The MC10E/100E195 is a programmable delay chip (PDC) designed
primarily for clock de-skewing and timing adjustment. It provides variable
delay of a differential ECL input transition.
The delay section consists of a chain of gates organized as shown in
the logic symbol. The first two delay elements feature gates that have
been modified to have delays 1.25 and 1.5 times the basic gate delay of
approximately 80 ps. These two elements provide the E195 with a
digitally-selectable resolution of approximately 20 ps. The required
device delay is selected by the seven address inputs D[0:6], which are
latched on chip by a high signal on the latch enable (LEN) control.
Because the delay programmability of the E195 is achieved by purely
differential ECL gate delays the device will operate at frequencies of >1.0
GHz while maintaining over 600 mV of output swing.
The E195 thus offers very fine resolution, at very high frequencies, that
is selectable entirely from a digital input allowing for very accurate system
clock timing.
An eighth latched input, D7, is provided for cascading multiple PDC’s
for increased programmable range. The cascade logic allows full control
of multiple PDC’s, at the expense of only a single added line to the data
bus for each additional PDC, without the need for any external gating.
• 2.0ns Worst Case Delay Range
• ≈20ps/Delay Step Resolution
• >1.0GHz Bandwidth
• On Chip Cascade Circuitry
• Extended 100E V
• 75KΩ Input Pulldown Resistors
PIN NAMES
PinFunction
IN/IN
EN
D[0:7]
Q/Q
LEN
SET MIN
SET MAX
CASCADE
Range of –4.2 to –5.46V
EE
Signal Input
Input Enable
Mux Select Inputs
Signal Output
Latch Enable
Min Delay Set
Max Delay Set
Cascade Signal
PROGRAMMABLE
DELAY CHIP
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
D2
D3D4D5D6D7NC
25242322212019
D1
26
D0
27
LEN
28
V
EE
1
IN
2
IN
3
V
4
BB
567891011
NCNCEN
Pinout:
28-Lead PLCC
(Top View)
SET MIN
SET MAX
18
NC
17
NC
16
V
CC
15
V
CCO
14
Q
13
Q
12
V
CCO
CASCADE
CASCADE
V
BB
1
* 1.25
110
* 1.5
IN
IN
EN
LEN
SET MIN
SET MAX
* DELAYS ARE 25% OR 50% LONGER THAN
* STANDARD (STANDARD ≈ 80 PS)
04/99
0
1
D0D1D2D3D4D5D6D7
Motorola, Inc. 1999
LOGIC DIAGRAM – SIMPLIFIED
0
1
111
2–1
0
1
7 BIT LATCH
4 GATES8 GATES16 GATES
0
1
0
1
LENQ
LATCH
D
REV 3
0
1
CASCADE
0
1
1
Q
Q
CASCADE
CASCADE
Page 2
MC10E195 MC100E195
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
1. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.
2. This setup time defines the amount of time prior to the input signal the delay tap of the device must be set.
3. This setup time is the minimum time that EN
±75 mV to that IN/IN
4. This hold time is the minimum time that EN
greater than ±75 mV to that IN/INtransition.
5. This release time is the minimum time that EN
the specified IN to Q propagation delay andtransition times.
6. Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations of
asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range.
7. The linearity specification guarantees to which delay control input the programmable steps will be monotonic (i.e. increasing delay steps for
increasing binary counts on the control inputsDn). Typically the device will be monotonic to the D0 input, however under worst case conditions
and process variation, delays could decrease slightly with increasing binary countswhen the D0 input is the LSB. With the D1 input as the LSB
the device is guaranteed to be monotonic over all specified environmental conditions and process variation.
8. The jitter of the device is less than what can be measured without resorting to very tedious and specialized measurement techniques.
Propagation Delay
IN to Q; Tap = 0
IN to Q; Tap = 127
EN
to Q; Tap = 0
D7 to CASCADE
Programmable Range
tPD (max) – tPD (min)
D0 High
D1 High
D2 High
D3 High
D4 High
D5 High
D6 High
Duty Cycle Skew
t
PHL–tPLH
Setup Time
D to LEN
D to IN
EN
to IN
Hold Time
LEN to D
IN to EN
Release Time
EN
to IN
SET MAX to LEN
SET MIN to LEN
Jitter<5.0<5.0<5.0ps8
Output Rise/Fall Time
20–80% (Q)
20–80% (CASCADE)
transition.
