The MAX8732/MAX8733/MAX8734 dual step-down,
switch-mode power-supply (SMPS) controllers generate
logic-supply voltages in battery-powered systems. The
MAX8732/MAX8733/MAX8734 include two pulse-width
modulation (PWM) controllers, adjustable from 2V to 5.5V
or fixed at 5V and 3.3V. These devices feature two linear
regulators providing 5V and 3.3V always-on outputs. Each
linear regulator provides up to 100mA output current with
automatic linear-regulator bootstrapping to the main
SMPS outputs. The MAX8732/MAX8733/MAX8734 include
on-board power-up sequencing, a power-good (PGOOD)
output, digital soft-start, and internal soft-stop output discharge that prevents negative voltages on shutdown.
Maxim’s proprietary Quick-PWM™ quick-response, constant on-time PWM control scheme operates without
sense resistors and provides 100ns response to load transients while maintaining a relatively constant switching frequency. The unique ultrasonic pulse-skipping mode
maintains the switching frequency above 25kHz, which
eliminates noise in audio applications. Other features
include pulse skipping, which maximizes efficiency in
light-load applications, and fixed-frequency PWM mode,
which reduces RF interference in sensitive applications.
The MAX8732 features a 200kHz/5V and 300kHz/3.3V
SMPS for highest efficiency, while the MAX8733 features
a 400kHz/5V and 500kHz/3.3V SMPS for “thin and light”
applications. The MAX8734 provides a pin-selectable
switching frequency, allowing either 200kHz/300kHz or
400kHz/500kHz operation of the 5V/3.3V SMPSs, respectively. The MAX8732/MAX8733/MAX8734 are available in
28-pin QSOP packages and operate over the extended
temperature range (-40°C to +85°C).
The MAX8732/MAX8733/MAX8734 are pin-for-pin
upgrades to the MAX1777/MAX1977/MAX1999.
The MAX1999 Evaluation Kit can be used to evaluate
the MAX8732/MAX8733/MAX8734.
Applications
Notebook and Subnotebook Computers
PDAs and Mobile Communication Devices
3- and 4-Cell Li+ Battery-Powered Devices
Features
♦ No Current-Sense Resistor Needed (MAX8734)
♦ Accurate Current Sense with Current-Sense
Resistor (MAX8732/MAX8733)
♦ 1.5% Output Voltage Accuracy
♦ 3.3V and 5V 100mA Bootstrapped Linear
Regulators
♦ Internal Soft-Start and Soft-Stop Output
Discharge
♦ Quick-PWM with 100ns Load Step Response
♦ 3.3V and 5V Fixed or Adjustable Outputs
(Dual Mode™)
♦ 4.5V to 24V Input Voltage Range
♦ Enhanced Ultrasonic Pulse-Skipping Mode
(25kHz min)
♦ Power-Good (PGOOD) Signal
♦ Overvoltage Protection Enable/Disable
(Circuit of Figure 1 and Figure 2, no load on LDO5, LDO3, OUT3, OUT5, and REF, V+ = 12V, ON3 = ON5 = VCC, V
SHDN
= 5V,
T
A
= 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V+, SHDN to GND..................................................-0.3V to +25V
BST_ to GND ..........................................................-0.3V to +30V
LX_ to BST_ ..............................................................-6V to +0.3V
CS_ to GND (MAX8732/MAX8733 only)......................-2V to +6V
V
CC
, LDO5, LDO3, OUT3, OUT5, ON3, ON5, REF,
FB3, FB5, SKIP, PRO, PGOOD to GND ...............-0.3V to +6V
DH3 to LX3 ..............................................-0.3V to (V
BST3
+ 0.3V)
DH5 to LX5 ..............................................-0.3V to (V
BST5
+ 0.3V)
ILIM3, ILIM5 to GND...................................-0.3V to (V
CC
+ 0.3V)
DL3, DL5 to GND....................................-0.3V to (V
LDO5
+ 0.3V)
TON to GND (MAX8734 only)...................................-0.3V to +6V
LDO3, LDO5, REF Short Circuit to GND ....................Momentary
LDO3 Current (Internal Regulator) Continuous ..............+100mA
LDO3 Current (Switched Over to OUT3) Continuous.....+200mA
LDO5 Current (Internal Regulator) Continuous ..............+100mA
LDO5 Current (Switched Over to OUT5) Continuous.....+200mA
DL_ Gate-Driver Source CurrentDL3 (source), DL5 (source), forced to 2V1.7A
DL_ Gate-Driver Sink CurrentDL3 (sink), DL5 (sink), forced to 2V3.3A
DH_ Gate-Driver On-ResistanceBST - LX_ forced to 5V1.54.0Ω
DL_ Gate-Driver On-Resistance
PARAMETERCONDITIONSMINTYPMAXUNITS
FB3 or FB5 delay with 50mV overdrive10µs
FB3 or FB5 with respect to nominal output, falling edge,
typical hysteresis = 1%
= 4mA0.3V
SINK
FB3 or FB5 with respect to nominal output voltage657075%
From ON_ signal102235ms
= V
FB3
Low level0.6
High level1.5
Low level0.8
Float level1.72.3SKIP Input Voltage
High level2.4
Low level0.8
High level2.4
Clear fault level/SMPS off level0.8
Delay start level1.72.3ON3, ON5 Input Voltage
SMPS on level2.4
V
PRO
V
ON_
V
SKIP
V
SHDN
V
CS_
V
ILIM3
Rising edge1.21.62.0
Falling edge0.961.001.04
DH3, DH5 forced to 2V2A
DL_, high state (pullup)2.25.0
DL_, low state (pulldown)0.61.5
3.3V SMPS Current-Sense Input. Connect CS3 to a current-sensing resistor from the source of
the synchronous rectifier to GND. The voltage at ILIM3 determines the current-limit threshold
(see the Current-Limit (ILIM) Circuit section).
Power-Good Output. PGOOD is an open-drain output that is pulled low if either output is
disabled or is more than 10% below its nominal value.
3.3V SMPS Enable Input. The 3.3V SMPS is enabled if ON3 is greater than the SMPS on level
and disabled if ON3 is less than the SMPS off level. If ON3 is connected to REF, the 3.3V
SMPS starts after the 5V SMPS reaches regulation (delay start). Drive ON3 below the clear
fault level to reset the fault latches.
5V SMPS Enable Input. The 5V SMPS is enabled if ON5 is greater than the SMPS on level and
disabled if ON5 is less than the SMPS off level. If ON5 is connected to REF, the 5V SMPS
starts after the 3.3V SMPS reaches regulation (delay start). Drive ON5 below the clear fault
level to reset the fault latches.
3.3V SMPS Current-Limit Adjustment. The GND-LX current-limit threshold defaults to 100mV if
ILIM3 is connected to V
seen at ILIM3 over a 0.5V to 3V range. The logic threshold for switchover to the 100mV default
value is approximately V
Shutdown Control Input. The device enters its 6µA supply current shutdown mode if
V
is less than the SHDN input falling-edge trip level and does not restart until V
SHDN
greater than the SHDN input rising-edge trip level. Connect SHDN to V+ for automatic startup.
SHDN can be connected to V+ through a resistive voltage-divider to implement a
programmable undervoltage lockout.
3.3V SMPS Feedback Input. Connect FB3 to GND for fixed 3.3V operation. Connect FB3 to a
resistive voltage-divider from OUT3 to GND to adjust the output from 2V to 5.5V.
2V Reference Output. Bypass to GND with a 0.22µF (min) capacitor. REF can source up to
100µA for external loads. Loading REF degrades FB_ and output accuracy according to the
REF load-regulation error.
5V SMPS Feedback Input. Connect FB5 to GND for fixed 5V operation. Connect FB5 to a
resistive voltage-divider from OUT5 to GND to adjust the output from 2V to 5.5V.
Overvoltage and Undervoltage Fault Protection Enable/Disable. Connect PRO to V
disable undervoltage, overvoltage protection, and discharge mode (DL = low in shutdown).
Connect PRO to GND to enable undervoltage and overvoltage protection (see the FaultProtection section), and output discharge mode.
