Datasheet MC100LVE222FA, MC100LVE222FAR2 Datasheet (MOTOROLA)

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MC100LVE222
Low V oltage 1:15 Differential÷1/÷2 ECL/PECL Clock Driver
The MC100LVE222 is a low skew 1:15 differential ÷1/÷2 ECL
fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be differential or used single–ended (with VBB output reference bypassed and connected to the unused input of a pair). Either of two fully differential clock inputs may be selected. Each of the four output banks of 2, 3, 4, and 6 differential pairs may be independently configured to fanout 1X or 1/2X of the input frequency. The LVE222 specifically guarantees low output to output skew. Optimal design, layout, and processing minimize skew within a device and from lot to lot.
The fsel pins and CLK_Sel pin are asynchronous control inputs. Any changes may cause indeterminate output states requiring a MR pulse to resynchronize any 1/2X outputs.
To ensure that the tight skew specification is realized, both sides of any differential output pair need to be terminated identically even if only one side is being used. When fewer than all fifteen pairs are used, identically terminate all the output pairs on the same package side whether used or unused. If no outputs on a side are used, then leave all these outputs open (unterminated). This will maintain minimum output skew. Failure to do this will result in a 10–20ps loss of skew margin (propagation delay) in the output(s) in use.
The MC100LVE222, as with most ECL devices, can be operated from a positive VCC supply in PECL mode. This allows the L VE222 to be used for high performance clock distribution in +3.3V systems. Designers can take advantage of the LVE222’s performance to distribute low skew clocks across the backplane or the board. In a PECL environment series or Thevenin line, terminations are typically used as they require no additional power supplies. All power supply pins must be connected. For more information on using PECL, designers should refer to Application Note AN1406/D. For a SPICE model, see Application Note AN1560/D.
200ps Part–to–Part Skew
50ps Output–to–Output Skew
Selectable 1x or 1/2x Frequency Outputs
Extended Power Supply Range of –3.0V to –5.25V (+3.0V to
+5.25V)
52–Lead TQFP Packaging
ESD > 2000V
Moisture Sensitivity Level 2,
For Additional Information, See Application Note AND8003/D
Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
Transistor Count = 684 devices
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TQFP
FA SUFFIX
CASE 848D
MARKING DIAGRAM*
MC100L VE
222
AWLYYWW
32
1
*For additional information, see Application Note AND8002/D
ORDERING INFORMATION
Device Package Shipping
MC100L VE222FA TQFP 800 Units/Tray
MC100L VE222FAR2 TQFP 1500 Tape & Reel
A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week
Semiconductor Components Industries, LLC, 1999
February , 2000 – Rev. 2
1 Publication Order Number:
MC100L VE222/D
Page 2
VCCO
MC100LVE222
Pinout: 52–Lead TQFP (Top View)
VCCO
Qc0
Qc0
Qc1
Qc1
Qc2
Qc2
Qc3
Qc3
VCCONCNC
39 38 37 36 35 34 33 32 31 30 29 28 27
40
VCCO
26
Qd0 Qb2 Qb2 Qb1 Qb1 Qb0 Qb0
VCCO
Qa1 Qa1 Qa0 Qa0
VCCO
41 42 43 44 45 46 47 48 49 50 51 52
12345678910111213
MR
VCC
fsela
MC100LVE222
fselb
CLK0
CLK0
CLK_Sel
CLK1
CLK1
VBB
fselc
fseld
VEE
25 24 23 22 21 20 19 18 17 16 15 14
Qd0
Qd1
Qd1
Qd2
Qd2
Qd3
Qd3
Qd4
Qd4
Qd5
Qd5
VCCO
MR
CLK0 CLK0 CLK1 CLK1
CLK_Sel
V
BB
fsela
fselb
fselc
fseld
LOGIC SYMBOL
÷1
÷2
2
Qa0:1 Qa0:1
FUNCTION TABLE
3
4
6
Qb0:2 Qb0:2
Qc0:3 Qc0:3
Qd0:5 Qd0:5
Input
MR CLK_Sel fseln
Function
01
Active
CLK0
÷1
Reset CLK1
÷2
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MC100LVE222
CLK
RESET
Q
Figure 1. Timing Diagram
MAXIMUM RATINGS*
Symbol Parameter Value Unit
V
EE
V
I
I
out
T
A
* Maximum Ratings are those values beyond which damage to the device may occur.
