The MAX7033 fully integrated low-power CMOS superheterodyne receiver is ideal for receiving amplitudeshift-keyed (ASK) data in the 300MHz to 450MHz
frequency range. The receiver has an RF input signal
range of -114dBm to 0dBm. With few external components and a low-current power-down mode, it is ideal
for cost-sensitive and power-sensitive applications typical in the automotive and consumer markets. The
MAX7033 consists of a low-noise amplifier (LNA), a fully
differential image-rejection mixer, an on-chip phaselocked loop (PLL) with integrated voltage-controlled
oscillator (VCO), a 10.7MHz IF limiting amplifier stage
with received-signal-strength indicator (RSSI), and analog baseband data-recovery circuitry. The MAX7033
also has a discrete one-step automatic gain control
(AGC) that reduces the LNA gain by 35dB when the RF
input signal exceeds -62dBm. The AGC circuitry offers
an externally controlled hold feature.
The MAX7033 is available in 28-pin TSSOP and
32-pin TQFN packages and is specified over the
extended (-40°C to +105°C) temperature range.
= +3.0V to +3.6V, no RF signal applied, TA= -40°C to +105°C, unless otherwise
noted. Typical values are at V
AVDD
= V
DVDD
= V
DD5
= +3.3V and TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
DD5
to AGND.......................................................-0.3V to +6.0V
AVDD to AGND .....................................................-0.3V to +4.0V
DVDD to DGND .....................................................-0.3V to +4.0V
AGND to DGND.....................................................-0.1V to +0.1V
IRSEL, DATAOUT, XTALSEL,
AC, SHDN to AGND .............................-0.3V to (V
DD5
+ 0.3V)
All Other Pins to AGND ..........................-0.3V to (V
Note 1: 100% tested at TA= +25°C. Guaranteed by design and characterization over temperature.
Note 2: IRSEL is internally set to 375MHz IR mode. It can be left open when the 375MHz image-rejection setting is desired. Bypass
to AGND with a 1nF capacitor in a noisy environment.
Note 3: BER = 2 x 10
-3
, Manchester encoded, data rate = 4kbps, IF bandwidth = 280kHz.
Note 4: Input impedance is measured at the LNAIN pin. Note that the impedance includes the 15nH inductive degeneration con-
nected from the LNA source to ground. The equivalent input circuit is 50Ω in series with 2.2pF.
Note 5: Crystal oscillator frequency for other RF carrier frequency within the 300MHz to 450MHz range is (f
RF
- 10.7MHz)/64 for
XTALSEL = 0V, and (f
RF
- 10.7MHz)/32 for XTALSEL = V
DD5
.
AC ELECTRICAL CHARACTERISTICS (continued)
(
Typical Application Circuit
, V
AVDD
= V
DVDD
= V
DD5
= +3.0V to +3.6V, all RF inputs are referenced to 50Ω, fRF= 315MHz,
T
A
= -40°C to +105°C, unless otherwise noted. Typical values are at V
129XTAL1Crystal Input 1 (See the Phase-Locked Loop section)
2, 74, 30AVDD
331LNAINLow-Noise Amplifier Input (See the Low-Noise Amplifier section)
432LNASRC
5, 102, 7AGNDAnalog Ground
63LNAOUT
85MIXIN11st Differential Mixer Input. Connect to LC tank filter from LNAOUT.
96MIXIN22nd Differential Mixer Input. Connect through a 100pF capacitor to V
118IRSEL
129MIXOUT330Ω Mixer Output. Connect to the input of the 10.7MHz bandpass filter.
1310DGNDDigital Ground
1411DVDD
1512ACAutomatic Gain Control. See Figure 1. Internally pulled down to AGND with a 100kΩ resistor.
1614XTALSEL
1715IFIN1
1816IFIN2
1917DFOData Filter Output
2018DSNNegative Data Slicer Input
2119OPPNoninverting Op-Amp Input for the Sallen-Key Data Filter
2220DFFBData-Filter Feedback Node. Input for the feedback of the Sallen-Key data filter.
2322DSPPositive Data Slicer Input
2423V
2524DATAOUT Digital Baseband Data Output
2626PDOUTPeak-Detector Output
2727SHDN
NAMEFUNCTION
Positive Analog Supply Voltage. For +5V operation, pin 2 is the output of an on-chip +3.2V
low-dropout regulator, and should be bypassed to AGND with a 0.1μF capacitor as close as
possible to the pin. Pin 7 must be externally connected to the supply from pin 2, and bypassed
to AGND with a 0.01μF capacitor as close as possible to the pin. (See the Voltage Regulator
section and the Typical Application Circuit.)