5V SMPS Current-Limit Adjustment. The GND-LX current-limit threshold defaults to 100mV if
ILIM5 is connected to V
seen at ILIM5 over a 0.5V to 3V range. The logic threshold for switchover to the 100mV default
value is approximately V
Low-Noise Mode Control. Connect SKIP to GND for normal Idle-Mode (pulse-skipping)
operation or to VCC for PWM mode (fixed frequency). Connect to REF or leave floating for
. In adjustable mode, the current-limit threshold is 1/10th the voltage
CC
- 1V. Connect ILIM3 to REF for a fixed 200mV threshold.
CC
. In adjustable mode, the current-limit threshold is 1/10th the voltage
CC
- 1V. Connect ILIM5 to REF for a fixed 200mV threshold.
1616DH5High-Side MOSFET Floating Gate-Driver Output for 5V SMPS. DH5 swings from LX5 to BST5.
1717V
1818LDO5
1919DL55V SMPS Synchronous Rectifier Gate-Drive Output. DL5 swings between GND and LDO5.
2020V+
2121OUT5
2222OUT3
2323GNDAnalog and Power Ground
2424DL33.3V SMPS Synchronous-Rectifier Gate-Drive Output. DL3 swings between GND and LDO5.
2525LDO3
2626DH3High-Side MOSFET Floating Gate-Driver Output for 3.3V SMPS. DH3 swings from LX3 to BST3.
2727LX3
2828BST3
MAX8734
NAMEFUNCTION
5V SMPS Current-Sense Input. Connect CS5 to a current-sensing resistor from the source of
the synchronous rectifier to GND. The voltage at ILIM5 determines the current-limit threshold
(see the Current-Limit Circuit section).
Frequency Select Input. Connect to V
400kHz/500kHz operation (5V/3.3V SMPS switching frequencies, respectively).
Boost Flying Capacitor Connection for 5V SMPS. Connect to an external capacitor and diode
according to the typical application circuits (Figure 1 and Figure 2). See the MOSFET GateDrivers (DH_, DL_) section.
Inductor Connection for 5V SMPS. LX5 is the internal lower supply rail for the DH5 high-side
gate driver. LX5 is the current-sense input for the 5V SMPS (MAX8734 only).
Analog Supply Voltage Input for PWM Core. Connect VCC to the system supply voltage with a
CC
series 50Ω resistor. Bypass to GND with a 1µF ceramic capacitor.
5V Linear-Regulator Output. LDO5 is the gate-driver supply for the external MOSFETs. LDO5
can provide a total of 100mA, including MOSFET gate-drive requirements and external loads.
The internal load depends on the choice of MOSFET and switching frequency (see the
Reference and Linear Regulators (REF, LDO5, and LDO3) section). If OUT5 is greater than the
LDO5 bootstrap switch threshold, the LDO5 regulator shuts down and the LDO5 pin connects
to OUT5 through a 1.4Ω switch. Bypass LDO5 with a minimum of 4.7µF. Use an additional 1µF
per 5mA of load.
Power-Supply Input. V+ powers the LDO5/LDO3 linear regulators and is also used for the
Quick-PWM on-time one-shot circuits. Connect V+ to the battery input through a 4Ω resistor
and bypass with a 4.7µF capacitor.
5V SMPS Output Voltage-Sense Input. Connect to the 5V SMPS output. OUT5 is an input to the
Quick-PWM on-time one-shot circuit. It also serves as the 5V feedback input in fixed-voltage
mode. If OUT5 is greater than the LDO5 bootstrap-switch threshold, the LDO5 linear regulator
shuts down and LDO5 connects to OUT5 through a 1.4Ω switch.
3.3V SMPS Output Voltage-Sense Input. Connect to the 3.3V SMPS output. OUT3 is an input to
the Quick-PWM on-time one-shot circuit. It also serves as the 3V feedback input in fixedvoltage mode. If OUT3 is greater than the LDO3 bootstrap-switch threshold, the LDO3 linear
regulator shuts down and LDO3 connects to OUT3 through a 1.5Ω switch.
3.3V Linear-Regulator Output. LDO3 powers up after REF is in regulation. LDO3 can provide a
total of 100mA to external loads. If OUT3 is greater than the LDO3 bootstrap-switch threshold,
the LDO3 regulator shuts down and the LDO3 pin connects to OUT3 through a 1.5Ω switch.
Bypass LDO3 with a minimum of 4.7µF. Use an additional 1µF per 5mA of load.
Inductor Connection for 3.3V SMPS. LX3 is the current-sense input for the 3.3V SMPS
(MAX8734 only).
Boost Flying Capacitor Connection for 3.3V SMPS. Connect to an external capacitor and diode
according to the typical application circuits (Figure 1 and Figure 2). See the MOSFET GateDrivers (DH_, DL_) section.
CC
for 200kHz/300kHz operation and to GND for
Page 14
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
The typical application circuits (Figures 1 and 2) generate the 5V/5A and 3.3V/5A main supplies in a notebook
computer. The input supply range is 7V to 24V. Table 1
lists component suppliers.
Detailed Description
The MAX8732/MAX8733/MAX8734 dual-buck, BiCMOS,
switch-mode power-supply controllers generate logic
supply voltages for notebook computers. The
MAX8732/MAX8733/MAX8734 are designed primarily
for battery-powered applications where high efficiency
and low-quiescent supply current are critical.
The MAX8732 is optimized for highest efficiency with a
5V/200kHz SMPS and a 3.3V/300kHz SMPS, while the
MAX8733 is optimized for “thin and light” applications with a
5V/400kHz SMPS and a 3.3V/500kHz SMPS. The MAX8734
provides a pin-selectable switching frequency, allowing
either 200kHz/300kHz or 400kHz/500kHz operation of the
5V/3.3V SMPSs, respectively.
Light-load efficiency is enhanced by automatic IdleMode operation, a variable-frequency pulse-skipping
mode that reduces transition and gate-charge losses.
Each step-down, power-switching circuit consists of two
n-channel MOSFETs, a rectifier, and an LC output filter.
The output voltage is the average AC voltage at the
switching node, which is regulated by changing the duty
cycle of the MOSFET switches. The gate-drive signal to
the n-channel high-side MOSFET must exceed the
battery voltage, and is provided by a flying-capacitor
boost circuit that uses a 100nF capacitor connected
to BST_.
Each PWM controller consists of a Dual-Mode feedback
network and multiplexer, a multi-input PWM comparator,
high-side and low-side gate drivers, and logic. The
MAX8732/MAX8733/MAX8734 contain fault-protection circuits that monitor the main PWM outputs for undervoltage
and overvoltage conditions. A power-on sequence block
controls the power-up timing of the main PWMs and monitors the outputs for undervoltage faults. The
MAX8732/MAX8733/MAX8734 include 5V and 3.3V linear
regulators. Bias generator blocks include the 5V (LDO5)
linear regulator, 2V precision reference, and automatic
bootstrap switchover circuit.
Figure 4. PWM Controller (One Side Only)
V+
OUT
TON (MAX8734)
REF
ILIM_
TRIG
ONE SHOT
ON-TIME
COMPUTE
t
ON
Q
ERROR
AMPLIFIER
CURRENT
LIMIT
Σ
CS_ (MAX8732/8733)
LX_ (MAX8734)
t
OFF
TRIG
Q
ONE SHOT
ZERO
CROSSING
R
Q
S
S
Q
R
TO DH_ DRIVER
TO DL_ DRIVER
SKIP
OUT_
FB_
0.15V
PRO
0.7✕V
0.9
1.1 ✕ V
REF
PGOOD
✕
V
REF
OV_FAULT
UV_FAULT
REF
BLANKING
20ms
FAULT
LATCH
Page 18
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
These internal blocks are not powered directly from the
battery. Instead, the 5V (LDO5) linear regulator steps
down the battery voltage to supply both internal circuitry and the gate drivers. The synchronous-switch gate
drivers are directly powered from LDO5, while the highside switch gate drivers are indirectly powered from
LDO5 through an external diode-capacitor boost circuit. An automatic bootstrap circuit turns off the 5V linear regulator and powers the device from OUT5 when
OUT5 is above 4.56V.
