The MC100EPT21 is a Differential LVPECL to LVTTL translator.
Because LVPECL (Positive ECL) levels are used only +3.3V and
ground are required. The small outline 8–lead SOIC package makes
the EPT21 ideal for applications which require the translation of a
clock or data signal.
The VBB output allows the EPT21 to also be used in a single–ended
input mode. In this mode the VBB output is tied to the D0
non–inverting buffer or the D0 input for an inverting buffer. If used,
the VBB pin should be bypassed to ground via a 0.01µF capacitator.
• 1.4ns Typical Propagation Delay
• 275MHz Fmax (Clock bit stream, not pseudo–random)
• Differential LVPECL inputs
• Small Outline SOIC Package
• 24mA TTL outputs
• Flow Through Pinouts
• Internal Input Resistors: Pulldown on D, Pulldown and Pullup on D
• Q Output will default LOW with inputs open or at GND
• ESD Protection: >1500V HBM, >100V MM
• V
BB
Output
• New Differential Input Common Mode Range
• Moisture Sensitivity Level 1, Indefinite T ime Out of Drypack.
For Additional Information, See Application Note AND8003/D
• Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
• T ransistor Count = 81 devices
1
NC
input for a
V
CC
http://onsemi.com
8
1
SO–8
D SUFFIX
CASE 751
MARKING DIAGRAM
8
KPT21
ALYW
1
*For additional information, see Application Note
AND8002/D
PIN DESCRIPTION
PIN
Q
D, D
V
CC
V
BB
GNDGround
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
FUNCTION
LVTTL Output
Differential LVPECL Input Pair
Positive Supply
Output Reference Voltage
2
D
LVTTL
3
LVPECL
VBB
Figure 1. 8–Lead Pinout (Top View) and Logic Diagram
Semiconductor Components Industries, LLC, 1999
September, 1999 – Rev. 1.0
45
78Q
6
NCD
GND
1Publication Order Number:
MC100EPT21DSOIC98 Units/Rail
MC100EPT21DR2SOIC2500 Tape & Reel
ORDERING INFORMATION
DevicePackageShipping
MC100EPT21/D
Page 2
MC100EPT21
MAXIMUM RATINGS*
SymbolParameterValueUnit
V
CC
V
I
I
out
I
BB
T
A
T
stg
θ
JA
θ
JC
T
sol
* Maximum Ratings are those values beyond which damage to the device may occur.
{
Use for inputs of same package only.
DC CHARACTERISTICS (VCC = 3.3V ± 0.3V; GND = 0V; TA = –40°C to 85°C)
SymbolCharacteristicMinTypMaxUnit
I
CCH
I
CCL
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
I
OS
V
IHCMR
V
BB
NOTE: 100EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The
1. All values vary 1:1 with VCC.
2. All loading with 500 ohms to GND, CL = 20pF.
3. V
Power Supply Current (Outputs set to HIGH)5.01220mA
Power Supply Current (Outputs set to LOW)8.01826mA
Input HIGH Voltage (VCC = 3.3) (Note 1.)21352420mV
Input LOW Voltage (VCC = 3.3) (Note 1.)14901825mV
Input HIGH Current150µA
Input LOW CurrentD
Output HIGH Voltage (IOH = –3.0mA) (Note 2.)2.4V
Output LOW Voltage (IOL = 24mA) (Note 2.)0.5V
Output Short Circuit Current–130–80mA
Input HIGH Voltage Common Mode Range (Note 3.)2.03.3V
Output Voltage Reference2.0V
circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.
min varies 1:1 with GND, max varies 1:1 with VCC.
IHCMR
Power Supply (GND = 0V)0 to 3.8VDC
Input Voltage (GND = 0V, VI not more positive than VCC)0 to 3.8VDC
Output CurrentContinuous
VBB Sink/Source Current
Operating Temperature Range–40 to +85°C
Storage Temperature–65 to +150°C
Thermal Resistance (Junction–to–Ambient)Still Air
Thermal Resistance (Junction–to–Case)41 to 44 ± 5%°C/W
Solder Temperature (<2 to 3 Seconds: 245°C desired)265°C
Cycle–to–Cycle JitterTBDTBDTBDps
Input Voltage Swing (Diff.)150800120015080012001508001200mV
Output Rise/Fall Times
(0.8V – 2.0V)Q, Q
guaranteed for functionality only. VOL and VOH levels are guaranteed at DC only.
max
275350275350275350
1000
1000
330500900330500900330500900
1450
1400
60
25
500
1800
1800
1000
1000
1450
1400
60
25
500
1800
1800
1000
1000
1450
1400
60
25
500
1900
1900
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2
MHz
ps
ps
ps
Page 3
MC100EPT21
P ACKAGE DIMENSIONS
SO–8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–06
ISSUE T
C
A
A1
D
58
0.25MB
E
1
B
e
H
4
M
h
X 45
_
q
C
A
SEATING
PLANE
0.10
L
B
SS
A0.25MCB
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MINMAX
A1.351.75
A10.100.25
B0.350.49
C0.190.25
D4.805.00
E
3.804.00
1.27 BSCe
H5.806.20
h
0.250.50
L0.401.25
0 7
q
__
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3
Page 4
MC100EPT21
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability ,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .
PUBLICATION ORDERING INFORMATION
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Phone: 81–3–5487–8345
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For additional information, please contact your local Sales Representative.
MC100EPT21/D
4
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