Datasheet MC10176L Datasheet (Motorola)

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SEMICONDUCTOR TECHNICAL DATA

   

The MC10176 contains six high-speed, master slave type “D” flip-flops.
Clocking is common to all six flip-flops. Data is entered into the master when the
clock is low. Master to slave data transfer takes place on the positive-going
Clock transition. Thus, outputs may change only on a positive-going Clock
transition. A change in the information present at the data (D) input will not affect
the output information any other time due to the master-slave construction of
this device.

PD= 460 mW typ/pkg (No Load)

f

= 150 MHz (typ)

toggle

tr, tf= 2.0 ns typ (20%–80%)

LOGIC DIAGRAM

2 5

D0

6D1

7D2

10D3

11D4

Q0

3 Q1

4 Q2

13 Q3

14 Q4



CERAMIC PACKAGE

PLASTIC PACKAGE

DIP

PIN ASSIGNMENT

V

CC1

Q0
Q1
Q2
D0
D1
D2

V

EE

1
2
3
4
5
6
7
8

L SUFFIX

CASE 620–10

P SUFFIX

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

16
15
14
13
12
11
10

V
Q5
Q4
Q3
D5
D4
D3
CLOCK

9

CC2

CLOCK 9

3/93

 Motorola, Inc. 1996

12

D5

CLOCKED TRUTH TABLE

C D Q

L X Q
H* L L
H* H H

*A clock H is a clock transition
from a low to a high state.

3–131

n+1

n

15 Q5

V
V

= PIN 1

CC1

= PIN 16

CC2
VEE= PIN 8

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

REV 5

MC10176

Under

ELECTRICAL CHARACTERISTICS

Pin

Characteristic Symbol

Power Supply Drain Current I
Input Current I

Output Voltage Logic 1 V

Output Voltage Logic 0 V

Threshold Voltage Logic 1 V

Threshold Voltage Logic 0 V

Switching Times (50Ω Load)
Clock Input

Propagation Delay t

Rise Time (20 to 80%) t
Fall Time (20 to 80%) t

Setup Time t
Hold Time t
Toggle Frequency (Max) f

[

Output level to be measured after a clock pulse has been applied to the C Input (Pin 9)

E

inH

I

inL

OH

OL

OHA

OLA

9+2+

t

9+2–

2+
2–

setup

hold

tog

Under

Test

8 121 88 110 121 mAdc
5

9
5

9

2

[

15

[

2

[

15

[

2

[

15

[

2

[

15

[

2
2

2 1.0 4.1 1.1 4.0 1.1 4.4
2 1.0 4.1 1.1 4.0 1.1 4.4

2 2.5 2.5 2.5 ns
2 1.5 1.5 1.5 ns
2 125 125 150 125 MHz

–30°C +25°C +85°C

Min Max Min Typ Max Min Max

350
495

0.5

0.5

–1.060
–1.060

–1.890
–1.890

–1.080
–1.080

1.6

1.6

–0.890
–0.890

–1.675
–1.675

–1.655
–1.655

4.6

4.6

0.5

0.5

–0.960
–0.960

–1.850
–1.850

–0.980
–0.980

1.6

1.6

Test Limits

220
310

–0.810
–0.810

–1.650
–1.650

–1.630
–1.630

4.5

4.5

V

IHmax

V

ILmin

0.3

0.3

–0.890
–0.890

–1.825
–1.825

–0.910
–0.910

1.6

1.6

220
310

–0.700
–0.700

–1.615
–1.615

–1.595
–1.595

5.0

5.0

Unit

µAdc

µAdc

Vdc

Vdc

Vdc

Vdc

ns

MOTOROLA MECL Data

3–132

DL122 — Rev 6

MC10176

Und

(VCC)

ELECTRICAL CHARACTERISTICS (continued)

TEST VOLTAGE VALUES (Volts)

@ Test Temperature V

–30°C –0.890 –1.890 –1.205 –1.500 –5.2
+25°C –0.810 –1.850 –1.105 –1.475 –5.2
+85°C –0.700 –1.825 –1.035 –1.440 –5.2

Pin

Characteristic Symbol

Power Supply Drain Current I
Input Current I

Output Voltage Logic 1 V

Output Voltage Logic 0 V

Threshold Voltage Logic 1 V

Threshold Voltage Logic 0 V

Switching Times (50Ω Load) +1.11Vdc +0.31V Pulse In Pulse Out –3.2 V +2.0 V
Clock Input

Rise Time (20 to 80%) t
Fall Time (20 to 80%) t

Setup Time t
Hold Time t
Toggle Frequency (Max) f

[

Output level to be measured after a clock pulse has been applied to the C Input (Pin 9)

Propagation Delay

E

inH

I

inL

OH

OL

OHA

OLA

t

9+2+

t

9+2–

2+
2–

setup

hold

tog

er

Test

8 8 1, 16
5

9
5

9

2

[

15

[

2

[

15

[

2

[

15

[

2

[

15

[

2
2

2 5, 9 2 8 1, 16
2 5, 9 2 8 1, 16

2 5, 9 2 8 1, 16
2 5, 9 2 8 1, 16
2 8 1, 16

IHmax

TEST VOLTAGE APPLIED TO PINS LISTED BELOW

V

IHmax

5
9

5

12

V

ILmin

V

ILmin

12

V

IHAminVILAmax

V

IHAminVILAmax

5
9

5

5

12

5

12

5, 9
5, 9

V

IHmax

V

ILmin

2
2

V

EE

V

EE

8
8

8
8

8
8

8
8

8
8

8
8

8
8

Gnd

1, 16
1, 16

1, 16
1, 16

1, 16
1, 16

1, 16
1, 16

1, 16
1, 16

1, 16
1, 16

1, 16
1, 16

Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.

3–133 MOTOROLAMECL Data

DL122 — Rev 6

MC10176

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

–T–

J

VIEW S

S

S

D

D

M

M

SEATING
PLANE

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

Z

0.010 (0.250) N

X

G1

S

S

L–M

T

S

VIEW D–D

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

MOTOROLA MECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

3–134

MILLIMETERSINCHES

DL122 — Rev 6

OUTLINE DIMENSIONS

CERAMIC DIP PACKAGE

–A–

16 9

–B–

18

C

–T–

SEATING
PLANE

E

F

G

16 PLD

0.25 (0.010) T

M

–A–

916

B

18

F

C

S

H

G

D

16 PL

0.25 (0.010) T

K

M

K

N

S

A

PLASTIC DIP PACKAGE

SEATING

–T–

PLANE

M

A

L SUFFIX

CASE 620–10

ISSUE V

L

M

16 PLJ

0.25 (0.010) T

P SUFFIX

CASE 648–08

ISSUE R

L

J

MC10176

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

DIM MIN MAX MIN MAX

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31

M

S

B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

M

L 0.300 BSC 7.62 BSC
M 0 15 0 15

____

N 0.020 0.040 0.51 1.01

Y14.5M, 1982.

FORMED PARALLEL.

DIM MIN MAX MIN MAX

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

MILLIMETERSINCHES

MILLIMETERSINCHES

____

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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Opportunity/Affirmative Action Employer.

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MC10176/D

DL122 — Rev 6

◊

3–135 MOTOROLAMECL Data

*MC10176/D*