Free-Running, Constant On-Time PWM
Controller with Input Feed-Forward
The Quick-PWM control architecture is a pseudo-fixedfrequency, constant on-time, current-mode type with
voltage feedforward. The Quick-PWM control architecture relies on the output ripple voltage to provide the
PWM ramp signal; thus the output filter capacitor’s ESR
acts as a current-feedback resistor. The high-side
switch on-time is determined by a one-shot whose period is inversely proportional to input voltage and directly
proportional to output voltage. Another one-shot sets a
minimum off-time (300ns typ). The on-time one-shot
triggers when the following conditions are met: the error
comparator is low, the synchronous rectifier current is
below the current-limit threshold, and the minimum offtime one-shot has timed out.
On-Time One-Shot (tON)
Each PWM core includes a one-shot that sets the highside switch on-time for each controller. Each fast, lowjitter, adjustable one-shot includes circuitry that varies
the on-time in response to battery and output voltage.
The high-side switch on-time is inversely proportional to
the battery voltage as measured by the V+ input, and
proportional to the output voltage. This algorithm results
in a nearly constant switching frequency despite the
lack of a fixed-frequency clock generator. The benefit
of a constant switching frequency is the frequency can
be selected to avoid noise-sensitive frequency regions:
See Table 2 for approximate K-factors. The constant
0.075V is an approximation to account for the expected
drop across the synchronous-rectifier switch. Switching
frequency increases as a function of load current due
to the increasing drop across the synchronous rectifier,
which causes a faster inductor-current discharge ramp.
On-times translate only roughly to switching frequencies. The on-times guaranteed in the ElectricalCharacteristics are influenced by switching delays in
the external high-side power MOSFET. Also, the deadtime effect increases the effective on-time, reducing the
switching frequency. It occurs only in PWM mode (SKIP
= VCC) and during dynamic output voltage transitions
when the inductor current reverses at light or negative
load currents. With reversed inductor current, the
inductor’s EMF causes LX to go high earlier than normal, extending the on-time by a period equal to the DHrising dead time.
For loads above the critical conduction point, the actual
switching frequency is:
where V
DROP1
is the sum of the parasitic voltage drops
in the inductor discharge path, including synchronous
rectifier, inductor, and PC board resistances; V
DROP2
is
the sum of the parasitic voltage drops in the charging
path, including high-side switch, inductor, and PC
board resistances, and tONis the on-time calculated by
the MAX8732/MAX8733/MAX8734.
Automatic Pulse-Skipping Switchover
(Idle Mode)
In Idle Mode (SKIP = GND), an inherent automatic
switchover to PFM takes place at light loads. This
switchover is affected by a comparator that truncates
the low-side switch on-time at the inductor current’s
zero crossing. This mechanism causes the threshold
between pulse-skipping PFM and nonskipping PWM
operation to coincide with the boundary between con-
tinuous and discontinuous inductor-current operation
(also known as the critical conduction point):
where K is the on-time scale factor (see the On-TimeOne-Shot (tON) section). The load-current level at which
PFM/PWM crossover occurs, I
LOAD(SKIP)
, is equal to 1/2
the peak-to-peak ripple current, which is a function of the
inductor value (Figure 5). For example, in the MAX8732
typical application circuit with V
OUT2
= 5V, V+ = 12V,
L = 7.6µH, and K = 5µs, switchover to pulse-skipping
operation occurs at I
LOAD
= 0.96A or about 1/5th full
load. The crossover point occurs at an even lower value
if a swinging (soft-saturation) inductor is used.
The switching waveforms may appear noisy and asynchronous when light loading causes pulse-skipping
operation, but this is a normal operating condition that
results in high light-load efficiency. Trade-offs in PFM
noise vs. light-load efficiency are made by varying the
inductor value. Generally, low inductor values produce
a broader efficiency vs. load curve, while higher values
result in higher full-load efficiency (assuming that the
coil resistance remains fixed) and less output voltage
ripple. Penalties for using higher inductor values
include larger physical size and degraded load-transient response (especially at low input-voltage levels).
DC output accuracy specifications refer to the trip level of
the error comparator. When the inductor is in continuous
conduction, the output voltage has a DC regulation higher
than the trip level by 50% of the ripple. In discontinuous
conduction (SKIP = GND, light load), the output voltage
has a DC regulation higher than the trip level by approximately 1.5% due to slope compensation.
Forced-PWM Mode
The low-noise, forced-PWM (SKIP = VCC) mode disables the zero-crossing comparator, which controls the
low-side switch on-time. Disabling the zero-crossing
detector causes the low-side, gate-drive waveform to
become the complement of the high-side, gate-drive
waveform. The inductor current reverses at light loads
as the PWM loop strives to maintain a duty ratio of
V
OUT
/V+. The benefit of forced-PWM mode is to keep
the switching frequency fairly constant, but it comes at
a cost: the no-load battery current can be 10mA to
50mA, depending on switching frequency and the
external MOSFETs.
Forced-PWM mode is most useful for reducing audiofrequency noise, improving load-transient response,
providing sink-current capability for dynamic output
voltage adjustment, and improving the cross-regulation
of multiple-output applications that use a flyback transformer or coupled inductor.
Enhanced Ultrasonic Mode
(25kHz (min) Pulse Skipping)
Leaving SKIP unconnected or connecting SKIP to REF
activates a unique pulse-skipping mode with a minimum switching frequency of 25kHz. This ultrasonic
pulse-skipping mode eliminates audio-frequency modulation that would otherwise be present when a lightly
loaded controller automatically skips pulses. In ultrasonic mode, the controller automatically transitions to
fixed-frequency PWM operation when the load reaches
the same critical conduction point (I
LOAD(SKIP)
) that
occurs when normally pulse skipping.
An ultrasonic pulse occurs when the controller detects
that no switching has occurred within the last 28µs.
Once triggered, the ultrasonic controller pulls DL high,
turning on the low-side MOSFET to induce a negative
inductor current. After the inductor current reaches the
negative ultrasonic current threshold, the controller
turns off the low-side MOFET (DL pulled low) and triggers a constant on-time (DH driven high). When the ontime has expired, the controller reenables the low-side
MOSFET until the controller detects that the inductor
current dropped below the zero-crossing threshold.
Starting with a DL pulse greatly reduces the peak output voltage when compared to starting with a DH pulse.
The output voltage at the beginning of the ultrasonic
pulse determines the negative ultrasonic current threshold, resulting in the following equation:
where VFB> V
REF
and RONis the on-resistance of the
synchronous rectifier (MAX8734) or the current-sense
resistor value (MAX8732/MAX8733).
VIRVV
ISONICL ONREFFB
==−
()
× 058.
Figure 5. Pulse- Skipping/Discontinuous Crossover Point
I
LOAD SKIP
()
KV
×
OUTOUT
=
2
L
×
VV
+ −
__
V
+
∆i
V+
- V
OUT
=
L
∆t
INDUCTOR CURRENT
-I
PEAK
I
= I
/2
LOAD
PEAK
ON-TIME0TIME
Page 20
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
The 2V reference (REF) is accurate to ±1% over temperature, making REF useful as a precision system
reference. Bypass REF to GND with a 0.22µF (min)
capacitor. REF can supply up to 100µA for external
loads. However, if extremely accurate specifications for
both the main output voltages and REF are essential,
avoid loading REF. Loading REF reduces the LDO5,
LDO3, OUT5, and OUT3 output voltages slightly
because of the reference load-regulation error.
Two internal regulators produce 5V (LDO5) and 3.3V
(LDO3). LDO5 provides gate drive for the external
MOSFETs and powers the PWM controller, logic, reference, and other blocks within the device. The LDO5
regulator supplies a total of 100mA for internal and
external loads, including MOSFET gate drive, which
typically varies from 10mA to 50mA, depending on
switching frequency and the external MOSFETs. LDO3
powers up when the reference (REF) is in regulation,
and supplies up to 100mA for external loads. Bypass
LDO5 and LDO3 with a minimum 4.7µF load; use an
additional 1µF per 5mA of internal and external load.
