The Fujitsu MB3771 is designed to monitor the voltage level of one or two power supplies (+5 V and an arbitrary
voltage) in a microprocessor circuit, memory board in large-size computer, for example.
If the circuit’s po wer supply de viates more than a specified amount, then the MB3771 gener ates a reset signal to
the microprocessor. Thus, the computer data is protected from accidental erasure.
Using the MB3771 requires few exter nal components. To monitor only a +5 V supply, the MB3771 requires the
connection of one external capacitor. The level of an arbitrary detection voltage is determined by two external
resistors. The MB3771 is av ailable in an 8-pin Dual In-Line, Single In-Line P ackage or space sa ving Flat Pac kage.
DS04-27400-11E
FEATURES
■
• Precision voltage detection (V
• User selectable threshold level with hysteresis (V
• Monitors the voltage of one or two power supplies (5 V and an arbitrary voltage, >1.23 V)
• Usable as over voltage detector
• Low voltage output for reset signal (V
• Minimal number of external components (one capacitor Min)
• Low power dissipation (I
• Detection threshold voltage has hysteresis function
Comparators Comp.A and Comp .B apply a h ysteresis to the detected voltage , so that when the voltage at either
the V
Comp. B ma y be used to detect any given v oltage(APPLICA TION CIRCUIT 3 : Arbitr ary Voltage Supply Monitor),
and can also be used as a forced reset pin (with reset hold time) with TTL input (APPLICATION CIRCUIT 6 :
5V Power Supply Monitor with forced RESET
Note that if Comp.B is not used, the V
Power Supply Monitor).
Instantaneous breaks or drops in the power supply can be detected as abnormal conditions by the MB3771
within a 2 µs interval. However because momentary breaks or drops of this duration do not cause problems in
actual systems in some cases, a delay ed trigger function can be created b y connecting capacitors to the V
V
or VSB pin falls below 1.23 V the RESET output signal goes to “low” level.
SA
input (VCC = 5 V) ).
pin should be connected to the VCC pin (APPLICATION CIRCUIT 1 : 5V
SB
pin (APPLICATION CIRCUIT 8 : Supply Voltage Monitoring with Delayed Trigger).
SB
SA
or
Because the RESET
output has built-in pull-up resistance, there is no need to connect to exter nal pull-up
resistance when connected to a high impedance load such as a CMOS logic IC.
Comparator Comp. C is an open-collector output comparator without hysteresis, in which the polarity of input/
output characteristics is reversed. Thus Comp. C is useful for over-voltage detection (APPLICATION CIRCUIT
11 : Low V oltage and Over V oltage Detection (V
CIRCUIT 7 : 5 V Power Supply Monitor with Non-inverted RESET
= 5 V) ) and positive logic RESET signal output (APPLICATION
CC
), as well as for creating a reference voltage
(APPLICATION CIRCUIT 10 : Reference Voltage Generation and Voltage Sagging Detection).
Note that if Comp. C is not used, the V
pin should be connected to the GND pin (APPLICATION CIRCUIT 1 :
SC
5V Power Supply Monitor).
FUNCTION EXPLANATION
■
HYS
V
VS
VCC
RESET
0.8 V
PO
T
(1)(2) (3)(4) (5) (6)(7)(8)
TPO
CC
CT
1
8
2
7
3
6
4
5
RESET
(1) When VCC
(2) When V
(3) RESET
T
PO
(4) When V
(5) When V
In the case of voltage sagging, if the period from the time V
reaches V
rises to about 0.8V, RESET goes low.
reaches V
CC
S +VHYS
, CT then begins charging. RESET remains low during this time
goes high when CT begins charging.
:= CT × 10
5
(Refer to “CT
level drops lower then VS, then RESET goes low and CT starts discharging.
CC
level reaches VS + V
CC
+V
S
again, is longer than tPI, (as specified in the AC Characteristics), CT is discharged and
HYS
pin capacitance vs. reset hold time” in “TYPICAL CHARACTERISTICS”.)
, then CT starts charging.
HYS
goes lower than or equal to VS to the time VCC
CC
charged successively.
(6) After T
passes, and VCC level exceeds VS + V
PO
, then RESET goes high.
HYS
(7) Same as Point 4.
(8) RESET
remains low until VCC drops below 0.8V.