Low-Noise Amplifier Source for External Inductive Degeneration. Connect inductor to ground
to set the LNA input impedance (See the Low-Noise Amplifier section).
Low-Noise Amplifier Output. Connect to mixer input through an LC tank filter (See the Low-Noise Amplifier section).
DD5
Image-Rejection Select. Set V
unconnected to center image rejection at 375MHz. Set V
rejection at 433MHz.
Positive Digital Supply Voltage. Connect to both of the AVDD pins. Bypass to DGND with a
0.01μF capacitor as close as possible to the
Crystal Divider Ratio Select. Drive XTALSEL low to select f
XTALSEL high to select f
1st Differential Intermediate-Frequency Limiter Amplifier Input. Bypass to AGND with a 1500pF
capacitor as close to the pin as possible.
2nd Differential Intermediate-Frequency Limiter Amplifier Input. Connect to the output of a
10.7MHz bandpass filter.
+5V Supply Voltage. Bypass to AGND with a 0.01μF capacitor as close as possible to the pin.
For +5V operation, V
ap p ear s at the p i n 2 AV D D p i n.
C i r cui t.)
Power-Down Select Input. Drive high to power up the IC. Internally pulled down to AGND with
a 100kΩ resistor.
LO/fXTAL
is the input to an on-chip voltage regulator whose +3.2V output
DD5
= 0V to center image rejection at 315MHz. Leave IRSEL
IRSEL
pin. (See the Typical Application Circuit.)
ratio of 32.
( S ee the V ol tag e Reg ul ator secti on and the Typ i cal Ap p l i cati on
The MAX7033 CMOS superheterodyne receiver and a
few external components provide the complete receive
chain from the antenna to the digital output data.
Depending on signal power and component selection,
data rates as high as 33kbps Manchester (66kbps
NRZ) can be achieved.
The MAX7033 is designed to receive binary ASK data
modulated in the 300MHz to 450MHz frequency range.
ASK modulation uses a difference in amplitude of the
carrier to represent logic 0 and logic 1 data.
Voltage Regulator
For operation with a single +3.0V to +3.6V supply voltage,
connect AVDD, DVDD, and V
DD5
to the supply voltage.
For operation with a single +4.5V to +5.5V supply voltage,
connect V
DD5
to the supply voltage. An on-chip voltage
regulator drives one of the AVDD pins to approximately
+3.2V. For proper operation, DVDD and both the AVDD
pins must be connected together. Bypass V
DD5
, DVDD,
and the pin 7 AVDD pin to AGND with 0.01μF capacitors,
and the pin 2 AVDD pin to AGND with a 0.1μF capacitor,
all placed as close as possible to the pins.
Low-Noise Amplifier
The LNA is an nMOS cascode amplifier with off-chip
inductive degeneration, with a 3.0dB noise figure and
an IIP3 of -12dBm. The gain and noise figures are
dependent on both the antenna matching network at
the LNA input and the LC tank network between the
LNA output and the mixer inputs.
PIN
TSSOPTHIN QFN
2828XTAL2
LNAIN
AVDD
V
DD5
AVDD
DVDD
DGND
AGND
1, 13,
21, 25
3
2
24
7
14
13
5, 10
—
——EPExposed Pad (TQFN Only). Connect EP to GND.
NAMEFUNCTION
Crystal Input 2. Can also be driven with an external reference oscillator. (See the Crystal
Oscillator section.)
N.CNo Connection
AC
LNASRC
41568911121718
LNA
3.2V REG
DIVIDE
BY 64
PHASE
DETECTOR
÷1
÷2
LNAOUT MIXIN1 MIXIN2
AUTOMATIC
GAIN
CONTROL
VCO
LOOP
FILTER
CRYSTAL
DRIVER
POWER-
DOWN
Q
I
DATA
SLICER
IRSEL
0˚
IMAGE
REJECTION
90˚
∑
AMPS
DATA
FILTER
28-PIN TSSOP
PACKAGE
R
DF1
100kΩ
MAX7033
IFIN1MIXOUTIFIN2
RSSI
R
DF2
100kΩ
IF LIMITING
28
XTALSEL16XTAL11XTAL2
25
SHDN27DATAOUT
19
DSN20DSP23DFO
21
PDOUT26OPP
22
DFFB
Page 10
The off-chip inductive degeneration is achieved by
connecting an inductor from LNASRC to AGND. This
inductor sets the real part of the input impedance at
LNAIN, allowing for a more flexible input impedance
match, such as a typical PCB trace antenna. A nominal
value for this inductor with a 50Ω input impedance is
15nH, but is affected by PCB trace.
