Page 1
MBR140SF, NRVB140SF
s
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
This device uses the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
Features
• Guardring for Stress Protection
• Low Forward Voltage
• 125°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Package Designed for Optimal Automated Board Assembly
• ESD Rating:
♦ Human Body Model = 3B
♦ Machine Model = C
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
• Device Marking: L4F
• Polarity Designator: Cathode Band
• Weight: 11.7 mg (approximately)
• Case: Epoxy, Molded
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
40 VOLTS
SOD−123FL
CASE 498
MARKING DIAGRAM
L4FMG
G
L4F = Specific Device Code
M = Date Code
G = Pb−Free Package)
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping
MBR140SFT1G SOD−123FL
(Pb−Free)
NRVB140SFT1G SOD−123FL
(Pb−Free)
MBR140SFT3G SOD−123FL
(Pb−Free)
NRVB140SFT3G SOD−123FL
(Pb−Free)
** 8 mm Tape, 7” Reel
*** 8 mm Tape, 13” Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD801 1/D.
3,000 /
Tape & Reel **
3,000 /
Tape & Reel **
10,000 /
Tape & Reel ***
10,000 /
Tape & Reel ***
†
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 6
1 Publication Order Number:
MBR140SFT1/D
Page 2
MBR140SF, NRVB140SF
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (At Rated VR, TL = 112°C) I
Peak Repetitive Forward Current
(At Rated V
, Square Wave, 100 kHz, TL = 95°C)
R
Non−Repetitive Peak Surge Current
(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)
Storage Temperature T
Operating Junction Temperature T
Voltage Rate of Change (Rated VR, TJ = 25°C) dv/dt 10,000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Lead (Note 2)
Thermal Resistance, Junction−to−Ambient (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm
2
).
V
V
I
I
RRM
RWM
V
R
O
FRM
FSM
stg
J
R
tjl
R
tjl
R
tja
R
tja
40 V
1.0 A
2.0
30
−55 to 150 °C
−55 to 125 °C
V/ms
26
°C/W
21
325
82
A
A
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3), See Figure 2
(IF = 0.1 A)
(I
= 1.0 A)
F
(IF = 3.0 A)
Maximum Instantaneous Reverse Current (Note 3), See Figure 4
(VR = 40 V)
(V
= 20 V)
R
V
F
I
R
TJ = 25°C TJ = 85°C
0.36
0.55
0.85
0.30
0.515
0.88
TJ = 25°C TJ = 85°C
0.5
0.15
25
18
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
V
mA
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2
Page 3
)
i
, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
9
I
, REVERSE CURRENT (AMPS)
0
)
.6
MBR140SF, NRVB140SF
100
10
1.0
0.1
0.1
F
100E−3
10E−3
1.0E−3
100E−6
10E−6
R
1.0E−6
TJ = 125°C
TJ = 85°C
TJ = 25°C
1.0
TJ = 125°C
TJ = 85°C
TJ = 25°C
TJ = −40°C
0.1
0.70.3 0.5 0.9
v
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
0.1
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
V
F
, INSTANTANEOUS FORWARD CURRENT (AMPS
F
I
(VOLTS)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
1.0E+0
TJ = 125°C
TJ = 85°C
TJ = 25°C
10 20 30
V
, REVERSE VOLTAGE (VOLTS)
R
100E−3
10E−3
1.0E−3
100E−6
, MAXIMUM REVERSE CURRENT (AMPS)
10E−6
R
I
400
0
10 20 30
VR, REVERSE VOLTAGE (VOLTS)
TJ = 85°C
TJ = 25°C
0.70.3 0.5 0.
4
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
, AVERAGE FORWARD CURRENT (AMPS)
O
I
3525
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
dc
freq = 20 kHz
SQUARE
WAVE
Ipk/Io = p
Ipk/Io = 5
Ipk/Io = 10
Ipk/Io = 20
55 115
, LEAD TEMPERATURE (°C)
T
L
7545 65 85 125
95 105
Figure 5. Current Derating
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1.0
0.9
0.8
0.7
0.6
Ipk/Io = 10
Ipk/Io = 20
Ipk/Io = 5
Ipk/Io = p
SQUARE
WAVE
0.5
0.4
0.3
0.2
0.1
, AVERAGE POWER DISSIPATION (WATTS
FO
P
0
0.20
IO, AVERAGE FORWARD CURRENT (AMPS)
0.6 1.4
1.00.4 0.8 1.2 1
Figure 6. Forward Power Dissipation
3
dc
Page 4
MBR140SF, NRVB140SF
r(t), TRANSIENT THERMAL RESISTANCE
0
1000
125
R
= 25.6°C/W
q
JA
115
130°C/W
TJ = 25°C
105
324.9°C/W
95
100
85
235°C/W
75
TEMPERATURE (°C)
, DERATED OPERATING
C, CAPACITANCE (pF)
10
15510 2025
V
, REVERSE VOLTAGE (VOLTS)
R
Figure 7. Capacitance
300
J
T
65
55
4035
V
R
15510 2025 4035
, DC REVERSE VOLTAGE (VOLTS)
300
Figure 8. Typical Operating Temperature
Derating*
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of T
T
may be calculated from the equation: TJ = T
J
This graph displays the derated allowable T
where r(t) = Rthja. For other power applications further calculations must be performed.
therefore must include forward and reverse power effects. The allowable operating
J
− r(t)(Pf + Pr) where
Jmax
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
due to reverse bias under DC conditions only and is calculated as TJ = T
J
Jmax
− r(t)Pr,
1000
100
10
0.1
D = 0.5
0.2
0.1
0.05
P
0.01
1
SINGLE PULSE
0.0001 0.001 0.01 1 10 1000.000001
Test Type > Min Pad < Die Size 38x38 @ 75% mils
0.10.00001
t
, TIME (sec)
1
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
qJA = 321.8 °C/W
2
100
Figure 9. Thermal Response
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Page 5
MBR140SF, NRVB140SF
P
al
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
E
D
12
POLARITY INDICATOR
OPTIONAL AS NEEDED
TOP VIEW
q
H
E
c
SIDE VIEW
2X
L
2X
b
BOTTOM VIEW
q
A
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
A1
DIMAMIN NOM MAX MIN
A1 0.00 0.05 0.10 0.000
b 0.70 0.90 1.10 0.028
c 0.10 0.15 0.20 0.004
D 1.50 1.65 1.80 0.059
E 2.50 2.70 2.90 0.098
L 0.55 0.75 0.95 0.022
H
E
q
MILLIMETERS
0.90 0.95 0.98 0.035
3.40 3.60 3.80 0.134 0.142 0.150
0° 8° 0° 8°
− −
INCHES
NOM MAX
0.037 0.039
0.002 0.004
0.035 0.043
0.006 0.008
0.065 0.071
0.106 0.114
0.030 0.037
RECOMMENDED
SOLDERING FOOTPRINT*
4.20
2X
1.22
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
2X
1.25
ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided i n SCILLC data sheets
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MBR140SFT1/D
5
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