When the 5V main output voltage is above the LDO5
bootstrap-switchover threshold, an internal 1.4Ω p-channel MOSFET switch connects OUT5 to LDO5 while simultaneously shutting down the LDO5 linear regulator.
Similarly, when the 3.3V main output voltage is above the
LDO3 bootstrap-switchover threshold, an internal 1.5Ω
p-channel MOSFET switch connects OUT3 to LDO3 while
simultaneously shutting down the LDO3 linear regulator.
These actions bootstrap the device, powering the internal
circuitry and external loads from the output SMPS voltages, rather than through linear regulators from the bat-
tery. Bootstrapping reduces power dissipation due to
gate charge and quiescent losses by providing power
from a 90%-efficient switch-mode source, rather than
from a much-less-efficient linear regulator.
Current-Limit Circuit (ILIM_)
The current-limit circuit employs a “valley” current-sensing algorithm. The MAX8734 uses the on-resistance of
the synchronous rectifier, while the MAX8732/MAX8733
use a discrete resistor in series with the source of the
synchronous rectifier as a current-sensing element. If the
magnitude of the current-sense signal at CS_
(MAX8732/MAX8733)/LX_ (MAX8734) is above the current-limit threshold, the PWM is not allowed to initiate a
new cycle (Figure 7). The actual peak current is greater
than the current-limit threshold by an amount equal to the
inductor ripple current. Therefore, the exact current-limit
characteristic and maximum load capability are a function of the current-limit threshold, inductor value, and
input and output voltage.
For the MAX8732/MAX8733, connect CS_ to the junction
of the synchronous rectifier source and a current-sense
resistor to GND. With a current-limit threshold of 100mV,
the accuracy is approximately ±7%. Using a lower current-sense threshold results in less accuracy. The current-sense resistor only dissipates power when the
synchronous rectifier is on.
For lower power dissipation, the MAX8734 uses the onresistance of the synchronous rectifier as the currentsense element. Use the worst-case maximum value for
R
DS(ON)
from the MOSFET data sheet, and add some
margin for the rise in R
DS(ON)
with temperature. A good
general rule is to allow 0.5% additional resistance for
each °C of temperature rise. The current limit varies
with the on-resistance of the synchronous rectifier. The
reward for this uncertainty is robust, lossless overcurrent sensing. When combined with the undervoltage-
protection circuit, this current-limit method is effective
in almost every circumstance.
A negative current limit prevents excessive reverse
inductor currents when V
OUT
sinks current. The negative current-limit threshold is set to approximately 120%
of the positive current limit and therefore tracks the
positive current limit when ILIM_ is adjusted.
The current-limit threshold is adjusted with an external
voltage-divider at ILIM_. The current-limit threshold
adjustment range is from 50mV to 300mV. In the
adjustable mode, the current-limit threshold voltage is
precisely 1/10th the voltage at ILIM_. The threshold
defaults to 100mV when ILIM_ is connected to VCC.
The logic threshold for switchover to the 100mV default
value is approximately VCC- 1V.
Carefully observe the PC board layout guidelines to
ensure that noise and DC errors do not corrupt the current-sense signals at CS_. Mount or place the device
close to the synchronous rectifier or sense resistor
(whichever is used) with short, direct traces, making a
Kelvin sense connection to the sense resistor. The current-sense accuracy of Figure 8 is degraded if the
Schottky diode conducts during the synchronous rectifier on-time. To ensure that all current passes through
the sense resistor, connect the Schottky diode in parallel with only the synchronous recifier (Figure 9) if the
voltage drop across the synchronous rectifier and
sense resistor exceeds the Schottky diode’s forward
voltage. Note that at high temperatures, the on-resistance of the synchronous rectifier increases and the
forward voltage of the Schottky diode decreases.
MOSFET Gate Drivers (DH_, DL_)
The DH_ and DL_ gate drivers sink 2.0A and 3.3A
respectively of gate drive, ensuring robust gate drive for
high-current applications. The DH_ floating high-side
MOSFET drivers are powered by diode-capacitor charge
pumps at BST_. The DL_ synchronous-rectifier drivers are
powered by LDO5.
The internal pulldown transistors that drive DL_ low
have a 0.6Ω typical on-resistance. These low on-resistance pulldown transistors prevent DL_ from being
pulled up during the fast rise time of the inductor nodes
due to capacitive coupling from the drain to the gate of
the low-side synchronous-rectifier MOSFETs. However,
for high-current applications, some combinations of
high- and low-side MOSFETS may cause excessive
gate-drain coupling, which leads to poor efficiency and
EMI-producing shoot-through currents. Adding a resistor in series with BST_ increases the turn-on time of the
Figure 8. Current Sensing Using Sense Resistor
(MAX8732/MAX8733)
Figure 9. More Accurate Current Sensing with Adjusted
Schottky Connection
Figure 10. Reducing the Switching-Node Rise Time
MAX8732
MAX8733
DH_
LX_
DL_
CS_
MAX8732
MAX8733
DH_
LX_
V+
OUT_
V+
OUT_
5V
V
IN
10Ω
BST
DL_
CS_
DH
LX
MAX8732
MAX8733
MAX8734
Page 22
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
high-side MOSFETs at the expense of efficiency, without
degrading the turn-off time (Figure 10).
Adaptive dead-time circuits monitor the DL_ and DH_
drivers and prevent either FET from turning on until the
other is fully off. This algorithm allows operation without
shoot-through with a wide range of MOSFETs, minimizing delays and maintaining efficiency. There must be
low-resistance, low-inductance paths from the gate drivers to the MOSFET gates for the adaptive dead-time circuit to work properly. Otherwise, the sense circuitry
interprets the MOSFET gate as “off” when there is actually charge left on the gate. Use very short, wide traces
measuring 10 to 20 squares (50mils to 100mils wide if
the MOSFET is 1in from the device).
POR, UVLO, and Internal Digital
Soft-Start
Power-on reset (POR) occurs when V+ rises above
approximately 1V, resetting the undervoltage, overvoltage, and thermal-shutdown fault latches. LDO5
undervoltage-lockout (UVLO) circuitry inhibits switching
when LDO5 is below 4V. DL_ is low if PRO is disabled;
DL_ is high if PRO is enabled. The output voltages
begin to ramp up once VCCexceeds its 4V UVLO and
REF is in regulation. The internal digital soft-start timer
begins to ramp up the maximum-allowed current limit
during startup. The 1.7ms ramp occurs in five steps:
20%, 40%, 60%, 80%, and 100%.
Power-Good Output (PGOOD)
The PGOOD comparator continuously monitors both output voltages for undervoltage conditions. PGOOD is
actively held low in shutdown, standby, and soft-start.
PGOOD releases and digital soft-start terminates when
BOTH outputs reach the error-comparator threshold.
PGOOD goes low if EITHER output turns off or is 10%
below its nominal regulation point. PGOOD is a true
open-drain output. Note that PGOOD is independent of
the state of PRO.
Fault Protection
The MAX8732/MAX8733/MAX8734 provide over/undervoltage fault protection. Drive PRO low to activate fault
protection. Drive PRO high to disable fault protection.
Once activated, the devices continuously monitor for
both undervoltage and overvoltage conditions.
Overvoltage Protection
When the output voltage is 11% above the set voltage,
the overvoltage fault protection activates. The synchronous rectifier turns on 100% and the high-side MOSFET
turns off. This rapidly discharges the output capacitors,
decreasing the output voltage. The output voltage may
dip below ground. For loads that cannot tolerate a negative voltage, place a power Schottky diode across the
output to act as a reverse-polarity clamp. In practical
applications, there is a fuse between the power source
(battery) and the external high-side switches. If the
overvoltage condition is caused by a short in the highside switch, turning the synchronous rectifier on 100%
creates an electrical short between the battery and
GND, blowing the fuse and disconnecting the battery
from the output. Once an overvoltage fault condition is
set, it can only be reset by toggling SHDN, ON_, or
cycling V+ (POR).