The LC tank filter connected to LNAOUT comprises L3
and C2 (see the
Typical Application Circuit
). Select L3
and C2 to resonate at the desired RF input frequency.
The resonant frequency is given by:
where:
L
TOTAL
= L3 + L
PARASITICS
.
C
TOTAL
= C2 + C
PARASITICS
.
L
PARASITICS
and C
PARASITICS
include inductance and
capacitance of the PCB traces, package pins, mixer
input impedance, LNA output impedance, etc. These
parasitics at high frequencies cannot be ignored, and
can have a dramatic effect on the tank filter center frequency. Lab experimentation should be done to optimize the center frequency of the tank.
Automatic Gain Control
When the AC pin is low, the automatic gain-control
(AGC) circuit monitors the RSSI output. As the RSSI
output reaches 1.98V, which corresponds to RF input
level of -62dBm, the AGC switches on the LNA gain
reduction resistor. The resistor reduces the LNA gain
by 35dB, thereby reducing the RSSI output by about
500mV. The LNA resumes high-gain mode when the
RSSI level drops back below 1.39V (approximately
-70dBm at RF input) for 1ms. The AGC has a hysteresis
of 8dB. With the AGC function, the MAX7033 can reliably produce an ASK output for RF input levels up to
0dBm with modulation depth of 18dB.
When the AC pin is high and SHDN goes high, the
AGC circuit is disabled and the LNA is always in highgain mode. The AGC function can be resumed by
bringing the AC pin low when SHDN is high.
The MAX7033 features an AGC lock function that is
asserted when the level at the AC pin transitions from
low to high while SHDN is high. Locking the AGC locks
the LNA in the current gain state. As shown in Figure 1,
the AGC lock function can be enabled or disabled as
long as the SHDN pin is high. Changing the state of AC
when SHDN is low has no effect.
Mixer
A unique feature of the MAX7033 is the integrated
image rejection of the mixer. This device eliminates the
need for a costly front-end SAW filter for most applications. Advantages of not using a SAW filter are
increased sensitivity, simplified antenna matching, less
board space, and lower cost.
The mixer cell is a pair of double balanced mixers that
perform an IQ downconversion of the RF input to the
10.7MHz IF from a low-side injected LO (i.e., fLO= fRFfIF). The image-rejection circuit then combines these
signals to achieve 44dB of image rejection. Low-side
MAX7033
315MHz/433MHz ASK Superheterodyne
Receiver with AGC Lock
injection is required due to the on-chip image-rejection
architecture. The IF output is driven by a source follower biased to create a driving-point impedance of 330Ω;
this provides a good match to the off-chip 330Ω ceram-
ic IF filter.
The IRSEL pin is a logic input that selects one of the
three possible image-rejection frequencies. When V
IRSEL
= 0V, the image rejection is tuned to 315MHz. V
IRSEL
=
V
DD5
/2 tunes the image rejection to 375MHz, and V
IRSEL
= V
DD5
tunes the image rejection to 433MHz. The IRSEL
pin is internally set to V
DD5
/2 (image rejection at
375MHz) when it is left unconnected, thereby eliminating
the need for an external V
DD5
/2 voltage.
Phase-Locked Loop
The PLL block contains a phase detector, charge
pump, integrated loop filter, VCO, asynchronous 64x
clock divider, and crystal oscillator driver. Besides the
crystal, this PLL does not require any external components. The VCO generates a low-side LO. The relationship between the RF, IF, and crystal frequencies is
given by:
where:
M = 1 (V
XTALSEL
= V
DD5
) or 2 (V
XTALSEL
= 0V)
To allow the smallest possible IF bandwidth (for best sensitivity), minimize the tolerance of the reference crystal.
Table 1. Component Values for Typical Application Circuit
*
Wire wound recommended.