3
Page 4
MB3771
ABSOLUTE MAXIMUM RATINGS
■
ParameterSymbol
Unit
MinMax
Rating
Power supply voltageV
V
Input voltage
V
V
Power dissipationP
CC
SA
SB
SC
D
−0.3+20V
−0.3V
CC + 0.3 ( < +20) V
−0.3 +20V
−0.3+20V
⎯200 (Ta ≤ 85 °C) mW
Storage temperatureTstg−55 +125 °C
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
■
ParameterSymbol
Power supply voltageV
I
CC
RESET
MinMax
3.518V
020mA
Value
Unit
Output current
I
OUTC
06mA
Operating ambient temperatureTa−40 +85 °C
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
4
Page 5
ELECTRICAL CHARACTERISTICS
■
1.DC Characteristics
ParameterSymbolConditions
MB3771
= 5 V, Ta = + 25 °C)
(VCC
Value
MinTypMax
Unit
Power supply current
I
I
V
(DOWN)
Detection voltage
SAH
V
Hysteresis widthV
Detection voltageV
Deviation of detection voltage∆V
Hysteresis widthV
I
Input current
I
V
Output voltage
V
Output sink currentI
RESET
CT charge currentI
CC1
CC2
SAL
(UP)
HYSA
SB
SB
HYSB
IHB
ILB
OHR
OLR
CT
VSB = 5 V, VSC = 0 V⎯350500 µA
VSB = 0 V, V
V
CC
0 V⎯400600µA
SC =
4.104.204.30V
Ta = −40 °C to +85 °C4.054.204.35V
CC
V
4.204.304.40V
Ta = −40 °C to +85 °C4.154.304.45V
⎯50100150mV
V
SB
1.2121.2301.248V
Ta = −40 °C to +85 °C1.2001.2301.260V
VCC = 3.5 V to 18 V⎯310mV
⎯142842mV
VSB = 5 V⎯0250nA
VSB = 0 V⎯20250nA
I
= −5µA, VSB = 5 V4.54.9⎯V
RESET
I
= 3mA, VSB = 0 V⎯0.280.4V
RESET
I
= 10mA, VSB = 0 V⎯0.380.5V
RESET
V
= 1.0 V, VSB = 0 V2040⎯mA
OLR
VSB = 5 V, VCT = 0.5 V91216µA
Input current
I
I
Detection voltageV
Deviation of detection voltage∆V
Output leakage currentI
reduces the minimum supply voltage of the RESET output, but requires resistance with higher allo wab le loss .
CC
3
R
5 V output(Stablized)
0.47 µF
1
2
3
4
8
7
6
5
RESE
R1
R2
CT
R4:
100 kΩ
R
5:
33 kΩ
8
Page 9
MB3771
4.5 V and 12 V Power Supply Monitor (2 types of power supply monitor V
CC1
= 5 V, V
• 5 V is monitored by VSA. Detection voltage is about 4.2 V
• 12 V is monitored by V
. When R1 = 390 kΩ and R2 = 62 kΩ, Detection voltage is about 9.0 V.Generally the
SB
detection voltage is determined by the following equation.
Detection Voltage = (R
+ R2) × VSB/R
1
VCC2
VCC1
2
MB3771
1
CT
2
3
4
5.5 V and 12 V Po wer Suppl y Monitor (RESET signal is generated by 5 V, V
8
7
6
5
R
1: 390 kΩ
R2: 62 kΩ
RESET
Logic
circuit
CC1
= 5 V, V
• 5 V is monitored by VSA, and generates RESET signal when VSA detects voltage sagging.
• 12 V is monitored by V
, and generates its detection signal at OUTC.
SC
• The detection voltage of 12 V monitoring and its hysteresis is determined by the following equations.
+ R2 + R
Detection voltage =
1
R
R
2
+ R
3
× V
3
SC
(8.95 V in the circuit above)
CC2
=12 V)
CC2
= 12 V)
Hysteresis width =
V
V
CC2
CC1
R
(R3 − R3 // R4)
1
(R
+ R3) (R2 + R3 // R4)
2
1
: 390 kΩ
R
R
2
: 33 kΩ
R
4
: 510 kΩ
R
3
: 30 kΩ
× V
R
5
: 100 kΩ
SC
(200 mV in the circuit above)
L
: 10 kΩ
R
MB3771
1
2
3
4
C
T
8
7
6
5
RESET
or
IRQ
Port Logic Circuit
9
Page 10
MB3771
6.5 V Power Supply Monitor with forced RESET input (VCC = 5 V)
RESIN is an TTL compatible input.
RESIN
VCC
MB3771
1
2
C
T
3
4
8
7
6
5
RESET
Logic Circuit
7.5 V Power Supply Monitor with Non-inverted RESET
In this case, Comparator C is used to invert RESET signal. OUTC is an open-collector output.
RL is used an a pull-up resistor.
