Datasheet MC10123P, MC10123FN, MC10123L Datasheet (Motorola)

Page 1

SEMICONDUCTOR TECHNICAL DATA
   
The MC10123 consists of three NOR gates designed for bus driving applications on card or between cards. Output low logic levels are specified with VOL = –2.1 Vdc so that the bus may be terminated to –2.0 Vdc. The gate output, when low, appears as a high impedance to the bus, because the output emitter– followers of the MC10123 are “turned–off.” This eliminates discontinuities in the characteristic impedance of the bus.
The VOH level is specified when driving a 25–ohm load terminated to –2.0 Vdc, the equivalent of a 50–ohm bus terminated at both ends. Although 25 ohms is the lowest characteristic impedance that can be driven by the MC10123, higher impedance values may be used with this part. A typical 50–ohm bus is shown in Figure 1.
PD= 310 mW typ/pkg (No Load) tpd= 3.0 ns typ
tr, tf= 2.5 ns typ (20%–80%)
LOGIC DIAGRAM
4
10 11
12 13 14
5 6
7 9
V
= PIN 1
CC1
V
= PIN 16
CC2 VEE= PIN 8
3
2
15
FIGURE 1 — 50–OHM BUS DRIVER (TYPICAL APPLICATION)
1/3 MC10123 1/3 MC10123
ZO = 50
1/3 MC10123

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
DIP
PIN ASSIGNMENT
V
CC1
B
OUT
A
OUT
A
IN
A
IN
A
IN
A
IN
V
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
1 2 3 4 5 6 7 8
Book (DL122/D).
16 15 14 13 12 11 10
V
CC2
C
OUT
C
IN
C
IN
C
IN
B
IN
B
IN
B
9
IN
50
–2.0 VDC
3/93
Motorola, Inc. 1996
RECEIVERS (MECL GATES)
3–78
–2.0
VDC
50
REV 5
Page 2
MC10123
Under
Und
(VCC)
ELECTRICAL CHARACTERISTICS
Test Limits
Pin
Characteristic Symbol
Power Supply Drain Current I Input Current I
Output Voltage Logic 1 V Output Voltage Logic 0 V Threshold Voltage Logic 1 V Threshold Voltage Logic 0 V Switching Times (50 Load) ns Propagation Delay t
Rise Time (20 to 80%) t Fall Time (20 to 80%) t
inH
I
inL
OH
OL
OHA
OLA
4+3–
t
4–3+
3+ 3–
E
Under
Test
8 82 71 75 82 mAdc 4 350 220 220 µAdc 4 0.5 µAdc 3 –1.060 –0.890 –0.960 –0.810 –0.890 –0.700 Vdc 3 –2.100 –2.030 –2.100 –2.030 –2.100 –2.030 Vdc 3 –1.080 –0.980 –0.910 Vdc 3 –2.100 –2.100 –2.100 Vdc
3 3
3 1.0 3.7 1.0 2.5 3.5 1.0 3.9 3 1.0 3.7 1.0 2.5 3.5 1.0 3.9
ELECTRICAL CHARACTERISTICS (continued)
@ Test Temperature V
Characteristic Symbol
Power Supply Drain Current I
Input Current I
Output Voltage Logic 1 V Output Voltage Logic 0 V
Threshold Voltage Logic 1 V Threshold Voltage Logic 0 V Switching Times (50 Load) Pulse In Pulse Out –3.2 V +2.0 V Propagation Delay t
Rise Time (20 to 80%) t Fall Time (20 to 80%) t
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50-ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner.
inH
I
inL
OH
OL
OHA OLA
4+3–
t
4–3+
3+ 3–
E
–30°C +25°C +85°C
Min Max Min Typ Max Min Max
1.2
1.2
–30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2
Pin
er
Test
8 4,5,6,7,9
4 4 8 1, 16 4 4 8 1, 16 3 8 1, 16 3 4,5,6,7
3 4,5,6,7 8 1, 16 3 9,12 4,5,6,7 8 1, 16
3 3
3 4 3 8 1, 16 3 4 3 8 1, 16
4.6
4.6
IHmax
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
V
IHmax
10,11,12
13,14
9,12
1.2
1.2
TEST VOLTAGE VALUES (Volts) V
ILmin
V
ILmin
3.0
3.0
V
IHAminVILAmax
V
IHAminVILAmax
4.4
4.4
4 4
3 3
1.2
1.2
4.8
4.8
V
EE
V
EE
8 1, 16
8 1, 16
8 8
Unit
Gnd
1, 16 1, 16
DL122 — Rev 6
3–79 MOTOROLAMECL Data
Page 3
MC10123
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
MOTOROLA MECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
3–80
MILLIMETERSINCHES
DL122 — Rev 6
Page 4
OUTLINE DIMENSIONS
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
–T–
SEATING PLANE
E
F
G
16 PLD
0.25 (0.010) T
M
–A–
916
B
18
F
C
S
H
G
D
16 PL
K
0.25 (0.010) T
K
N
S
A
PLASTIC DIP PACKAGE
SEATING
–T–
PLANE
M
M
A
L SUFFIX
CASE 620–10
ISSUE V
L
M
16 PLJ
0.25 (0.010) T
P SUFFIX
CASE 648–08
ISSUE R
L
J
MC10123
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31
M
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
M
L 0.300 BSC 7.62 BSC M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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MC10123/D
3–81 MOTOROLAMECL Data
DL122 — Rev 6
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