Undervoltage Protection
When the output voltage is 30% below the set voltage for
over 22ms (undervoltage shutdown blanking time), the
undervoltage fault protection activates. Both SMPSs stop
switching. The two outputs start to discharge (see the
Discharge Mode (Soft-Stop) section). When the output
voltage drops to 0.3V, the synchronous rectifiers turn on,
clamping the outputs to GND. Toggle SHDN or ON_, or
cycle V+ (POR) to clear the undervoltage fault latch.
Thermal Protection
The MAX8732/MAX8733/MAX8734 have thermal shutdown to protect the devices from overheating. Thermal
shutdown occurs when the die temperature exceeds
+160°C. All internal circuitry shuts down during thermal
shutdown. The MAX8732/MAX8733/MAX8734 may trigger thermal shutdown if LDO_ is not bootstrapped from
OUT_ while applying a high input voltage on V+ and
drawing the maximum current (including short circuit)
from LDO_. Even if LDO_ is bootstrapped from OUT_,
overloading the LDO_ causes large power dissipation
on the bootstrap switches, which may result in thermal
shutdown. Cycling SHDN, ON3, ON5, or a V+ (POR)
ends the thermal-shutdown state.
Discharge Mode (Soft-Stop)
When PRO is low and a transition to standby or shutdown mode occurs, or the output undervoltage fault
latch is set, the outputs discharge to GND through an
internal 12Ω switch, until the output voltages decrease
to 0.3V. The reference remains active to provide an
accurate threshold and to provide overvoltage protection. When both SMPS outputs discharge to 0.3V, the
DL_ synchronous rectifier drivers are forced high. The
synchronous rectifier drivers clamp the SMPS outputs
to GND. When PRO is high, the SMPS outputs do not
discharge and the DL_ synchronous rectifier drivers
remain low.
Drive SHDN below the precise SHDN input falling-edge
trip level to place the MAX8732/MAX8733/MAX8734
in their low-power shutdown state. The MAX8732/
MAX8733/MAX8734 consume only 6µA of quiescent
current while in shutdown mode. When shutdown mode
activates, the reference turns off, making the threshold
to exit shutdown inaccurate. To guarantee startup, drive
SHDN above 2V (SHDN input rising-edge trip level). For
automatic shutdown and startup, connect SHDN to V+.
If PRO is low, both SMPS outputs are discharged
to 0.3V through a 12Ω switch before entering True
Shutdown™. The accurate 1V falling-edge threshold on
SHDN can be used to detect a specific analog voltage
level and shut down the device. Once in shutdown, the
1.6V rising-edge threshold activates, providing sufficient
hysteresis for most applications. For additional hysteresis, the undervoltage threshold can be made dependent
on REF or LDO_, which go to 0V in shutdown.
Power-Up Sequencing and
On/Off Controls (ON3, ON5)
ON3 and ON5 control SMPS power-up sequencing.
ON3 or ON5 rising above 2.4V enables the respective
outputs. ON3 or ON5 falling below 1.6V disables the
respective outputs.
Connecting ON3 or ON5 to REF forces the respective
outputs off while the other output is below regulation and
Table 3. Operating-Mode Truth Table
Table 4. Power-Up Sequencing
True Shutdown is a trademark of Maxim Integrated Products, Inc.
MODECONDITIONCOMMENT
Power-UpLDO5 < UVLO threshold
Run
Overvoltage
Protection
Undervoltage
Protection
Discharge
Standby
ShutdownSHDN = lowAll circuitry off
Thermal ShutdownTJ > +160°CAll circuitry off. Exited by V+ POR or cycling SHDN, ON3, or ON5.
SHDN = high, ON3 or ON5
enabled
Either output > 111% of
nominal level, PRO = low
Either output < 70% of
nominal after 22ms timeout expires and output is
enabled, PRO = low
PRO is low and either
SMPS output is still high in
either standby mode or
shutdown mode
ON5, ON3 < startup
threshold, SHDN = high
Transitions to discharge mode after a V+ POR and after REF becomes valid.
LDO5, LDO3, and REF remain active. DL_ is active if PRO is low.
Normal operation
DL_ is forced high. LDO3, LDO5 active. Exited by a V+ POR or by toggling
SHDN, ON3, or ON5.
If PRO is low, DL_ is forced high after discharge mode terminates. LDO3,
LDO5 active. Exited by a V+ POR or by toggling SHDN, ON3, or ON5.
Discharge switch (12Ω) connects OUT_ to PGND. One output may still run
while the other is in discharge mode. Activates when LDO_ is in UVLO, or
transition to UVLO, standby, or shutdown has begun. LDO3, LDO5 active.
starts after that output regulates. The second SMPS
remains on until the first SMPS turns off, the device shuts
down, a fault occurs, or LDO5 goes into undervoltage
lockout. Both supplies begin their power-down sequence
immediately when the first supply turns off. Driving ON_
below 0.8V clears the overvoltage, undervoltage, and
thermal fault latches.
Adjustable-Output Feedback
(Dual-Mode FB)
Connect FB_ to GND to enable the fixed, preset SMPS
output voltages (3.3V and 5V). Connect a resistive voltage-divider at FB_ between OUT_ and GND to adjust
the respective output voltage between 2V and 5.5V
(Figure 11). Choose R2 to be approximately 10kΩ, and
solve for R1 using the equation:
where V
FB
= 2V nominal.
When using the adjustable-output mode, set the 3.3V
SMPS lower than the 5V SMPS. LDO5 connects to OUT5
through an internal switch only when OUT5 is above the
LDO5 bootstrap-switch threshold (4.56V). LDO3 connects to OUT3 through an internal switch only when
OUT3 is above the LDO3 bootstrap switch threshold
(2.91V). Bootstrapping is most effective when the fixed
output voltages are used. Once LDO_ is bootstrapped
from OUT_, the internal linear regulator turns off. This
reduces internal power dissipation and improves efficiency when LDO_ is powered with a high input voltage.
Design Procedure
Establish the input voltage range and maximum load
current before choosing an inductor and its associated
ripple-current ratio (LIR). The following four factors dictate the rest of the design:
1) Input Voltage Range. The maximum value (V+
(MAX)
)
must accommodate the maximum AC adapter voltage. The minimum value (V+
(MIN)
) must account for
the lowest input voltage after drops due to connectors, fuses, and battery selector switches. Lower input
voltages result in better efficiency.
2) Maximum Load Current. The peak load current
(I
LOAD(MAX)
) determines the instantaneous component stress and filtering requirements, and thus drives output capacitor selection, inductor saturation
rating, and the design of the current-limit circuit.
The continuous load current (I
LOAD
) determines the
thermal stress and drives the selection of input
capacitors, MOSFETs, and other critical heat-contributing components.
3) Switching Frequency. This choice determines the
basic trade-off between size and efficiency. The
optimal frequency is largely a function of maximum
input voltage and MOSFET switching losses. The
MAX8732 has a nominal switching frequency of
200kHz for the 5V SMPS and 300kHz for the 3.3V
SMPS. The MAX8733 has a nominal switching frequency of 400kHz for the 5V SMPS and 500kHz for
the 3.3V SMPS. The MAX8734 has a pin-selectable
switching frequency.
4) Inductor Ripple Current Ratio (LIR). LIR is the
ratio of the peak-peak ripple current to the average
inductor current. Size and efficiency trade-offs must
be considered when setting the inductor ripple current ratio. Low inductor values cause large ripple
currents, resulting in the smallest size, but poor efficiency and high output noise. The minimum practical inductor value is one that causes the circuit to
operate at critical conduction (where the inductor
current just touches zero with every cycle at maximum load). Inductor values lower than this grant no
further size-reduction benefit.
The MAX8732/MAX8733/MAX8734s’ pulse-skipping
algorithm (SKIP = GND) initiates skip mode at the
critical conduction point, so the inductor’s operating
point also determines the load current at which
PWM/PFM switchover occurs. The optimum point is
usually found between 20% and 50% ripple current.
