Datasheet MC100LVE222 Datasheet (Motorola)

Page 1

SEMICONDUCTOR TECHNICAL DATA
   
÷÷
ECL fanout buffer designed with clock distribution in mind. The device features fully differential clock paths to minimize both device and system skew. The LVE222 can be used as a simple fanout buffer or outputs can be configured to provide half frequency outputs. The combination of 1x and 1/2x frequencies is flexible providing for a myriad of combinations. All timing differences between the 1x and 1/2x signals are compensated for internal to the chip so that the output–to–output skew is identical regardless of what output frequencies are selected.
  
The MC100LVE222 is a low voltage, low skew 1:15 differential ÷1/÷2
Fifteen Differential Outputs
200ps Part–to–Part Skew
50ps Output–to–Output Skew
Selectable 1x or 1/2x Frequency Outputs
Extended Power Supply Range of –3.0V to –5.25V (+3.0V to +5.25V)
52–Lead TQFP Packaging
ESD > 2000V
The fsel and CLK_Sel input pins are asynchronous control signals. As a result, changing these inputs could cause indeterminent excursions on the outputs immediately following the changes on the inputs.
For applications which require a single–ended input, the VBB reference voltage is supplied. For single–ended input applications the V reference should be connected to the CLK via a 0.01µf capacitor. The input signal is then driven into the CLK input.
To ensure that the tight skew specification is met it is necessary that both sides of the differential output are terminated into 50, even if only one side is being used. In most applications all fifteen dif ferential pairs will be used and therefore terminated. In the case where fewer than fifteen pairs are used it is necessary to terminate at least the output pairs adjacent to the output pair being used in order to maintain minimum skew. Failure to follow this guideline will result in small degradations of propagation delay (on the order of 10–20ps) of the outputs being used, while not catastrophic to most designs this will result in an increase in skew. Note that the package corners isolate outputs from one another such that the guideline expressed above holds only for outputs on the same side of the package.
The MC100L VE222, as with most ECL devices, can be operated from a positive VCC supply in PECL mode. This allows the LVE222 to be used for high performance clock distribution in +3.3V systems. Designers can take advantage of the LVE222’s performance to distribute low skew clocks across the backplane or the board. In a PECL environment series or Thevenin line, terminations are typically used as they require no additional power supplies, if parallel termination is desired a terminating voltage of VCC–2.0V will need to be provided. For more information on using PECL, designers should refer to Motorola Application Note AN1406/D.
The MC100LVE222 is packaged in the 52–lead TQFP package. For a 3.3V supply this package provides the optimum performance and minimizes board space requirements. The LVE222 will operate from a standard 100E –4.5V supply or a 5.0V PECL supply. The 52–lead TQFP utilizes a 10x10mm body with a lead pitch of 0.65mm.
input and bypassed to ground
BB

