Datasheet MBR 350RL Datasheet (FREI)

Page 1

MBR350, MBR360

MBR360 is a Preferred Device

Axial Lead Rectifiers

These devices employ the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlap contact. Ideally suited for use as rectifiers in low−voltage, high−frequency inverters, free wheeling diodes, and polarity protection diodes.

Features

• Extremely Low v

• Low Power Loss/High Efficiency

• Highly Stable Oxide Passivated Junction

• Low Stored Charge, Majority Carrier Conduction

• Shipped in plastic bags, 500 per bag

• Available Tape and Reeled, 1500 per reel, by adding a “RL’’ suffix to

the part number

• These devices are manufactured with a Pb−Free external lead

finish only*

Mechanical Characteristics:

• Case: Epoxy, Molded

• Weight: 1.1 gram (approximately)

• Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

• Lead and Mounting Surface Temperature for Soldering Purposes:

220°C Max. for 10 Seconds, 1/16 in from case

• Polarity: Cathode indicated by Polarity Band

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SCHOTTKY BARRIER

RECTIFIERS

3.0 AMPERES 50, 60 VOLTS

AXIAL LEAD

CASE 267−05

(DO−201AD)

STYLE 1

MAXIMUM RATINGS

Rating Symbol Max Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage DC Blocking Voltage MBR350

Average Rectified Forward Current

= 65°C (R

P.C. Board Mounting)

Non−Repetitive Peak Surge Current

(Note 1) (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz, T

Operating and Storage Junction

Temperature Range (Reverse Voltage Applied)

Peak Operating Junction Temperature

(Forward Current Applied)

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1. Lead Temperature reference is cathode lead 1/32 in from case. *For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.



= 75°C)

= 28°C/W,

MBR360

RRM

RWM

FSM

TJ, T

J(pk)

−65 to +150 °C

stg

50 60

3.0 A

80 A

150 °C

MARKING DIAGRAM

MBR

3x0

MBR3x0= Device Code x = 5 or 6

ORDERING INFORMATION

Device Package Shipping

MBR350 Axial Lead 500 Units/Bag MBR350RL Axial Lead 1500/Tape & Reel MBR360 Axial Lead 500 Units/Bag MBR360RL Axial Lead 1500/Tape & Reel †For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Preferred devices are recommended choices for future use and best overall value.

†

 Semiconductor Components Industries, LLC, 2004

December, 2004 − Rev. 4

1 Publication Order Number:

MBR350/D

Page 2

MBR350, MBR360

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance, Junction−to−Ambient (see Note 4, Mounting Method 3) R



28 °C/W

ELECTRICAL CHARACTERISTICS (T

= 25°C unless otherwise noted) (Note 2)

Characteristic

Maximum Instantaneous Forward Voltage (Note 3)

= 1.0 Amp)

= 3.0 Amp)

= 9.4 Amp)

Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 3)

= 25°C

= 100°C

2. Lead Temperature reference is cathode lead 1/32 in from case.

3. Pulse Test: Pulse Width = 300 s, Duty Cycle =2.0%.

= 100°C 25°C

75°C

7.0

5.0

3.0

2.0

1.0

0.7

0.5

0.3

0.2

i , INSTANTANEOUS FORWARD CURRENT (AMPS)

0.1

0.07

0.05

20 10

5.0

2.0

1.0

0.50

0.20

0.10

0.05

0.02

I , REVERSE CURRENT (mA)

0.01

0.005

0.002 02010 30 40

VR REVERSE VOLTAGE (VOLTS)

Figure 2. Typical Reverse Current*

5.0

4.0

3.0

2.0

Symbol Max Unit

0.600

0.740

1.080

0.60 20

= 150°C

100°C

75°C

*The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if V sufficiently below rated V

25°C

50 60 80

RATED V

= 28°C/W



SQUARE

WAVE

0.03

0.02

0.20 0.4

INSTANTANEOUS VOLTAGE (VOLTS)

0.6 0.8

1.0 1.2 1.4

Figure 1. Typical Forward Voltage

1.0

F (AV)

I , AVERAGE FORWARD CURRENT (AMPS)

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= 150°C

20 1006040 80

, AMBIENT TEMPERATURE (C°)

Figure 3. Current Derating Ambient

(Mounting Method #3 per Note 4)

120 140 160

Page 3

MBR350, MBR360

5.0

4.0

3.0

= 150°C

SQUARE

WAVE

2.0 dc

1.0

F (AV)

P , AVERAGE POWER DISSIPATION (WATTS)

0 2.01.0 3.0 4.0 5.0

, AVERAGE FORWARD CURRENT (AMPS)

F (AV)

Figure 4. Power Dissipation Figure 5. Typical Capacitance

NOTE 4 — MOUNTING DATA

Data shown for thermal resistance junction−to−ambient

) for the mountings shown is to be used as typical



guideline values for preliminary engineering, or in case the tie point temperature cannot be measured.

TYPICAL VALUES FOR R

Mounting

Method

1 2 3

300

200

100

C, CAPACITANCE (pF)

02010 30 40 50

IN STILL AIR



Lead Length, L (in)

1/8 1/4 1/2 3/4

50 51 53 55 °C/W 58 59 61 63

°C/W °C/W

= 25°C

VR, REVERSE VOLTAGE (VOLTS)I



Mounting Method 1

P.C. Board where available

copper surface is small.

L L

Mounting Method 3

P.C. Board with 2−1/2″ X 2−1/2″ copper surface.

L = 1/2’’

Board Ground Plane

Mounting Method 2

Vector Push−In Terminals T−28

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Page 4

MBR350, MBR360

PACKAGE DIMENSIONS

AXIAL LEAD

CASE 267−05

(DO−201AD)

ISSUE G

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 0.287 0.374 7.30 9.50 B 0.189 0.209 4.80 5.30 D 0.047 0.051 1.20 1.30 K 1.000 −−− 25.40 −−−

STYLE 1:

PIN 1. CATHODE (POLARITY BAND)

2. ANODE

MILLIMETERSINCHES

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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MBR350/D