V
CC
RL: 10 kΩ
CT
RESET
MB3771
1
2
3
4
8
7
6
5
8.Supply Voltage Monitoring with Delayed Trigger
When the voltage shown in the diagram below is applied at VCC, the minimum value of the input pulse width is
increased to 40 µs (when C
The formula for calculating the minimum value of the input pulse width [T
T
[µs] := 4 × 10-2 × C1 [pF]
PI
CC
V
10
1
5 V
4 V
= 1000 pF).
TP
CT
MB3771
1
2
3
4
] is:
PI
8
7
6
5
RESET
C1
Page 11
MB3771
9.Dual (Positive/Negative) Power Supply Voltage Monitoring (VCC = 5 V, VEE = Negative Power
Supply)
Monitors a 5 V and a negative (any given level) power supply. R1, R2, and R3 should be the same value.
Detection Voltage = V
SB
Example if VEE = −5 V, R4 = 91 kΩ
Then the detected voltage = −4.37 V
− V
× R4/R
SB
3
In cases where V
may be output when VCC is not output, it is necessary to use a Schottky barrier diode (SBD).
EE
V
CC
R5 : 5.1 kΩ
4
R
V
EE
0.22 µF
C
T
3
R
20 kΩ
SBD
:
MB3771
1
2
3
4
8
7
6
5
R
1
R
2
RESET
: 20 kΩ
: 20 kΩ
10. Reference Voltage Generation and Voltage Sagging Detection
(1) 9V Reference Voltage Generation and 5V/9V Monitoring
Detection Voltage = 7.2 V
In the above e xamples , the output v oltage and the detection v oltage are determined by the f ollowing equations:
Detection Voltage = (R
+ R2) × VSB/R
1
2
15 V
V
CC
: 5 V
R
5
: 3 kΩ
MB3771
8
7
6
5
3
:
R
7.5 kΩ
R
4
:
1.2 kΩ
RESET
9 V (≅ 50 mA)
R
1
: 300 kΩ
R
2
: 62 kΩ
0.47 µF
C
T
1
2
3
4
11
Page 12
MB3771
T
G
T
(
(2) 5 V Reference Voltage Generation and 5V Monitoring (No.1)
Detection Voltage = 4.2 V
In the above e xamples , the output v oltage and the detection v oltage are determined by the f ollowing equations:
Output Voltage = (R
15 V
(3) 5 V Reference Voltage Generation and 5 V Monitoring (No. 2)
+ R4) × VSC/R
3
CT
0.47 µF
4
5 : 3 kΩ
R
MB3771
1
2
3
4
8
7
6
5
R
3 : 3.6 kΩ
4 : 1.2 kΩ
R
RESET
5 V(≅ 50 mA)
The value of R
R
, and the 5 V output current. The table below provides sample resistance values for reference.
3
should be calculated from the current consumption of the MB3771, the current flowing at R2 and
1
CC
(V) R1 (kΩ)
V
Output Current
4011< 1.6
246.2< 1.4
154.7< 0.6
V
CC
1
R
1
ND
8
7
2
3
6
4
C
T
R2 :
100 kΩ
3
: 33 kΩ
R
5
0.47 µF
RESE
5 V
(4) 1.245 V Reference Voltage Generation and 5 V Monitoring
Resistor R
determines Reference current. Using 1.2 kΩ as R1, reference current is about 2 mA.
1
(mA)
VCC
5 V)
GND
CT
0.47 µF
R
1 : 10 kΩ
1
2
3
4
8
7
6
5
RESE
Reference Voltage
1.245 V Typ
12
Page 13
MB3771
11. Low Voltage and Over Voltage Detection (VCC = 5 V)
VSH has no hysteresis. When over voltage is detected, RESET is held in the constant time as well as when
low voltage is detected.
V
= (R1 + R2) × VSB/R
SL
VSH = (R3 + R4) × VSC/R
RESET
V
2
4
V
CC
R
R
3
1
MB3771
1
2
R
4
C
T
V
SL
V
SH
CC
3
4
8
7
6
5
RESET
R
2
12. Detection of Abnormal State of Power Supply System (VCC = 5 V)
• This Example circuit detects abnormal low/over v o ltage of power supply voltage and is indicated by LED
indicator. LED is reset by the CLEAR key.
• The detection levels of low/over voltages are determined by V
CC
V
R1
MB3771
1
2
R
2
3
4
8
7
6
5
, and R1 and R2 respectively.