1210
1360
1510
3200
3570
1250
1450
300
450
200021752050224023752580
17
55
115
250
505
1000
200
800
200
500025050002505000250
300
800
800
125
300
must remain asserted after a negative going IN or positive going IN to prevent an output response
34
68
136
272
544
1088
±30±30±30
0200
225
450
must be asserted prior to the next transition of IN/IN to prevent an output response greater than
must be deasserted prior to the next IN/IN transition to ensure an output response that meets
3970
1650
700
105
180
325
620
1190
325
650
1240
3270
1275
300
55
115
250
515
1030
800
200
300
800
800
125
300
= GND)
CCO
130
130
CCO
1390
3630
1475
450
17.5
140
280
560
1120
225
450
156
156
= GND)
1540
4030
1675
700
35
70
105
180
325
620
1220
0200
325
650
1440
3885
1350
300
65
140
305
620
1240
800
200
300
800
800
125
300
130
150
1590
4270
1650
450
21
42
84
168
336
672
1344
0
225
450
156
mA
179
ps
1765
4710
1950
700
ps
ps6
120
205
380
740
1450
ps
1
ps
2
3
ps
4
ps
5
ps
325
650
MOTOROLAECLinPS and ECLinPS Lite
2–2
DL140 — Rev 4
Page 3
A7
MC10E195 MC100E195
ADDRESS BUS (A0–A6)
INPUT
D2D3D4D5D6
D1
D0
LEN
V
EE
IN
IN
V
BB
E195
Chip #1
EN
SET MIN
SET MAX
CASCADE
D7
V
CC
V
CCO
V
CCO
CASCADE
Figure 1. Cascading Interconnect Architecture
Cascading Multiple E195’s
To increase the programmable range of the E195 internal
cascade circuitry has been included. This circuitry allows for
the cascading of multiple E195’s without the need for any
external gating. Furthermore this capability requires only one
more address line per added E195. Obviously cascading
multiple PDC’s will result in a larger programmable range
however this increase is at the expense of a longer minimum
delay .
Figure 1 illustrates the interconnect scheme for cascading
two E195’s. As can be seen, this scheme can easily be
expanded for larger E195 chains. The D7 input of the E195 is
the cascade control pin. With the interconnect scheme of
Figure 1 when D7 is asserted it signals the need for a larger
programmable range than is achievable with a single device.
An expansion of the latch section of the block diagram is
pictured below. Use of this diagram will simplify the
explanation of how the cascade circuitry works. When D7 of
chip #1 above is low the cascade output will also be low while
the cascade bar output will be a logical high. In this condition
the SET MIN pin of chip #2 will be asserted and thus all of the
latches of chip #2 will be reset and the device will be set at its
minimum delay. Since the RESET and SET inputs of the
latches are overriding any changes on the A0–A6 address bus
will not affect the operation of chip #2.
D2D3D4D5D6
D1
D0
LEN
V
EE
Q
Q
IN
IN
V
BB
E195
Chip #2
EN
SET MIN
SET MAX
CASCADE
D7
V
V
CCO
V
CCO
CASCADE
CC
Q
Q
OUTPUT
Chip #1 on the other hand will have both SET MIN and SET
MAX de-asserted so that its delay will be controlled entirely by
the address bus A0–A6. If the delay needed is greater than
can be achieved with 31.75 gate delays (1111111 on the
A0–A6 address bus) D7 will be asserted to signal the need to
cascade the delay to the next E195 device. When D7 is
asserted the SET MIN pin of chip #2 will be de-asserted and
the delay will be controlled by the A0–A6 address bus. Chip #1
on the other hand will have its SET MAX pin asserted resulting
in the device delay to be independent of the A0–A6 address
bus.
When the SET MAX pin of chip #1 is asserted the D0 and D1
latches will be reset while the rest of the latches will be set. In
addition, to maintain monotonicity an additional gate delay is
selected in the cascade circuitry. As a result when D7 of chip
#1 is asserted the delay increases from 31.75 gates to 32
gates. A 32 gate delay is the maximum delay setting for the
E195.
To expand this cascading scheme to more devices one
simply needs to connect the D7 input and CASCADE outputs
of the current most significant E195 to the new most significant
E195 in the same manner as pictured in Figure 1. The only
addition to the logic is the increase of one line to the address
bus for cascade control of the second PDC.
Figure 2. Expansion of the Latch Section of the E195 Block Diagram
2–3MOTOROLAECLinPS and ECLinPS Lite
CASCADE
CASCADE
Page 4
MC10E195 MC100E195
-N-
-L-
281
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
SNSM
G1
–M
SNSM
–M
0.010 (0.250)T L
–M
SNSS
0.007 (0.180)T L
Y BRK
B
0.007 (0.180)T L
U
D
Z
-M-
D
W
V
X
VIEW D-D
Z
C
G
G1
0.010 (0.250)T L
0.007 (0.180)T L
A
0.007 (0.180)T L
R
E
0.004 (0.100)
SEATING
-T-
J
PLANE
VIEW S
SNSS
–M
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
–M
–M
SNSM
SNSM
H
0.007 (0.180)T L
–M
SNSM
K1
K
SNSM
0.007 (0.180)T L
F
–M
VIEW S
INCHESMILLIMETERS
MINMINMAXMAX
DIM
G1
K1
A
0.485
B
0.485
C
0.165
E
0.090
F
0.013
G
0.050 BSC
H
0.026
J
0.020
K
0.025
R
0.450
U
0.450
V
0.042
W
0.042
X
0.042
Y
—
°
Z
2
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
—
—
0.456
0.456
0.048
0.048
0.056
0.020
10
0.430
—
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
°
°
2
1.02
10
10.92
—
°
10.42
MOTOROLAECLinPS and ECLinPS Lite
2–4
DL140 — Rev 4
Page 5
MC10E195 MC100E195
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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