LOW VOLTAGE
1:15 DIFFERENTIAL ÷1/÷2
ECL/PECL CLOCK DRIVER
FA SUFFIX
TQFP PACKAGE
CASE 848D–03
10/96
Motorola, Inc. 1996
4–1
REV 1
Page 2
MC100LVE222
VCCO
Pinout: 52–Lead TQFP (Top View)
VCCO
Qc0
Qc0
Qc1
Qc1
Qc2
Qc2
Qc3
Qc3
VCCONCNC
39 38 37 36 35 34 33 32 31 30 29 28 27
40
VCCO
26
Qd0 Qb2 Qb2 Qb1 Qb1 Qb0 Qb0
VCCO
Qa1 Qa1 Qa0 Qa0
VCCO
41 42 43 44 45 46 47 48 49 50 51 52
12345678910111213
MR
VCC
fsela
MC100LVE222
fselb
CLK0
CLK0
CLK1
CLK_Sel
CLK1
VBB
fselc
fseld
25 24 23 22 21 20 19 18 17 16 15 14
VEE
Qd0
Qd1
Qd1
Qd2
Qd2
Qd3
Qd3
Qd4
Qd4
Qd5
Qd5
VCCO
LOGIC SYMBOL
MR
CLK0 CLK0 CLK1 CLK1
CLK_Sel
V
BB
fsela
fselb
fselc
fseld
MOTOROLA ECLinPS and ECLinPS Lite
÷
1
÷
2
2
Qa0:1 Qa0:1
FUNCTION TABLE
3
4
6
4–2
Qb0:2 Qb0:2
Qc0:3 Qc0:3
Qd0:5 Qd0:5
Input
MR CLK_Sel fseln
Function
01
Active
CLK0
÷1
Reset CLK1
÷2
DL140 — Rev 3
Page 3
MC100LVE222
ECL DC CHARACTERISTICS
–40°C 0°C 25°C 70°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
V
OL
V
IH
V
IL
V
BB
V
EE
I
IH
I
IL
I
EE
PECL DC CHARACTERISTICS
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
V
OL
V
IH
V
IL
V
BB
V
CC
I
IH
I
IL
I
EE
1. These values are for VCC = 3.3V. Level Specifications will vary 1:1 with VCC.
Output HIGH Voltage –1.085 –1.005 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 V Output LOW Voltage –1.830 –1.695 –1.555 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 V Input HIGH Voltage –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 V Input LOW Voltage –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 V Output Reference
Voltage Power Supply Voltage –3.0 –5.25 –3.0 –5.25 –3.0 –5.25 –3.0 –5.25 V Input HIGH Current 150 150 150 150 µA Input CLK0, CLK1
LOW Current Others Power Supply Current 122 136 122 136 122 136 125 139 mA
Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Output Reference
1.
Voltage Power Supply Voltage 3.0 5.25 3.0 5.25 3.0 5.25 3.0 5.25 V Input HIGH Current 150 150 150 150 µA Input CLK0, CLK1
LOW Current Others Power Supply Current 122 136 122 136 122 136 125 139 mA
–1.38 –1.26 –1.38 –1.26 –1.38 –1.26 –1.38 –1.26 V
–300
0.5
–40°C 0°C 25°C 70°C
1.
2.215 2.295 2.420 2.275 2.345 2.420 2.275 2.345 2.420 2.275 2.345 2.420 V
1.
1.470 1.605 1.745 1.490 1.595 1.680 1.490 1.595 1.680 1.490 1.595 1.680 V
1.
1.
2.135 2.420 2.135 2.420 2.135 2.420 2.135 2.420 V
1.490 1.825 1.490 1.825 1.490 1.825 1.490 1.825 V
1.92 2.04 1.92 2.04 1.92 2.04 1.92 2.04 V
–300
0.5
–300
0.5
–300
0.5
–300
0.5
–300
0.5
–300
0.5
–300
0.5
µA
µA
DL140 — Rev 3
4–3 MOTOROLAECLinPS and ECLinPS Lite
Page 4
MC100LVE222
ECL AC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = V
–40°C 0°C 25°C 70°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Condition
t
PLH
t
PHL
t
skew
V
PP
V
CMR
tr/t
Propagation Delay to Output
Within–Device Skew Part–to–Part Skew (Diff)
Minimum Input Swing 400 400 400 400 mV Note 4. Common Mode Range
Output Rise/Fall Time 200 600 200 600 200 600 200 600 ps 20%–80%
f
IN (differential)
IN (single–ended)
VPP < 500mV
VPP 500mV V
MR
1040
990
1100
V
EE
+1.3
EE
+1.6
1140 1140 1250
1240 1290 1400
50
200
–0.4 V
–0.4 V
1060 1010 1130
EE
+1.2
EE
+1.5
1160 1160 1280
1260 1310 1430
50
200
–0.4 V
–0.4 V
1080 1030 1170
+1.2
+1.5
EE
EE
CCO
1180 1180 1320
= GND)
1280 1330 1470
50
200
–0.4 V
–0.4 V
1120 1070 1220
EE
+1.2
EE
+1.5
1220 1220 1370
1320 1370 1520
50
200
–0.4
–0.4
ps
Note 1. Note 2.
ps Note 3.
V Note 5.
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. See
Definitions and T esting of ECLinPS AC Parameters
in Chapter 1 (page 1–12) of the Motorola High Performance
ECL Data Book (DL140/D).
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. See
