The MC100LVE222 is a low skew 1:15 differential ÷1/÷2 ECL
fanout buffer designed with clock distribution in mind. The
LVECL/LVPECL input signal pairs can be differential or used
single–ended (with VBB output reference bypassed and connected to
the unused input of a pair). Either of two fully differential clock inputs
may be selected. Each of the four output banks of 2, 3, 4, and 6
differential pairs may be independently configured to fanout 1X or
1/2X of the input frequency. The LVE222 specifically guarantees low
output to output skew. Optimal design, layout, and processing
minimize skew within a device and from lot to lot.
The fsel pins and CLK_Sel pin are asynchronous control inputs.
Any changes may cause indeterminate output states requiring a MR
pulse to resynchronize any 1/2X outputs.
To ensure that the tight skew specification is realized, both sides of
any differential output pair need to be terminated identically even if
only one side is being used. When fewer than all fifteen pairs are used,
identically terminate all the output pairs on the same package side
whether used or unused. If no outputs on a side are used, then leave all
these outputs open (unterminated). This will maintain minimum
output skew. Failure to do this will result in a 10–20ps loss of skew
margin (propagation delay) in the output(s) in use.
The MC100LVE222, as with most ECL devices, can be operated
from a positive VCC supply in PECL mode. This allows the L VE222 to
be used for high performance clock distribution in +3.3V systems.
Designers can take advantage of the LVE222’s performance to
distribute low skew clocks across the backplane or the board. In a
PECL environment series or Thevenin line, terminations are typically
used as they require no additional power supplies. All power supply
pins must be connected. For more information on using PECL,
designers should refer to Application Note AN1406/D. For a SPICE
model, see Application Note AN1560/D.
• 200ps Part–to–Part Skew
• 50ps Output–to–Output Skew
• Selectable 1x or 1/2x Frequency Outputs
• Extended Power Supply Range of –3.0V to –5.25V (+3.0V to
+5.25V)
• 52–Lead TQFP Packaging
• ESD > 2000V
• Moisture Sensitivity Level 2,
For Additional Information, See Application Note AND8003/D
• Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
• Transistor Count = 684 devices
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TQFP
FA SUFFIX
CASE 848D
MARKING DIAGRAM*
MC100L VE
222
AWLYYWW
32
1
*For additional information, see Application Note
AND8002/D
ORDERING INFORMATION
DevicePackageShipping
MC100L VE222FATQFP800 Units/Tray
MC100L VE222FAR2TQFP1500 Tape & Reel
A= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
Semiconductor Components Industries, LLC, 1999
February , 2000 – Rev. 2
1Publication Order Number:
MC100L VE222/D
Page 2
VCCO
MC100LVE222
Pinout: 52–Lead TQFP (Top View)
VCCO
Qc0
Qc0
Qc1
Qc1
Qc2
Qc2
Qc3
Qc3
VCCONCNC
39383736353433323130292827
40
VCCO
26
Qd0
Qb2
Qb2
Qb1
Qb1
Qb0
Qb0
VCCO
Qa1
Qa1
Qa0
Qa0
VCCO
41
42
43
44
45
46
47
48
49
50
51
52
12345678910111213
MR
VCC
fsela
MC100LVE222
fselb
CLK0
CLK0
CLK_Sel
CLK1
CLK1
VBB
fselc
fseld
VEE
25
24
23
22
21
20
19
18
17
16
15
14
Qd0
Qd1
Qd1
Qd2
Qd2
Qd3
Qd3
Qd4
Qd4
Qd5
Qd5
VCCO
MR
CLK0
CLK0
CLK1
CLK1
CLK_Sel
V
BB
fsela
fselb
fselc
fseld
LOGIC SYMBOL
÷1
÷2
2
Qa0:1
Qa0:1
FUNCTION TABLE
3
4
6
Qb0:2
Qb0:2
Qc0:3
Qc0:3
Qd0:5
Qd0:5
Input
MR
CLK_Sel
fseln
Function
01
Active
CLK0
÷1
Reset
CLK1
÷2
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2
Page 3
MC100LVE222
CLK
RESET
Q
Figure 1. Timing Diagram
MAXIMUM RATINGS*
SymbolParameterValueUnit
V
EE
V
I
I
out
T
A
* Maximum Ratings are those values beyond which damage to the device may occur.
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the
differential output signals.
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited
for the LVE222. A differential input as low as 50 mV will still produce full ECL levels at the output.
5. V
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The V
CMR
level must be such that the peak to peakvoltage is less than 1.0 V and greater than or equal to VPP(min).
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the
differential output signals.
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited
for the LVE222. A differential input as low as 50 mV will still produce full ECL levels at the output.
5. V
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The V
CMR
level must be such that the peak to peakvoltage is less than 1.0 V and greater than or equal to VPP(min).
IL
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Page 5
MC100LVE222
P ACKAGE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 848D–03
ISSUE C
4X
N0.20 (0.008) H L–MN0.20 (0.008) T L–M
1
4X TIPS
C
L
AB
4052
39
AB
–X–
X=L, M, N
G
–L–
–H–
–T–
SEATING
PLANE
3X VIEW Y
–M–
BV
B1
V1
13
14
A1
–N–
27
26
S1
A
S
C
4Xθ2
0.10 (0.004) T
4Xθ3
VIEW AA
0.05 (0.002)
S
W
2 X R R1
PLATING
0.13 (0.005)N
ROTATED 90_ CLOCKWISE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE
DETERMINED AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability ,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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MC100L VE222/D
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