ECL DC CHARACTERISTICS
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V V V V V
V
I
IH
I
IL
I
EE
Output HIGH Voltage –1.085 –1.005 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 V
OH
Output LOW Voltage –1.830 –1.695 –1.555 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 V
OL
Input HIGH Voltage –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 V
IH
Input LOW Voltage –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 V
IL
Output Reference
BB
Voltage Power Supply Volt-
EE
age Input HIGH Current 150 150 150 150 µA Input CLK0, CLK1
LOW Current Others Power Supply Cur-
rent
Power Supply (VCC = 0V) –8.0 to 0 VDC Input Voltage (VCC = 0V) 0 to –6.0 VDC Output Current Continuous
Surge
50
100
mA
Operating Temperature Range –40 to +85 °C
–40°C 0°C 25°C 70°C
–1.38 –1.26 –1.38 –1.26 –1.38 –1.26 –1.38 –1.26 V
–3.0 –5.25 –3.0 –5.25 –3.0 –5.25 –3.0 –5.25 V
–300
0.5 122 136 122 136 122 136 125 139 mA
–300
0.5
–300
0.5
–300
0.5
µA
PECL DC CHARACTERISTICS
–40°C 0°C 25°C 70°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V V V V V
V I
IH
I
IL
I
EE
Output HIGH Voltage1.2.215 2.295 2.420 2.275 2.345 2.420 2.275 2.345 2.420 2.275 2.345 2.420 V
OH
Output LOW Voltage1.1.470 1.605 1.745 1.490 1.595 1.680 1.490 1.595 1.680 1.490 1.595 1.680 V
OL
Input HIGH Voltage
IH
Input LOW Voltage
IL
Output Reference
BB
CC
1.
Voltage Power Supply Voltage 3.0 5.25 3.0 5.25 3.0 5.25 3.0 5.25 V Input HIGH Current 150 150 150 150 µA Input CLK0, CLK1
LOW Current Others Power Supply Current 122 136 122 136 122 136 125 139 mA
1.
2.135 2.420 2.135 2.420 2.135 2.420 2.135 2.420 V
1.
1.490 1.825 1.490 1.825 1.490 1.825 1.490 1.825 V
1.92 2.04 1.92 2.04 1.92 2.04 1.92 2.04 V
–300
0.5
–300
0.5
–300
0.5
–300
0.5
1. These values are for VCC = 3.3V. Level Specifications will vary 1:1 with VCC.
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3
µA
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MC100LVE222
ECL AC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = V
–40°C 0°C 25°C 70°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Condition
t
PLH
t
PHL
t
skew
V V
tr/t
Propagation Delay to Out­put
Within–Device Skew Part–to–Part Skew (Diff)
Minimum Input Swing 400 400 400 400 mV Note 4.
PP
Common Mode Range
CMR
Output Rise/Fall Time 200 600 200 600 200 600 200 600 ps 20%–80%
f
IN (differential)
IN (single–ended)
VPP < 500mV
VPP 500mV V
MR
1040
990
1100
V
EE
+1.3
EE
+1.6
1140 1140 1250
1240 1290 1400
50
200
–0.4 V
–0.4 V
1060 1010 1130
EE
+1.2
EE
+1.5
1160 1160 1280
1260 1310 1430
50
200
–0.4 V
–0.4 V
1080 1030
1170
EE
+1.2
EE
+1.5
CCO
1180 1180 1320
= GND)
1280 1330 1470
50
200
–0.4 V
–0.4 V
1120 1070 1220
EE
+1.2
EE
+1.5
1220 1220 1370
1320 1370 1520
50
200
–0.4
–0.4
ps
Note 1. Note 2.
ps Note 3.
