Datasheet MC10159FNR2 Datasheet (MOTOROLA)

Page 1
LOGIC DIAGRAM
VCC= PIN 16 VEE= PIN 8
SELECT
D01 5
D00 6
D11 3
D10 4
D21 12
D20 13
D31 10
D30 11
1 Q0
2 Q1
15 Q2
14 Q3
ENABLE

SEMICONDUCTOR TECHNICAL DATA
3–65
REV 5
Motorola, Inc. 1996
3/93
  

The MC10159 is a quad two channel multiplexer with enable. It incorporates common enable and common data select inputs. The select input determines which data inputs are enabled. A high (H) level enables data inputs D00, D10, D20, and D30. A low (L) level enables data inputs D01, D11, D21, and D31. Any change on the data inputs will be reflected at the outputs while the enable is low. Input levels are inverted at the output.
PD= 218 mW typ/pkg (No Load) tpd= 2.5 ns typ (Data to Q)
3.2 ns typ (Select to Q)
tr, tf= 2.5 ns typ (20%–80%)
TRUTH TABLE
Enable Select D0 D1 Q
L L X L H L L X H L L H L X H L H H X L H X X X L

DIP
PIN ASSIGNMENT
Q0
Q1 D11 D10 D01 D00
ENABLE
V
EE
V
CC
Q2 Q3 D20 D21 D30 D31 SELECT
16 15 14 13 12 11 10
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Page 2
MC10159
MOTOROLA MECL Data
DL122 — Rev 6
3–66
ELECTRICAL CHARACTERISTICS
Test Limits
Pin
Under
–30°C +25°C +85°C
Characteristic Symbol
Under
Test
Min Max Min Typ Max Min Max
Unit
Power Supply Drain Current I
E
8 58 42 53 58 mAdc
Input Current I
inH
9 5
360 400
225 250
225 250
µAdc
I
inL
5 0.5 0.5 0.3 µAdc
Output Voltage Logic 1 V
OH
1 –1.060 –0.890 –0.960 –0.810 –0.890 –0.700 Vdc
Output Voltage Logic 0 V
OL
1 –1.890 –1.675 –1.850 –1.650 –1.825 –1.615 Vdc
Threshold Voltage Logic 1 V
OHA
1 –1.080 –0.980 –0.910 Vdc
Threshold Voltage Logic 0 V
OLA
1 –1.655 –1.630 –1.595 Vdc Switching Times (50 Load) ns Propagation Data Input
Delay Select Input
Enable Input
t
5+1–
t
9+1–
t
7+1–
1
1
1
1.1
1.5
1.4
3.8
5.3
5.3
1.2
1.5
1.5
2.5
3.2
2.5
3.3
5.0
5.0
1.1
1.5
1.4
3.8
5.3
5.3
Rise Time (20 to 80%) t
1+
1 1.0 3.7 1.1 2.5 3.5 1.0 3.7 Fall Time (20 to 80%) t
1–
1 1.0 3.7 1.1 2.5 3.5 1.0 3.7
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
@ Test Temperature V
IHmax
V
ILmin
V
IHAminVILAmax
V
EE
–30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2
Pin
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
Characteristic Symbol
Und
er
Test
V
IHmax
V
ILmin
V
IHAminVILAmax
V
EE
(VCC)
Gnd
Power Supply Drain Current I
E
8 8 16
Input Current I
inH
9 5
9 5
8 8
16 16
I
inL
5 5 8 16
Output Voltage Logic 1 V
OH
1 8 16
Output Voltage Logic 0 V
OL
1 5 8 16
Threshold Voltage Logic 1 V
OHA
1 9 6 8 16
Threshold Voltage Logic 0 V
OLA
1 9 6 8 16 Switching Times (50 Load) +1.11V +0.31V Pulse In Pulse Out –3.2 V +2.0 V Propagation Delay Data Input
Select Input
Enable Input
t
5+1–
t
9+1–
t
7+1–
1
1
1
6
3, 12
16 16
Rise Time (20 to 80%) t
1+
1 9 5 1 8 16 Fall Time (20 to 80%) t
1–
1 9 5 1 8 16
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner.
Page 3
MC10159
3–67 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
R
Z
A
0.004 (0.100)
–T–
SEATING PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50
Z 2 10 2 10 G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
____
Page 4
MC10159
MOTOROLA MECL Data
DL122 — Rev 6
3–68
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
____
16 9
18
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MC10159/D
*MC10159/D*
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