The switching frequency (on-time) and operating point
(% ripple or LIR) determine the inductor value as follows:
Example: I
LOAD(MAX)
= 5A, V+ = 12V, V
OUT5
= 5V, f =
200kHz, 35% ripple current or LIR = 0.35:
Find a low-loss inductor having the lowest possible DC
resistance that fits in the allotted dimensions. Ferrite cores
are often the best choice. The core must be large enough
not to saturate at the peak inductor current (I
PEAK
):
I
PEAK
= I
LOAD(MAX)
+ [(LIR/2) x I
LOAD(MAX)
]
The inductor ripple current also impacts transientresponse performance, especially at low V+ - V
OUT_
differences. Low inductor values allow the inductor current to slew faster, replenishing charge removed from
the output filter capacitors by a sudden load step. The
peak amplitude of the output transient (V
SAG
) is also a
function of the maximum duty factor, which can be calculated from the on-time and minimum off-time:
where minimum off-time = 0.350µs (max) and K is from
Table 2.
Determining the Current Limit
The minimum current-limit threshold must be great
enough to support the maximum load current when the
current limit is at the minimum tolerance value. The valley of the inductor current occurs at I
LOAD(MAX)
minus
half of the ripple current; therefore:
I
LIMIT(LOW)
> I
LOAD(MAX)
- [(LIR / 2) x I
LOAD(MAX)
]
where I
LIMIT(LOW)
= minimum current-limit threshold
voltage divided by the R
DS(ON)
of N2/N4 (MAX8734).
For the MAX8732/MAX8733/MAX8734, the minimum
current-limit threshold voltage is 93mV (ILIM_ = VCC).
Use the worst-case maximum value for R
DS(ON)
from
the MOSFET N2/N4 data sheet and add some margin
for the rise in R
DS(ON)
with temperature. A good gener-
al rule is to allow 0.5% additional resistance for each °C
of temperature rise.
Examining the 5A circuit example with a maximum
R
DS(ON)
= 12mΩ at high temperature reveals the following:
I
LIMIT(LOW)
= 93mV / 12mΩ > 5A - (0.35 / 2) 5A
7.75A > 4.125A
7.75A is greater than the valley current of 4.125A, so
the circuit can easily deliver the full-rated 5A using the
fixed 100mV nominal current-limit threshold voltage.
Connect the source of the synchronous rectifier to a
current-sense resistor to GND (MAX8732/MAX8733),
and connect CS_ to that junction to set the current limit
for the device. The MAX8732/MAX8733/MAX8734 limit
the current with the sense resistor instead of the
R
DS(ON)
of N2/N4. The maximum value of the sense
resistor can be calculated with the equation:
I
LIM_
= 93mV / R
SENSE
Output Capacitor Selection
The output filter capacitor must have low enough equivalent series resistance (ESR) to meet output ripple and
load-transient requirements, yet have high enough ESR
to satisfy stability requirements. The output capacitance must also be high enough to absorb the inductor
energy while transitioning from full-load to no-load conditions without tripping the overvoltage fault latch. In
applications where the output is subject to large load
transients, the output capacitor’s size depends on how
much ESR is needed to prevent the output from dipping too low under a load transient. Ignoring the sag
due to finite capacitance:
where V
DIP
is the maximum-tolerable transient voltage
drop. In non-CPU applications, the output capacitor’s
size depends on how much ESR is needed to maintain
an acceptable level of output voltage ripple:
where V
P-P
is the peak-to-peak output voltage ripple.
The actual capacitance value required relates to the
physical size needed to achieve low ESR, as well as to
the chemistry of the capacitor technology. Thus, the
capacitor is usually selected by ESR and voltage rating
rather than by capacitance value (this is true of tantalum, OS-CON, and other electrolytic-type capacitors).
L
L
122000 355
VVV
OUTOUT
=
VfLIR I
+× ××
+ −
__
()
LOAD MAX
()
VVV
512 5
VkHzA
×××
.
−
()
=
83
H=
. µ
V
SAG
ILK
∆
LOAD MAX
()
=
××
2
CVK
OUTOUT
2
()
_
×
+ −
VV
V
OUT
V
+
V
+
OUT
_
t
+
OFF MIN
_
()
−
t
OFF MIN
()
R
ESR
V
≤
I
LOAD MAX
DIP
()
R
≤
ESR
LIRI
×
V
−
PP
()
LOAD MAX
Page 26
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
When using low-capacity filter capacitors such as
polymer types, capacitor size is usually determined by
the capacity required to prevent V
SAG
and V
SOAR
from
tripping the undervoltage and overvoltage fault latches
during load transients in ultrasonic mode.
For low input-to-output voltage differentials (V
IN
/ V
OUT
< 2), additional output capacitance is required to maintain stability and good efficiency in ultrasonic mode.
The amount of overshoot due to stored inductor energy
can be calculated as:
where I
PEAK
is the peak inductor current.
Stability Considerations
Stability is determined by the value of the ESR zero
(f
ESR
) relative to the switching frequency (f). The point
of instability is given by the following equation:
where:
For a typical 300kHz application, the ESR zero frequency must be well below 95kHz, preferably below 50kHz.
Low-ESR capacitors (especially polymer or tantalum),
in widespread use at the time of publication, typically
have ESR zero frequencies lower than 30kHz. In the
design example used for inductor selection, the ESR
needed to support a specified ripple voltage is found
by the equation:
where LIR is the inductor ripple current ratio and I
LOAD
is the average DC load. Using LIR = 0.35 and an average load current of 5A, the ESR needed to support
50mV
P-P
ripple is 28mΩ.
Do not place high-value ceramic capacitors directly
across the fast-feedback inputs (OUT_ to GND for internal feedback, FB_ divider point for external feedback)
without taking precautions to ensure stability. Large
ceramic capacitors can have a high-ESR zero frequency
and cause erratic, unstable operation. Adding a discrete
resistor or placing the capacitors a couple of inches
downstream from the junction of the inductor and OUT_
may improve stability.
Unstable operation manifests itself in two related but
distinctly different ways: double pulsing and fast-feedback loop instability. Noise on the output or insufficient
ESR may cause double pulsing. Insufficient ESR does
not allow the amplitude of the voltage ramp in the output
signal to be large enough. The error comparator mistakenly triggers a new cycle immediately after the 350ns
minimum off-time period has expired. Double pulsing
results in increased output ripple, and can indicate the
presence of loop instability caused by insufficient ESR.
Loop instability results in oscillations or ringing at the
output after line or load perturbations, causing the output voltage to fall below the tolerance limit.
The easiest method for checking stability is to apply a
very fast zero-to-max load transient (refer to the
MAX8734 EV kit data sheet) and observe the output
voltage-ripple envelope for overshoot and ringing.
Monitoring the inductor current with an AC current
probe may also provide some insight. Do not allow
more than one cycle of ringing of under- or overshoot
after the initial step response.
Input Capacitor Selection
The input capacitors must meet the input-ripple-current
(I
RMS
) requirement imposed by the switching current.
The MAX8732/MAX8733/MAX8734 dual switching regulators operate at different frequencies. This interleaves
the current pulses drawn by the two switches and
reduces the overlap time where they add together. The
input RMS current is much smaller in comparison than
with both SMPSs operating in phase. The input RMS current varies with load and the input voltage.
The maximum input capacitor RMS current for a single
SMPS is given by:
When V+ = 2 x V
OUT_
(D = 50%), I
RMS
has maximum
current of I
LOAD
/ 2.
The ESR of the input-capacitor is important for determining capacitor power dissipation. All the power
(I
RMS
2
x ESR) heats up the capacitor and reduces efficiency. Nontantalum chemistries (ceramic or OS-CON)
are preferred due to their low ESR and resilience to
power-up surge currents. Choose input capacitors that
exhibit less than +10°C temperature rise at the RMS
input current for optimal circuit longevity. Place the
drains of the high-side switches close to each other to
share common input bypass capacitors.
Most of the following MOSFET guidelines focus on the
challenge of obtaining high load-current capability
(>5A) when using high-voltage (>20V) AC adapters.
Low-current applications usually require less attention.
Choose a high-side MOSFET (N1/N3) that has conduction losses equal to the switching losses at the typical
battery voltage for maximum efficiency. Ensure that the
conduction losses at the minimum input voltage do not
exceed the package thermal limits or violate the overall
thermal budget. Ensure that conduction losses plus
switching losses at the maximum input voltage do not
exceed the package ratings or violate the overall thermal budget.