V Note 5.
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals.
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited for the LVE222. A differential input as low as 50 mV will still produce full ECL levels at the output.
5. V
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The V
CMR
level must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
IL
PECL AC CHARACTERISTICS (VEE = GND; VCC = V
–40°C 0°C 25°C 70°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Condition
t
PLH
t
PHL
t
skew
V V
tr/t
Propagation Delay to Out­put
Within–Device Skew Part–to–Part Skew (Diff)
Minimum Input Swing 400 400 400 400 mV Note 4.
PP
Common Mode Range
CMR
Output Rise/Fall Time 200 600 200 600 200 600 200 600 ps 20%–80%
f
IN (differential)
IN (single–ended)
VPP < 500mV
VPP 500mV 1.6 V
1040
1100
MR
1140
990
1140 1250
1.3 V
1240 1290 1400
50
200
CC
–0.4
CC
–0.4
1060 1010 1130
1.2 V
1.5 V
= VCC (min) to VCC (max))
CCO
1160
1260
1080 1160 1280
1310 1430
50
200
CC
–0.4
CC
–0.4
1180
1030
1180
1170
1320
1.2 V
1.5 V
1280 1330 1470
50
200
CC
–0.4
CC
–0.4
1120
1220
1070
1220
1220
1370
1.2 V
1.5 V
1320 1370 1520
50
200
CC
–0.4
CC
–0.4
ps
Note 1. Note 2.
ps Note 3.
V Note 5.
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals.
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited for the LVE222. A differential input as low as 50 mV will still produce full ECL levels at the output.
5. V
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The V
CMR
level must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
IL
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MC100LVE222
P ACKAGE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 848D–03
ISSUE C
4X
N0.20 (0.008) H L–M N0.20 (0.008) T L–M
1
4X TIPS
C
L
AB
4052
39
AB
–X–
X=L, M, N
G
–L–
–H–
–T–
SEATING PLANE
3X VIEW Y
–M–
B V
B1
V1
13
14
A1
–N–
27
26
S1
A S
C
4X θ2
0.10 (0.004) T
4X θ3
VIEW AA
0.05 (0.002)
S
W
2 X R R1
PLATING
0.13 (0.005) N
ROTATED 90_ CLOCKWISE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46 (0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07 (0.003).
θ1
C2
C1
K E
0.25 (0.010)
θ
GAGE PLANE
Z
VIEW AA
VIEW Y
F
J
BASE METAL
U
D
M
S
L–M
T
SECTION AB–AB
MILLIMETERS
DIMAMIN MAX MIN MAX
10.00 BSC 0.394 BSC
A1 5.00 BSC 0.197 BSC
B 10.00 BSC 0.394 BSC
B1 5.00 BSC 0.197 BSC
C ––– 1.70 ––– 0.067 C1 0.05 0.20 0.002 0.008 C2 1.30 1.50 0.051 0.059
D 0.20 0.40 0.008 0.016
E 0.45 0.030
F 0.22 0.35 0.009 0.014
G 0.65 BSC
J 0.07 0.20 0.003 0.008
K 0.50 REF 0.020 REF R1 0.08 0.20 0.003 0.008
S 12.00 BSC 0.472 BSC S1 6.00 BSC 0.236 BSC
U 0.09 0.16 0.004 0.006
V 12.00 BSC 0.472 BSC V1 6.00 BSC 0.236 BSC W 0.20 REF 0.008 REF
Z 1.00 REF 0.039 REF
θ
0
__
θ1
0
_
12
θ2
θ3
REF
5
___
INCHES
0.75 0.018
0.026 BSC
0
7
__
––– –––
0
_
12
REF
_
5
13
13
_
S
7
_
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Notes
MC100LVE222
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Notes
MC100LVE222
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MC100LVE222
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MC100L VE222/D
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