SA
LED
R3: 620 Ω
R
4:
1 kΩ to 100 kΩ
CLEAR
13
Page 14
MB3771
V
13. Back-up Power Supply System (VCC = 5 V)
• Use CMOS Logic and connect VDD of CMOS logic with V
• The back-up battery works after CS goes high as V
• During t
• CS‘s threshold voltage V
V
= VF + (R1 + R2 + R3) × VSB/R
1
When V1 is 4.45 V or less, connect 7 pin with VCC.
When V
• The voltage to change V
V
= VF + (R1 + R2 + R3) × VSC/ (R2 + R3)
2
However, please set V
, memory access is prohibited.
PO
is determined by the following equation:
1
3
is 4.45 V or more, 7 pin can be used to open.
1
is provided as the following equation:
2
to 3.5 V or more.
2
VCC
V1
V2
CS
< V1.
2
CCO
.
t
TPO
t
CCO
t
CC
V
MB3771
1
C
T
2
3
4
8
7
6
5
R
3
: 56 kΩ
D
1
V
F
0.6 V
1
: 100 kΩ
R
R2: 6.2 kΩ
4
>1 kΩ
R
R
5
: 100 kΩ
R
6
: 100 kΩ
V
CS
CCO
* : Diode has been added to prevent Comp.C from malfunctioning when VCC voltage is low.
Set V
and V2 with care given to VF temperature characteristics (typically negative temperature
1
characteristics).
14
Page 15
TYPICAL CHARACTERISTICS
■
Power supply current (I
power supply voltage
700
A)
µ
(
600
CC1
500
400
300
200
100
0
Power supply current I
Ta =
+25°C
−40°C
+85°C
−40°C
+25°C
+85°C
05101520
Power supply voltage V
CC1
) vs.
CC
(V)
SC
Detection voltage (V
) vs.
Operating ambient temperature
1.30
(V)
SC
1.25
Detection voltage V
1.20
− 50−250+25+50+75+100
Operating ambient temperature Ta (°C)
MB3771
Power supply current (I
power supply voltage
A)
700
µ
(
600
CC2
500
400
300
200
100
Power supply current I
Ta =
+85°C
−40°C
−40°C
+25°C
+85°C
0
05101520
Power supply voltage V
Output voltage (RESET
5
(V)
4
RESET
3
2
CC2
) vs.
+25°C
CC
(V)
) vs. power supply voltage
SB
Detection voltage (V
) vs.
Operating ambient temperature
(V)
1.30
SBL
,V
SBH
1.25
1.20
−50−250+25+50+75+100
Detection voltage V
Operating ambient temperature Ta (°C)
Detection voltage (V
SA
) vs.
Operating ambient temperature
4.5
(V)
SAL
4.4
,V
SAH
4.3
4.2
SBH
V
VSBL
SAH
V
VSAL
Ta =
1
+25°C
+85°C
Output voltage V
0
0123 45
−40°C
Power supply voltage V
CC
(V)
4.1
4.0
−50−250+25+50+75+100
Detection voltage V
Operating ambient temperature Ta (°C)
(Continued)
15
Page 16
MB3771
(Continued)
Detection voltage (V
1.27
(V)
SBH
,V
SBL
, V
SC
1.26
1.25
1.24
1.23
1.22
1.21
1.20
05101520
SBH
V
V
SC
V
SBL
Power supply voltage VCC (V)
Detection voltage V
Reset hold time (tPO) vs.
power supply voltage (C
1.5
(ms)
PO
1.0
SB
, VSC) vs. Power supply voltage
T
= 0.01µF)
Ta =
− 40°C
+25°C
+85°C
Output voltage (V
5.0
OHR
) vs. output current
(V)
OHR
4.5
Output voltage V
4.0
0− 5−10−15
Output current I
OLR
Output voltage (V
2.0
) vs. output sink current
Ta =
− 40°C
RESET
Ta =
+25°C
(µA)
− 40°C
(V)
OLR
1.0
+85°C
+85°C
0.5
Reset hold time t
0
05101520
Power supply voltage V
Reset hold time (t
10
1
(s)
PO
100 m
10 m
1 m
µ
100
10
µ
Reset hold time t
1
µ
10 p
1 p0.1 µ1 µ10 µ100
PO
) vs. CT pin capacitance
Ta =
− 40°C
100 p 1000 p
+25°C
0.01
+85°C
µ
CT pin capacitance (F)
CC
(V)
+25°C
Output voltage V
0
0102030 5040
RESET
OLC
(mA)
) vs.
Output sink current I
Output voltage (V
output sink current
1.0
(V)
OLC
0.5
Output voltage V
µ
0
05101520
Output sink current I
Ta =
− 40°C
+25°C
OUTC
+85°C
(mA)
16
Page 17
MB3771
NOTES ON USE
■
• Take account of common impedance when designing the earth line on a printed wiring board.
