Datasheet MC100LVEL59DWR2, MC100LVEL59DW, MC100EL59DW, MC100EL59DWR2 Datasheet (MOTOROLA)

Page 1

SEMICONDUCTOR TECHNICAL DATA
4–1
REV 1
Motorola, Inc. 1996
4/95
  
Individual or Common Select Controls
20–Lead SOIC Packaging
500ps Typical Propagation Delays
Supports Both Standard and Low Voltage 100K ECL
Internal Input Pulldown Resistors
>2000V ESD Protection
D1a
Logic Diagram and Pinout: 20–Lead SOIC (Top View)
SEL0 SEL1 D2a
1718 16 15 14 13 12
43
5 6 7 8 9
Q0
11
10
VCCQ1 Q1 VCCQ2 Q2 V
EE
D0a
1920
21
VCCQ0
D0b D1bCOM_SEL D2b SEL2
1 0 1 0 1 0


SEL
H
L
TRUTH TABLE
Data
a b
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
1
20
PIN NAMES
Function
Input Data a Input Data b Individual Select Input Common Select Input True Outputs Inverted Outputs
Pins
D0a–D1a D0b–D1b SEL0–SEL1 COM_SEL Q0–Q2 Q0
–Q2
Page 2
MC100LVEL59 MC100EL59
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 3
4–2
MC100LVEL59 DC CHARACTERISTICS (VEE = –3.0V to –3.8V; VCC = GND)
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
I
EE
Power Supply Current 27 32 27 32 27 32 27 32 mA
I
IH
Input HIGH Current 150 150 150 150 µA
MC100LVEL59 AC CHARACTERISTICS (VEE = –3.0V to –3.8V; VCC = GND)
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
t
PLH
t
PHL
Propagation DATAQ/Q Delay SELQ/Q
COM_SELQ/Q
340 340 340
690 690 690
340 340 340
690 690 690
340 340 340
690 690 690
340 340 340
690 690 690
ps
t
sk(O)
Output–Output Skew
Any Dn, Dm to Q
100 100 100 100
ps
t
r
t
f
Output Rise/Fall Times Q (20% – 80%)
200 540 200 540 200 540 200 540 ps
MC100EL59 DC CHARACTERISTICS (VEE = –4.2V to –5.5V; VCC = GND)
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
I
EE
Power Supply Current 27 32 27 32 27 32 27 32 mA
I
IH
Input HIGH Current 150 150 150 150 µA
MC100EL59 AC CHARACTERISTICS (VEE = –4.2V to –5.5V; VCC = GND)
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
t
PLH
t
PHL
Propagation DATAQ/Q Delay SELQ/Q
COM_SELQ/Q
340 340 340
690 690 690
340 340 340
690 690 690
340 340 340
690 690 690
340 340 340
690 690 690
ps
t
sk(O)
Output–Output Skew
Any Dn, Dm to Q 100 100 100 100
ps
t
r
t
f
Output Rise/Fall Times Q (20% – 80%)
200 540 200 540 200 540 200 540 ps
Page 3
MC100LVEL59 MC100EL59
4–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 3
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G J K M P R
0.510
0.299
0.104
0.019
0.035
0.012
0.009 7
°
0.415
0.029
0.499
0.292
0.093
0.014
0.020
0.010
0.004 0
°
0.395
0.010
12.95
7.60
2.65
0.49
0.90
0.32
0.25 7
°
10.55
0.75
12.65
7.40
2.35
0.35
0.50
0.25
0.10 0
°
10.05
0.25
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1.27 BSC 0.050 BSC
–A
–B
P 10 PL
1 10
1120
–T
D
20 PL
K
C
SEATING PLANE
R X 45°
M
0.010 (0.25)
B
M M
0.010 (0.25) T A B
M
S S
G 18 PL
F
J
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MC100LVEL59/D
*MC100LVEL59/D*
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