Datasheet MC10115P, MC10115FNR2, MC10115L, MC10115FN Datasheet (Motorola)

Page 1

SEMICONDUCTOR TECHNICAL DATA
  
The MC10115 is a quad differential amplifier designed for use in sensing differential signals over long lines. The base bias supply (VBB) is made available at pin 9 to make the device useful as a Schmitt trigger, or in other applications where a stable reference voltage is necessary.
Active current sources provide the MC10115 with excellent common mode noise rejection. If any amplifier in a package is not used, one input of that amplifier must be connected to VBB (pin 9) to prevent upsetting the current source bias network.
PD= 1 10 mW typ/pkg (No Load) tpd= 2.0 ns typ
tr, tf= 2.0 ns typ (20%–80%)
LOGIC DIAGRAM

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
4 5
7 6
10 11
13 12
VBB*
V
= PIN 1
CC1
V
= PIN 16
CC2
VEE= PIN 8
*VBB to be used to supply bias to the MC10115 only and bypassed (when used)
with 0.01 µF to 0.1 µF capacitor to ground (0 V). VBB can source < 1.0 mA.
When the input pin with the bubble goes positive, the output goes negative.
2
3
14
15 9
DIP
PIN ASSIGNMENT
V
CC1
A
OUT
B
OUT
A
IN
A
IN
B
IN
B
IN
V
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
1 2 3 4 5 6 7 8
Book (DL122/D).
16 15 14 13 12 11 10
V
CC2
D
OUT
C
OUT
D
IN
D
IN
C
IN
C
IN
VBB
9
3/93
Motorola, Inc. 1996
3–59
REV 5
Page 2
MC10115
Under
From
Und
(VCC)
ELECTRICAL CHARACTERISTICS
Test Limits
Pin
Characteristic Symbol
Power Supply Drain Current I Input Current I
Output Voltage Logic 1 V Output Voltage Logic 0 V Threshold Voltage Logic 1 V Threshold Voltage Logic 0 V Reference Voltage V Switching Times (50 Load) ns Propagation Delay t
Rise Time (20 to 80%) t Fall Time (20 to 80%) t
inH
I
CBO
OH
OL
OHA
OLA
BB
4–2+
t
4+2–
2+ 2–
E
Under
Test
8 29 26 29 mAdc 4 150 95 95 µAdc 4 1.5 1.0 1.0 µAdc 2 –1.060 –0.890 –0.960 –0.810 –0.890 –0.700 Vdc 2 –1.890 –1.675 –1.850 –1.650 –1.825 –1.615 Vdc 2 –1.080 –0.980 –0.910 Vdc 2 –1.655 –1.630 –1.595 Vdc 9 1.420 1.280 –1.350 –1.230 1.295 –1.150 Vdc
2 2
2 1.1 3.6 1.1 3.3 1.1 3.7 2 1.1 3.6 1.1 3.3 1.1 3.7
–30°C +25°C +85°C
Min Max Min Typ Max Min Max
1.0
1.0
3.1
3.1
1.0
1.0
2.9
2.9
1.0
1.0
3.3
3.3
Unit
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
@ Test Temperature V
–30°C –0.890 –1.890 –1.205 –1.500 +25°C –0.810 –1.850 –1.105 –1.475 +85°C –0.700 –1.825 –1.035 –1.440
Pin
Characteristic Symbol
Power Supply Drain Current I Input Current I
Output Voltage Logic 1 V Output Voltage Logic 0 V Threshold Voltage Logic 1 V Threshold Voltage Logic 0 V Reference Voltage V Switching Times (50 Load) Pulse In Pulse Out –3.2 V +2.0 V Propagation Delay t
Rise Time (20 to 80%) t Fall Time (20 to 80%) t
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50-ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner.
inH
I
CBO
OH
OL
OHA
OLA
BB
4–2+
t
4+2–
2+ 2–
E
Test
IHmaxVILmin
er
8 4,7,10,13 5,6,1 1,12 8 1, 16 4 4 7,10,13 5,6,1 1,12 8 1, 16 4 7,10,13 5,6,11,12 8,4 1, 16 2 7,10,13 4 5,6,1 1,12 8 1, 16 2 4 7,10,13 5,6,1 1,12 8 1, 16 2 7,10,13 4 5,6,11,12 8 1, 16 2 7,10,13 4 5,6,11,12 8 1, 16 9 5,6,1 1,12 8 1, 16
2 2
2 4 2 5,6,1 1,12 8 1, 16 2 4 2 5,6,1 1,12 8 1, 16
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
V
IHmaxVILmin
4 4
V
IHAminVILAmax
V
IHAminVILAmax
2 2
V
BB
From
Pin
9
V
BB
5,6,1 1,12 5,6,1 1,12
V
EE
–5.2 –5.2 –5.2
V
EE
8 8
Gnd
1, 16 1, 16
MOTOROLA MECL Data
3–60
DL122 — Rev 6
Page 3
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
MC10115
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
–T–
J
VIEW S
S
S
D
D
M
M
SEATING PLANE
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
Z
0.010 (0.250) N
X
G1
S
S
L–M
T
S
VIEW D–D
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
DL122 — Rev 6
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
3–61 MOTOROLAMECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES
Page 4
MC10115
–T–
SEATING PLANE
18
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
N
E
F
G
16 PLD
0.25 (0.010) T
M
S
A
–A–
916
B
F
C
S
–T–
H
G
D
16 PL
0.25 (0.010) T
K
M
A
CASE 620–10
ISSUE V
L
K
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
SEATING PLANE
J
M
M
16 PLJ
0.25 (0.010) T
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31
M
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
M
L 0.300 BSC 7.62 BSC M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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MOTOROLA MECL Data
3–62
*MC10115/D*
MC10115/D
DL122 — Rev 6
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