• Take measures against static electricity.
- For semiconductors, use antistatic or conductive containers.
- When storing or carrying a printed circuit board after chip mounting, put it in a conductive bag or container.
- The work table, tools and measuring instruments must be grounded.
- The worker must put on a grounding device containing 250 kΩ to 1 MΩ resistors in series.
• Do not apply a negative voltage
- Applying a negative voltage of −0.3 V or less to an LSI may generate a parasitic transistor, resulting in
malfunction.
ORDERING INFORMATION
■
Part numberPackageRemarks
MB3771PF-❏❏❏
MB3771PF-❏❏❏E1
RoHS Compliance Information of Lead (Pb) Free version
■
The LSI products of Fujitsu with “E1” are compliant with RoHS Directive , and has observed the standard of
lead, cadmium, mercury, Hexavalent chromium, polybrominated biphen yls (PBB) , and polybrominated diphenyl
ethers (PBDE) .
The product that conforms to this standard is added “E1” at the end of the part number.
MARKING FORMAT (Lead Free version)
■
Lead-Free version
8-pin Plastic SOP
(FPT-8P-M01)
8-pin Plastic SOP
(FPT-8P-M01)
Conventional version
Lead Free version
3771
E1XXXX
INDEX
XXX
17
Page 18
MB3771
LABELING SAMPLE (Lead free version)
■
MB123456P - 789 - GE1
(3N) 1MB123456P-789-GE1
lead-free mark
JEITA logoJEDEC logo
1000
G
Pb
(3N)2 1561190005 107210
1,000
PCS
MB123456P - 789 - GE1
2006/03/01
MB123456P - 789 - GE1
1561190005
QC PASS
ASSEMBLED IN JAPAN
1/1
0605 - Z01A
Lead-Free version
1000
18
Page 19
MB3771
MB3771PF-
■
E1 Recommended Conditions of Moisture Sensitivity Level
30 °C, 70%RH or less (the lowest possible humidity)
Please use it within two years after
Manufacture.
Less than 8 days
Please processes within 8 days
after baking (125 °C, 24H)
[Temperature Profile for FJ Standard IR Reflow]
(1) IR (infrared reflow)
H rank : 260 °C Max.
260 °C
255 °C
220 °C
170 °C
to
190 °C
RT
(a)
(a) Temperature Increase gradient : Average 1 °C/s to 4 °C/s
(b) Preliminary heating : Temperature 170 °C to 190 °C, 60s to 180s
(c) Temperature Increase gradient : Average 1 °C/s to 4 °C/s
(d) Actual heating : Temperature 260 °C MAX; 255 °C or more, 10s or less
(d’) Main heating : Temperature 230 °C or more, 40s or less
Temperature 225 °C or more, 60s or less
Temperature 220 °C or more, 80s or less
(e) Cooling : Natural cooling or forced cooling
Note : Temperature : the top of the package body
(2) Manual soldering (partial heating method)
Conditions : Temperature 400 °C MAX
(b)
(c)
(d)
(d')
(e)
or
or
Times : 5 s max/pin
19
Page 20
MB3771
PACKAGE DIMENSIONS
■
8-pin plastic SOPLead pitch1.27 mm
8-pin plastic SOP
(FPT-8P-M01)
1
6.35
*
(FPT-8P-M01)
+.010
+0.25
–.008
–0.20
.250
58
Package width
package length
×
5.3 × 6.35 mm
Lead shapeGullwing
Sealing methodPlastic mold
Mounting height2.25 mm MAX
Weight0.10 g
Code
(Reference)
Note 1)*1 : These dimensions include resin protrusion.
Note 2)*2 : These dimensions do not include resin protrusion.
Note 3)Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.17
.007
+0.03
–0.04
+.001
–.002
P-SOP8-5.3×6.35-1.27
14
1.27(.050)
C
2002 FUJITSU LIMITED F08002S-c-6-7
INDEX
0.10(.004)
0.10(.004)
2
*
(.209±.012) (.307±.016)
0.47±0.08
(.019±.003)
0.13(.005)
7.80±0.405.30±0.30
Details of "A" part
"A"
M
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
2.00
.079
0.25(.010)
˚
0~8
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
+0.25
–0.15
(Mounting height)
+.010
–.006
+0.10
0.10
–0.05
+.004
–.002
.004
(Stand off)
20
Page 21
MB3771
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-party’s
intellectual property right or other right by using such information.
Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
EditedBusiness Promotion Dept.
F0605
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