* The Assembly Location Code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter
pin), the front side assembly code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 5 of this data sheet.
1Publication Order Number:
MBRD620CT/D
Page 2
MBRD620CT, NRVBD620VCT, SBRV620CT Series
MAXIMUM RATINGS
MBRD/NRVBD/SBRV
RatingSymbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
T
= 130°C (Rated VR)
C
Per Diode
V
V
I
F(AV)
RRM
RWM
V
Per Device
Peak Repetitive Forward Current,
T
= 130°C (Rated VR, Square Wave, 20 kHz)
C
Per Diode
Nonrepetitive Peak Surge Current − (Surge applied at rated load
conditions halfwave, single phase, 60 Hz)
Peak Repetitive Reverse Surge Current (2 ms, 1 kHz)
I
FRM
I
FSM
I
RRM
Operating Junction Temperature (Note 1)T
Storage TemperatureT
Voltage Rate of Change (Rated VR)dv/dt10,000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP
620CT 630CT 640CT 650CT 660CT
2030405060V
R
3
6
6
75A
1A
J
stg
−65 to +175°C
−65 to +175°C
/dTJ < 1/R
D
q
JA
Unit
A
A
V/ms
.
THERMAL CHARACTERISTICS PER DIODE
CharacteristicSymbolValueUnit
Maximum Thermal Resistance, Junction−to−Case
Maximum Thermal Resistance, Junction−to−Ambient (Note 2)
R
q
JC
R
q
JA
6°C/W
80°C/W
2. Rating applies when surface mounted on the minimum pad size recommended.
ELECTRICAL CHARACTERISTICS PER DIODE
CharacteristicSymbolValueUnit
Maximum Instantaneous Forward Voltage (Note 3)
i
= 3 Amps, TC = 25°C
F
iF = 3 Amps, TC = 125°C
iF = 6 Amps, TC = 25°C
i
= 6 Amps, TC = 125°C
F
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, T
(Rated dc Voltage, TC = 125°C)
= 25°C)
C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if VR is sufficient below rated VR.
TJ = 175°C
150°C
125°C
75°C
25°C
40700
5060102030
, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current,* Per Leg
14
13
1.4
, AVERAGE POWER DISSIPATION (WATTS)
F(AV)
P
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
12
11
10
IPK/IAV = 20
0
2.0
1.00
3.04.05.06.07.010
I
, AVERAGE FORWARD CURRENT (AMPS)
F(AV)
10
5
dc
Figure 3. Average Power Dissipation, Per Leg
SINE
WAVE
SQUARE
WAVE
TJ = 150°C
8.09.0
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3
Page 4
MBRD620CT, NRVBD620VCT, SBRV620CT Series
TYPICAL CHARACTERISTICS
8.0
7.0
6.0
5.0
4.0
3.0
2.0
, AVERAGE FORWARD CURRENT (AMPS)
1.0
F(AV)
I
4.0
3.5
3.0
2.5
2.0
1.5
1.0
RATED VOLTAGE APPLIED
SINE
WAVE
OR
SQUARE
WAVE
0
11090100120130150160
, CASE TEMPERATURE (°C)
T
C
Figure 4. Current Derating, Case, Per Leg
TJ = 150°C
VR = 25 V
VR = 60 V
R
q
JA
SURFACE MOUNTED ON MIN.
PAD SIZE RECOMMENDED
R
= 6°C/W
q
JC
TJ = 150°C
dc
14080
= 80°C/W
dc
SQUARE WAVE
SINE WAVE
OR
, AVERAGE FORWARD CURRENT (AMPS)
0.5
0
F(AV)
I
1 K
100
C, CAPACITANCE (pF)
10
1001600
12014020406080
, AMBIENT TEMPERATURE (°C)
T
A
Figure 5. Current Derating, Ambient, Per Leg
TJ = 25°C
1020304050
V
, REVERSE VOLTAGE (VOLTS)
R
600
70
Figure 6. Typical Capacitance, Per Leg
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4
Page 5
MBRD620CT, NRVBD620VCT, SBRV620CT Series
ORDERING INFORMATION
DevicePackageShipping
MBRD620CTT4G
MBRD630CTT4G2500 / Tape & Reel
MBRD640CTG75 Units / Rail
NRVBD640CTG*75 Units / Rail
NRVBD640CTG−VF01*75 Units / Rail
MBRD640CTT4G2500 / Tape & Reel
NRVBD640CTT4G*2500 / Tape & Reel
NRVBD640VCTT4G*2500 / Tape & Reel
SBRV640VCTT4G*2500 / Tape & Reel
MBRD650CTG75 Units / Rail
MBRD650CTT4G2500 / Tape & Reel
NRVBD650CTG−VF01*2500 / Tape & Reel
NRVBD650CTT4G*2500 / Tape & Reel
NRVBD650CTT4G−VF01*2500 / Tape & Reel
MBRD660CTG75 Units / Rail
NRVBD660CTG*75 Units / Rail
NRVBD660CTG−VF01*75 Units / Rail
MBRD660CTRLG1800 / Tape & Reel
NRVBD660CTRLG*1800 / Tape & Reel
MBRD660CTT4G2500 / Tape & Reel
NRVBD660CTT4G*2500 / Tape & Reel
SBRV660VCTT4G*2500 / Tape & Reel
SNRVBD660CTT4G*2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRVBD and SBRV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable.
DPAK
(Pb−Free)
2500 / Tape & Reel
†
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5
Page 6
L3
L4
b2
L2
12 3
e
TOP VIEW
GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
MBRD620CT, NRVBD620VCT, SBRV620CT Series
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F
E
b3
4
L
L1
A
B
D
NOTE 7
b
0.005 (0.13)C
H
A1
C
M
SEATING
PLANE
A
c
SIDE VIEW
C
c2
HDETAIL A
Z
BOTTOM VIEW
ALTERNATE
CONSTRUCTIONS
BOTTOM VIEW
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
Z
Z
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
DIM MINMAXMIN MAX
A 0.086 0.0942.182.38
A1 0.000 0.0050.000.13
b 0.025 0.0350.630.89
b2 0.028 0.0450.721.14
b3 0.180 0.2154.575.46
c 0.018 0.0240.460.61
c2 0.018 0.0240.460.61
D 0.235 0.2455.976.22
E 0.250 0.2656.356.73
e0.090 BSC2.29 BSC
H 0.370 0.4109.40 10.41
L 0.055 0.0701.401.78
L10.114 REF2.90 REF
L20.020 BSC0.51 BSC
L3 0.035 0.0500.891.27
L4−−− 0.040−−−1.01
Z 0.155−−−3.93−−−
MILLIMETERSINCHES
6.20
0.244
2.58
3.00
0.118
0.102
5.80
0.228
1.60
0.063
SCALE 3:1
6.17
0.243
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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◊
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
www.onsemi.com
6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MBRD620CT/D
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