Definitions and T esting of ECLinPS AC Parameters
in Chapter 1 (page 1–12) of the Motorola High Performance ECL Data Book (DL140/D).
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited for the LVE222. A differential input as low as 50 mV will still produce full ECL levels at the output.
5. V
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The VIL level
CMR
must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
PECL AC CHARACTERISTICS (VEE = GND; VCC = V
–40°C 0°C 25°C 70°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Condition
t
PLH
t
PHL
t
skew
V
PP
V
CMR
tr/t
Propagation Delay to Output
Within–Device Skew Part–to–Part Skew (Diff)
Minimum Input Swing 400 400 400 400 mV Note 4. Common Mode Range
Output Rise/Fall Time 200 600 200 600 200 600 200 600 ps 20%–80%
f
IN (differential)
IN (single–ended)
VPP < 500mV
VPP 500mV 1.6 V
MR
1040
1100
1140
990
1140 1250
1.3 V
1240 1290 1400
50
200
CC
–0.4
CC
–0.4
1060 1010 1130
1.2 V
1.5 V
= VCC (min) to VCC (max))
CCO
1160
1260
1080 1160 1280
1310 1430
50
200
CC
–0.4
CC
–0.4
1180
1030
1180
1170
1320
1.2 V
1.5 V
1280 1330 1470
50
200
CC
–0.4
CC
–0.4
1120
1220
1070
1220
1220
1370
1.2 V
1.5 V
1320 1370 1520
50
200
CC
–0.4
CC
–0.4
ps
Note 1. Note 2.
ps Note 3.
V Note 5.
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. See
Definitions and T esting of ECLinPS AC Parameters
in Chapter 1 (page 1–12) of the Motorola High Performance
ECL Data Book (DL140/D).
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. See
Definitions and T esting of ECLinPS AC Parameters
in Chapter 1 (page 1–12) of the Motorola High Performance ECL Data Book (DL140/D).
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited for the LVE222. A differential input as low as 50 mV will still produce full ECL levels at the output.
5. V
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The VIL level
CMR
must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
MOTOROLA ECLinPS and ECLinPS Lite
4–4
DL140 — Rev 3
Page 5
MC100LVE222
OUTLINE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 848D–03
ISSUE C
–X–
4X
N0.20 (0.008) H L–M N0.20 (0.008) T L–M
4X TIPS
C
L
AB
4052
1
39
AB
X=L, M, N
G
–L–
–H– –T–
SEATING PLANE
3X VIEW Y
–M–
B V
B1
V1
13
14
A1
–N–
27
26
S1
A S
C
4X θ2
0.10 (0.004) T
4X θ3
VIEW AA
0.05 (0.002)
C2
S
W
θ1
2 X R R1
0.25 (0.010)
θ
GAGE PLANE
PLATING
0.13 (0.005) N
ROTATED 90_ CLOCKWISE
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE. 4 DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–. 5 DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–. 6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-. 7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
K
C1
E
Z
VIEW AA
VIEW Y
F
J
BASE METAL
U
D
M
S
L–M
T
SECTION AB–AB
MILLIMETERS
DIMAMIN MAX MIN MAX
10.00 BSC 0.394 BSC
A1 5.00 BSC 0.197 BSC
B 10.00 BSC 0.394 BSC
B1 5.00 BSC 0.197 BSC
C ––– 1.70 ––– 0.067 C1 0.05 0.20 0.002 0.008 C2 1.30 1.50 0.051 0.059
D 0.20 0.40 0.008 0.016
E 0.45 0.030
F 0.22 0.35 0.009 0.014
G 0.65 BSC
J 0.07 0.20 0.003 0.008
K 0.50 REF 0.020 REF R1 0.08 0.20 0.003 0.008
S 12.00 BSC 0.472 BSC S1 6.00 BSC 0.236 BSC
U 0.09 0.16 0.004 0.006
V 12.00 BSC 0.472 BSC V1 6.00 BSC 0.236 BSC W 0.20 REF 0.008 REF
Z 1.00 REF 0.039 REF
θ
07
__
θ
1
0
_
12
θ
2
θ
3
REF
_
513
_
INCHES
0.75 0.018
0.026 BSC
07
__
––– –––
0
_
12
REF
_
5
_
13
_
S
_
DL140 — Rev 3
4–5 MOTOROLAECLinPS and ECLinPS Lite
Page 6
MC100LVE222
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MOTOROLA ECLinPS and ECLinPS Lite
4–6
*MC100LVE222/D*
MC100LVE222/D
DL140 — Rev 3
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