Choose a synchronous rectifier (N2/N4) with the lowest
possible R
DS(ON)
. Ensure the gate is not pulled up by the
high-side switch turning on due to parasitic drain-to-gate
capacitance, causing cross-conduction problems.
Switching losses are not an issue for the synchronous
rectifier in the buck topology since it is a zero-voltage
switched device when using the buck topology.
MOSFET Power Dissipation
Worst-case conduction losses occur at the duty-factor
extremes. For the high-side MOSFET, the worst-case
power dissipation (PD) due to the MOSFET’s R
DS(ON)
occurs at the minimum battery voltage:
Generally, a small high-side MOSFET reduces switching losses at high input voltage. However, the R
DS(ON)
required to stay within package power-dissipation limits
often limits how small the MOSFET can be. The optimum situation occurs when the switching (AC) losses
equal the conduction (R
DS(ON)
) losses.
Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum battery voltage is applied, due to the squared term in the CV
2
✕ f
switching-loss equation. Reconsider the high-side
MOSFET chosen for adequate R
DS(ON)
at low battery
voltages if it becomes extraordinarily hot when subjected to V+
(MAX)
.
Calculating the power dissipation in NH(N1/N3) due to
switching losses is difficult since it must allow for quantifying factors that influence the turn-on and turn-off
times. These factors include the internal gate resistance, gate charge, threshold voltage, source inductance, and PC board layout characteristics. The
following switching-loss calculation provides only a
very rough estimate and is no substitute for bench evaluation, preferably including verification using a thermocouple mounted on N
H
(N1/N3):
where C
RSS
is the reverse transfer capacitance of N
H
(N1/N3) and I
GATE
is the peak gate-drive source/sink
current.
For the synchronous rectifier, the worst-case power dis-
sipation always occurs at maximum battery voltage:
The absolute worst case for MOSFET power dissipation
occurs under heavy overloads that are greater than
I
LOAD(MAX)
but are not quite high enough to exceed
the current limit and cause the fault latch to trip. To
protect against this possibility, “overdesign” the circuit
to tolerate:
I
LOAD
= I
LIMIT(HIGH)
+ (LIR / 2 ) x I
LOAD(MAX)
where I
LIMIT(HIGH)
is the maximum valley current
allowed by the current-limit circuit, including threshold
tolerance and resistance variation.
Rectifier Selection
Current circulates from ground to the junction of both
MOSFETs and the inductor when the high-side switch is
off. As a consequence, the polarity of the switching
node is negative with respect to ground. This voltage is
approximately -0.7V (a diode drop) at both transition
edges while both switches are off (dead time). The drop
is I
L
x R
DS(ON)
when the low-side switch conducts.
The rectifier is a clamp across the synchronous rectifier
that catches the negative inductor swing during the dead
time between turning the high-side MOSFET off and the
synchronous rectifier on. The MOSFETs incorporate a
high-speed silicon body diode as an adequate clamp
diode if efficiency is not of primary importance. Place a
Schottky diode in parallel with the body diode to reduce
the forward voltage drop and prevent the N2/N4 MOSFET
body diodes from turning on during the dead time.
Typically, the external diode improves the efficiency by
1% to 2%. Use a Schottky diode with a DC current rating
equal to 1/3 of the load current. For example, use an
MBR0530 (500mA-rated) type for loads up to 1.5A, a
PD Nsisce
(Retan)
H
V
=
V
IN MIN
OUT
_
()
IR
LOADDS ON
()
2
()
PD N Switching
()
V
()
IN MAX
PD N
=−
()
L
H
2
()
V
OUT
1
V
IN MAX
=
CfI
RSS SW LOAD
I
GATE
_
IR
()
LOADDS ON
2
()
Page 28
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
1N5819 type for loads up to 3A, or a 1N5822 type for
loads up to 10A. The rectifier’s rated reverse breakdown
voltage must be at least equal to the maximum input voltage, preferably with a 20% derating factor.
Boost Supply Diode
A signal diode, such as a 1N4148, works well in most
applications. Use a small (20mA) Schottky diode for
slightly improved efficiency and dropout characteristics, if the input voltage can go below 6V. Do not use
large power diodes, such as 1N5817 or 1N4001, since
high-junction capacitance can force LDO5 to excessive
voltages.
Applications Information
Dropout Performance
The output voltage-adjust range for continuous-conduction operation is restricted by the nonadjustable 350ns
(max) minimum off-time one-shot. Use the slower 5V
SMPS for the higher of the two output voltages for best
dropout performance in adjustable feedback mode. The
duty-factor limit must be calculated using worst-case values for on- and off-times, when working with low input
voltages. Manufacturing tolerances and internal propagation delays introduce an error to the tONK-factor. Also,
keep in mind that transient-response performance of
buck regulators operated close to dropout is poor, and
bulk output capacitance must often be added (see the
V
SAG
equation in the Output Capacitor Selection section).
The absolute point of dropout occurs when the inductor
current ramps down during the minimum off-time
(∆I
DOWN
) as much as it ramps up during the on-time
(∆IUP). The ratio h = ∆IUP/∆I
DOWN
indicates the ability to
slew the inductor current higher in response to
increased load, and must always be greater than 1. As
h approaches 1, the absolute minimum dropout point,
the inductor current is less able to increase during each
switching cycle and V
SAG
greatly increases unless
additional output capacitance is used.
A reasonable minimum value for h is 1.5, but this can
be adjusted up or down to allow tradeoffs between
V
SAG
, output capacitance, and minimum operating
voltage. For a given value of h, the minimum operating
voltage can be calculated as:
where V
DROP1
and V
DROP2
are the parasitic voltage
drops in the discharge and charge paths (see the On-
Time One-Shot section), t
OFF(MIN)
is from the EC table,
and K is taken from Table 2. The absolute minimum
input voltage is calculated with h = 1.
Operating frequency must be reduced or h must be
increased and output capacitance added to obtain an
acceptable V
SAG
if calculated V+
(MIN)
is greater than
the required minimum input voltage. Calculate V
SAG
to
be sure of adequate transient response if operation
near dropout is anticipated.
Dropout Design Example
MAX8733: With V
OUT5
= 5V, fsw = 400kHz, K = 2.25µs,
t
OFF(MIN)
= 350ns, V
DROP1
= V
DROP2
= 100mV, and h = 1.5,
the minimum V+ is:
Calculating with h = 1 yields:
Therefore, V+ must be greater than 6.65V. A practical
input voltage with reasonable output capacitance
would be 7.5V.
A coupled inductor or transformer can be substituted for
the inductor in the 5V or 3.3V SMPS to create an auxiliary
output (Figure 12). The MAX8732/MAX8733/MAX8734 are
particularly well suited for such applications because they
can be configured in ultrasonic or forced-PWM mode to
ensure good load regulation when the main supplies are
lightly loaded. An additional postregulation circuit can be
used to improve load regulation and limit output current.
The power requirements of the auxiliary supply must be
considered in the design of the main output. The transformer must be designed to deliver the required current
in both the primary and the secondary outputs with the
proper turns ratio and inductance. The power ratings of
the synchronous-rectifier MOSFETs and the current limit
in the MAX8732/MAX8733/MAX8734 must also be
adjusted accordingly. Extremes of low input-output differentials, widely different output loading levels, and high
turns ratios can further complicate the design due to parasitic transformer parameters such as interwinding
capacitance, secondary resistance, and leakage inductance. Power from the main and secondary outputs is
combined to get an equivalent current referred to the
main output. Use this total current to determine the current limit (see the Determining the Current Limit section):
where I
TOTAL
is the equivalent output current referred
to the main output and P
TOTAL
is the sum of the output
power from both the main output and the secondary
output:
where L
PRIMARY
is the primary inductance, N is the
transformer turns ratio, V
SEC
is the minimum-required
rectified secondary voltage, V
FWD
is the forward drop
across the secondary rectifier, V
OUT(MIN)
is the minimum
value of the main output voltage, and V
RECT
is the onstate voltage drop across the synchronous rectifier
MOSFET. The transformer secondary return is often connected to the main output voltage instead of ground in
order to reduce the necessary turns ratio. In this case,
subtract V
OUT
from the secondary voltage (V
SEC
–
V
OUT
) in the transformer turns-ratio equation above.
