3–156
REV 5
Motorola, Inc. 1996
3/93
The MC10189 provides a high-speed Hex Inverter with a common
Enable input. The hex inverting function is provided when Enable is in the
low state. When Enable is in the high state all outputs are low.
PD= 200 mW typ/pkg (No Load)
tpd= 2.0 ns (Y-Q)
= 2.5 ns (X-Q)
LOGIC DIAGRAM
V
CC1
= PIN 1
V
CC2
= PIN 16
VEE= PIN 8
12
11
10
7
6
5
9
2
3
4
13
14
15
X
Y
OUT
TRUTH TABLE
Inputs Output
X Y OUT
L L H
L H L
H L L
H H L
DIP
PIN ASSIGNMENT
V
CC1
A
OUT
B
OUT
C
OUT
A
IN
B
IN
C
IN
V
EE
V
CC2
F
OUT
E
OUT
D
OUT
F
IN
E
IN
D
IN
COMMON
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–36 of the Motorola MECL Data
Book (DL122/D).
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Page 2
MC10189
3–157 MOTOROLAMECL Data
DL122 — Rev 6
ELECTRICAL CHARACTERISTICS
Test Limits
Pin
Under
–30°C +25°C +85°C
Characteristic Symbol
Under
Test
Min Max Min Max Min Max
Unit
Power Supply Drain Current I
E
8 44 40 44 mAdc
Input Current I
inH
5 425 265 265 µAdc
I
inL
9 890 555 555 µAdc
Output Voltage Logic 1 V
OH
2 –1.060 –0.890 –0.960 –0.810 –0.890 –0.700 Vdc
Output Voltage Logic 0 V
OL
2 –1.890 –1.675 –1.850 –1.650 –1.825 –1.615 Vdc
Threshold Voltage Logic 1 V
OHA
2 –1.080 –0.980 –0.910 Vdc
Threshold Voltage Logic 0 V
OLA
2 –1.655 –1.630 –1.595 Vdc
Switching Times (50Ω Load) ns
Propagation Delay Enable
Data
t
PHL
t
PLH
2
2
1.1
1.0
3.9
3.3
1.1
1.0
3.5
2.9
1.1
1.0
3.9
3.3
Rise/Fall Time (20 to 80%) t
TLH
t
THL
2 1.1 3.7 1.1 3.3 1.1 3.7
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
@ Test Temperature V
IHmax
V
ILmin
V
IHAminVILAmax
V
EE
–30°C –0.890 –1.890 –1.205 –1.500 –5.2
+25°C –0.810 –1.850 –1.105 –1.475 –5.2
+85°C –0.700 –1.825 –1.035 –1.440 –5.2
Pin
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
Characteristic Symbol
Und
er
Test
V
IHmax
V
ILmin
V
IHAminVILAmax
V
EE
(VCC)
Gnd
Power Supply Drain Current I
E
8 8 1, 16
Input Current I
inH
5 5 8 1, 16
I
inL
9 9 8 1, 16
Output Voltage Logic 1 V
OH
2 5 8 1, 16
Output Voltage Logic 0 V
OL
2 9 8 1, 16
Threshold Voltage Logic 1 V
OHA
2 5 8 1, 16
Threshold Voltage Logic 0 V
OLA
2 5 8 1, 16
Switching Times (50Ω Load) Pulse In Pulse Out –3.2 V +2.0 V
Propagation Delay Enable
Data
t
PHL
t
PLH
2
2
9
5
2
2
8
8
1, 16
1, 16
Rise/Fall Time (20 to 80%) t
TLH
t
THL
2 5 2 8 1, 16
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
Page 3
MC10189
MOTOROLA MECL Data
DL122 — Rev 6
3–158
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
Page 4
MC10189
3–159 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
____
16 9
18
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315
MFAX: RMF AX0@email.sps.mot.com – T OUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC10189/D
*MC10189/D*
◊
Loading...