Datasheet MC100EPT22D, MC100EPT22DR2 Datasheet (MOTOROLA)

MC100EPT22

Dual LVTTL/LVCMOS to
Differential LVPECL Translator

The MC100EPT22 is a dual LVTTL/LVCMOS to differential
LVPECL translator. Because LVPECL (Positive ECL) levels are used
only +3.3V and ground are required. The small outline 8–lead SOIC
package and the single gate of the EPT22 makes it ideal for those
applications where space, performance, and low power are at a
premium. Because the mature MOSAIC 5 process is used, low cost
and high speed can be added to the list of features.

• 420ps T ypical Propagation Delay

• Differential LVPECL Outputs

• Small Outline SOIC Package

• PNP LVTTL Inputs for Minimal Loading

• Flow Through Pinouts

• Q Output will default HIGH with inputs open

• ESD Protection: 4.0 KV HBM, 200 V MM

• Maximum Frequency > 1.1 GHz

• Moisture Sensitivity Level 1, Indefinite Time Out of Drypack.

For Additional Information, See Application Note AND8003/D

• Flammability Rating: UL–94 code V–0 @ 1/8”,

Oxygen Index 28 to 34

• Transistor Count = 164 devices

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1

SO–8
D SUFFIX
CASE 751

MARKING DIAGRAM

8

KPT22

ALYW

1

*For additional information, see Application Note
AND8002/D

A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week

Q0

Q0

1

2

V

78D0

CC

LVPECL LVTTL

3

45

Q1

Figure 1. 8–Lead Pinout (Top View) and Logic Diagram

6

D1Q1

GND

PIN DESCRIPTION

PIN

Q0, Q1, Q0

MC100EPT22D SOIC 98 Units/Rail

MC100EPT22DR2 SOIC 2500 Tape & Reel

, Q1

D0, D1 LVTTL Inputs

V

CC

GND Ground

ORDERING INFORMATION

Device Package Shipping

FUNCTION

Diff. LVPECL Outputs

Positive Supply

 Semiconductor Components Industries, LLC, 1999

September, 1999 – Rev. 2.0

1 Publication Order Number:

MC100EPT22/D

MC100EPT22

MAXIMUM RATINGS*

Symbol Parameter Value Unit

V

CC

V

I

I

out

T

A

T

stg

θ

JA

θ

JC

T

sol

* Maximum Ratings are those values beyond which damage to the device may occur.

LVTTL INPUT DC CHARACTERISTICS (VCC = 3.3V ±0.3V; GND = 0V; TA = –40°C to +85°C)

Symbol Characteristic Min Typ Max Unit

I

IH

I

IHH

I

IL

V
V
V

IK
IH
IL

Input HIGH Current (Vin = 2.7V) 20 µA
Input HIGH Current MAX (Vin = 6.0V) 100 µA
Input LOW Current (Vin = 0.5V) –0.6 mA
Input Clamp Voltage (Iin = –18mA) –1.0 V
Input HIGH Voltage 2.0 V
Input LOW Voltage 0.8 V

Power Supply 6.0 to 0 VDC
Input Voltage (VI not more positive than VCC) 6.0 to 0 VDC
Output Current Continuous

Surge
Operating Temperature Range –40 to +85 °C
Storage Temperature –65 to +150 °C
Thermal Resistance (Junction–to–Ambient) Still Air

500lfpm
Thermal Resistance (Junction–to–Case) 41 to 44 ± 5% °C/W
Solder Temperature (<2 to 3 Seconds: 245°C desired) 265 °C

50

100

190
130

mA

°C/W

LVPECL OUTPUT DC CHARACTERISTICS (VCC = 3.3V ± 0.3V, GND = 0V) (Note 3.)

–40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

ICC

V

OH

V

OL

NOTE: 100EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The

1. VCC = 3.3V, GND = 0V, all other pins floating.

2. All loading with 50 ohms to VCC–2.0 volts.

3. Output parameters vary 1:1 with VCC.

Power Supply Current HIGH
(Note 1.)

Output HIGH Voltage
(Note 2.)

Output LOW Voltage
(Note 2.)

circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.

32 43 55 35 45 60 37 46 62 mA

2100 2240 2400 2100 2280 2400 2100 2350 2400 mV

1350 1490 1600 1350 1555 1600 1350 1550 1600 mV

AC CHARACTERISTICS (VCC = 3.3V ± 0.3V; GND = 0V)

–40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

f

max

t

PLH

t

PHL

t

JITTER

tr &
t

f

4. F

Maximum Toggle
Frequency (Note 4.)

,

Propagation Delay to
Output Differential

Cycle–to–Cycle Jitter TBD TBD TBD ps
Output Rise/Fall Times

(20% – 80%) Q, Q

guaranteed for functionality only. VOL and VOH levels are guaranteed at DC only.

max

0.8 1.1 0.8 1.1 0.8 1.1 GHz

250 400 650 250 420 675 300 500 700 ps

50 110 200 60 120 220 70 140 250 ps

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MC100EPT22

P ACKAGE DIMENSIONS

SO–8

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751–06

ISSUE T

C

A

E

B

A1

D

58

0.25MB

1

H

4

e

M

h

X 45

_

q

C

A

SEATING
PLANE

0.10

L

B

SS

A0.25MCB

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETER.

3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.

MILLIMETERS

DIM MIN MAX

A 1.35 1.75

A1 0.10 0.25

B 0.35 0.49
C 0.19 0.25
D 4.80 5.00
E

3.80 4.00

1.27 BSCe

H 5.80 6.20
h

0.25 0.50

L 0.40 1.25

0 7

q

__

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MC100EPT22

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MC100EPT22/D

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