The secondary diode in coupled-inductor applications
must withstand flyback voltages greater than 60V, which
usually rules out most Schottky rectifiers. Common silicon rectifiers, such as the 1N4001, are also prohibited
because they are too slow. This often makes fast silicon
rectifiers such as the MURS120 the only choice. The flyback voltage across the rectifier is related to the V
IN
-
V
OUT
difference, according to the transformer turns ratio:
V
FLYBACK
= V
SEC
+ (V
IN
- V
OUT
) ✕N
where N is the transformer turns ratio (secondary windings/primary windings), V
SEC
is the maximum secondary
DC output voltage, and V
OUT
is the primary (main) out-
put voltage. If the secondary winding is returned to V
OUT
instead of ground, subtract V
OUT
from V
FLYBACK
in the
equation above. The diode’s reverse breakdown voltage
rating must also accommodate any ringing due to leakage inductance. The diode’s current rating should be at
least twice the DC load current on the secondary output.
The optional linear postregulator must be selected to
deliver the required load current from the transformer’s
rectified DC output. The linear regulator should be configured to run close to dropout to minimize power dissipation and should have good output accuracy under
those conditions. Input and output capacitors are chosen to meet line regulation, stability, and transient
requirements. There are a wide variety of linear regulators appropriate for this application; consult the specific
linear-regulator data sheet for details.
Widely different output loads affect load regulation. In
particular, when the secondary output is left unloaded
while the main output is fully loaded, the secondary output capacitor may become overcharged by the leakage
inductance, reaching voltages much higher than intended. In this case, a minimum load or overvoltage protection may be required on the secondary output to protect
any device connected to this output.
PC Board Layout Guidelines
Careful PC board layout is critical to achieve minimal
switching losses and clean, stable operation. This is
especially true when multiple converters are on the
same PC board where one circuit can affect the other.
The switching power stages require particular attention
(Figure 13). Refer to the MAX1999 Evaluation Kit data
sheet for a specific layout example.
Mount all of the power components on the top side of
the board with their ground terminals flush against one
another, if possible. Follow these guidelines for good
PC board layout:
• Isolate the power components on the top side from
the sensitive analog components on the bottom side
with a ground shield. Use a separate PGND plane
under the OUT3 and OUT5 sides (called PGND3 and
L
VVV
VILIR
N
VV
VV
PRIMARY
OUT IN MAXOUT
IN MAXTOTAL
SECFWD
OUT MINRECT
=
−
׃××
=
+
+
(
()
()
()
IPV
TOTALTOTALOUT
=/
Page 30
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
PGND5). Avoid the introduction of AC currents into
the PGND3 and PGND5 ground planes. Run the
power plane ground currents on the top side only, if
possible.
• Use a star ground connection on the power plane to
minimize the crosstalk between OUT3 and OUT5.
• Keep the high-current paths short, especially at the
ground terminals. This practice is essential for stable, jitter-free operation.
• Keep the power traces and load connections short.
This practice is essential for high efficiency. Using
thick copper PC boards (2oz vs. 1oz) can enhance
full-load efficiency by 1% or more. Correctly routing
PC board traces must be approached in terms of
fractions of centimeters, where a single milliohm of
excess trace resistance causes a measurable efficiency penalty.
• CS_ (MAX8732/MAX8733)/LX_ (MAX8734) and GND
connections to the synchronous rectifiers for current
limiting must be made using Kelvin-sense connections to guarantee the current-limit accuracy. With 8pin SO MOSFETs, this is best done by routing power
to the MOSFETs from outside using the top copper
layer, while connecting CS_/LX_ traces inside (underneath) the MOSFETs.
• When trade-offs in trace lengths must be made, it is
preferable to allow the inductor charging path to be
made longer than the discharge path. For example, it
is better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the synchronous rectifier or between the inductor and the
output filter capacitor.
• Ensure that the OUT_ connection to C
OUT_
is short and
direct. However, in some cases it may be desirable to
deliberately introduce some trace length between the
OUT_ connector node and the output filter capacitor
(see the Stability Considerations section).
• Route high-speed switching nodes (BST_, DH_, LX_,
and DL_) away from sensitive analog areas (REF,
ILIM_, and FB_). Use PGND3 and PGND5 as an EMI
shield to keep radiated switching noise away from the
IC’s feedback divider and analog bypass capacitors.
• Make all pin-strap control input connections (SKIP,
ILIM_, etc.) to GND or V
CC
of the device.
Layout Procedure
1) Place the power components first with ground ter-
minals adjacent (N2/N4 source, C
IN_
, C
OUT_
, D1
anode). If possible, make all these connections on
the top layer with wide, copper-filled areas.
2) Mount the controller IC adjacent to the synchronousrectifier MOSFETs, preferably on the back side in
order to keep DH_, GND, and the DL_ gate drive
lines short and wide. The DL_ gate trace must be
short and wide, measuring 50mils to 100mils wide if
the MOSFET is 1in from the controller device.
3) Group the gate-drive components (BST_ diode and
capacitor, V+ bypass capacitor) together near the
controller device.
Figure 13. PC Board Layout Example
USE AGND PLANE TO:
- BYPASS V
- TERMINATE EXTERNAL FB
DIVIDER (IF USED)
- TERMINATE R
(IF USED)
- PIN-STRAP CONTROL
INPUTS
ANALOG GROUND
PLANE ON INNER LAYER
AND REF
CC
ILIM
CONNECT PGND TO AGND
BENEATH THE CONTROLLER AT
ONE POINT ONLY AS SHOWN.
USE PGND PLANE TO:
- BYPASS LDO_
- CONNECT PGND TO THE TOPSIDE STAR GROUND
VIA BETWEEN POWER
4) Make the DC-DC controller ground connections as
follows: near the device, create a small analog
ground plane. Connect the small analog ground
plane to GND (Figure 13) and use the plane for the
ground connection for the REF and VCCbypass
capacitors, FB dividers, and ILIM resistors (if any).
Create another small ground island for PGND, and
use the plane for the V+ bypass capacitor, placed
very close to the device. Connect the AGND and
PGND planes together at the GND pin of the device.
5) On the board’s top side (power planes), make a
star ground to minimize crosstalk between the two
sides. The top-side star ground is a star connection
of the input capacitors and synchronous rectifiers.
Keep the resistance low between the star ground
and the source of the synchronous rectifiers for
accurate current limit. Connect the top-side star
ground (used for MOSFET, input, and output
capacitors) to the small island with a single short,
wide connection (preferably just a via).
Create PGND islands on the layer just below the
top-side layer (refer to the MAX1999 EV kit for an
example) to act as an EMI shield if multiple layers
are available (highly recommended). Connect each
of these individually to the star ground via, which
connects the top side to the PGND plane. Add one
more solid ground plane under the device to act as
an additional shield, and also connect the solid
ground plane to the star ground via.
6) Connect the output power planes (V
CORE
and system
ground planes) directly to the output filter capacitor
positive and negative terminals with multiple vias.
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
BST3
LX3
DH3
LDO3
DL3
GND
LX5
OUT3
OUT5
V+
DL5
LDO5
V
CC
DH5
BST5
CS5
ILIM5
FB5
REF
FB3
ILIM3
ON5
ON3
PGOOD
CS3
QSOP
TOP VIEW
MAX8732
MAX8733
SHDN
PRO
SKIP
Pin Configurations (continued)
Chip Information
TRANSISTOR COUNT: 8335
PROCESS: BiCMOS
Page 32
MAX8732/MAX8733/MAX8734
High-Efficiency, Quad-Output, Main PowerSupply Controllers for Notebook Computers
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 32
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages
.)
QSOP.EPS
PACKAGEOUTLINE,QSOP.150",.025"LEADPITCH
21-0055
1
E
1
Page 33
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.