**
Crystal frequencies shown are for ÷64 (V
XTALSEL
= 0V) and ÷32 (V
XTALSEL
= VDD)
f
XTA L
ff
RFIF
=
M
×-32
COMPONENTVALUE FOR fRF = 433MHzVALUE FOR fRF = 315MHzDESCRIPTION
C1100pF100pF5%
C22pF4pF± 0.1pF
C3100pF100pF5%
C4100pF100pF5%
C51500pF1500pF10%
C6220pF220pF5%
C7470pF470pF5%
C80.47μF0.47μF20%
C9220pF220pF10%
C100.01μF0.01μF20%
C110.1μF0.1μF20%
C1215pF15pFDepends on XTAL
C1315pF15pFDepends on XTAL
C140.01μF0.01μF20%
C150.01μF0.01μF20%
L156nH120nH5% or better*
L215nH15nH5% or better*
L315nH27nH5% or better*
R15.1kΩ5.1kΩ5%
R2OpenOpen—
R3ShortShort—
X1 (÷64)6.6128MHz**4.7547MHz**Crystek or Hong Kong Crystal
X1 (÷32)13.2256MHz**9.5094MHz**Crystek or Hong Kong Crystal
The IF section presents a differential 330Ω load to provide matching for the off-chip ceramic filter. The six
internal AC-coupled limiting amplifiers produce an
overall gain of approximately 65dB, with a bandpass-filter-type response centered near the 10.7MHz IF frequency with a 3dB bandwidth of approximately 10MHz.
The RSSI circuit demodulates the IF by producing a DC
output proportional to the log of the IF signal level, with
a slope of approximately 14.2mV/dB (see the
Typical
Operating Characteristics
).
Applications Information
Crystal Oscillator
The crystal oscillator in the MAX7033 is designed to
present a capacitance of approximately 3pF between
the XTAL1 and XTAL2. If a crystal designed to oscillate
with a different load capacitance is used, the crystal is
pulled away from its stated operating frequency, introducing an error in the reference frequency. Crystals
designed to operate with higher differential load capacitance always pull the reference frequency higher. For
example, a 4.7547MHz crystal designed to operate
with a 10pF load capacitance oscillates at 4.7563MHz
with the MAX7033, causing the receiver to be tuned to
315.1MHz rather than 315.0MHz, an error of about
100kHz, or 320ppm.
In actuality, the oscillator pulls every crystal. The crystal’s natural frequency is really below its specified frequency, but when loaded with the specified load
capacitance, the crystal is pulled and oscillates at its
specified frequency. This pulling is already accounted
for in the specification of the load capacitance.
Additional pulling can be calculated if the electrical
parameters of the crystal are known. The frequency
pulling is given by:
where:
fP is the amount the crystal frequency pulled in ppm.
CMis the motional capacitance of the crystal.
C
CASE
is the case capacitance.
C
SPEC
is the specified load capacitance.
C
LOAD
is the actual load capacitance.
When the crystal is loaded as specified, i.e., C
LOAD
=
C
SPEC
, the frequency pulling equals zero.
It is possible to use an external reference oscillator in
place of a crystal to drive the VCO. AC-couple the external oscillator to XTAL2 with a 1000pF capacitor. Drive
XTAL2 with a signal level of approximately -10dBm. ACcouple XTAL1 to ground with a 1000pF capacitor.
Data Filter
The data filter is implemented as a 2nd-order lowpass
Sallen-Key filter. The pole locations are set by the combination of two on-chip resistors and two external
capacitors. Adjusting the value of the external capacitors changes the corner frequency to optimize for different data rates. The corner frequency should be set
to approximately 1.5 times the fastest expected data
rate from the transmitter. Keeping the corner frequency
near the data rate rejects any noise at higher frequencies, resulting in an increase in receiver sensitivity.
The configuration shown in Figure 2 can create a
Butterworth or Bessel response. The Butterworth filter
offers a very flat amplitude response in the passband
and a rolloff rate of 40dB/decade for the two-pole filter.
The Bessel filter has a linear phase response, which
works well for filtering digital data. To calculate the
value of C5 and C6, use the following equations, along
with the coefficients in Table 2:
where fCis the desired 3dB corner frequency.
MAX7033
315MHz/433MHz ASK Superheterodyne
Receiver with AGC Lock
For example, to choose a Butterworth filter response
with a corner frequency of 5kHz:
Choosing standard capacitor values changes C5 to
470pF and C6 to 220pF, as shown in the
Typical
Application Circuit
.
Data Slicer
The data slicer takes the analog output of the data filter
and converts it to a digital signal. This is achieved by
using a comparator and comparing the analog input to
a threshold voltage. One input is supplied by the data
filter output. Both comparator inputs are accessible offchip to allow for different methods of generating the
slicing threshold, which is applied to the second comparator input.
The suggested data slicer configuration uses a resistor
(R1) connected between DSN and DSP with a capacitor (C4) from DSN to DGND (Figure 3). This configuration averages the analog output of the filter and sets the
threshold to approximately 50% of that amplitude. With
this configuration, the threshold automatically adjusts
as the analog signal varies, minimizing the possibility
for errors in the digital data. The values of R1 and C4
affect how fast the threshold tracks to the analog amplitude. Be sure to keep the corner frequency of the RC
circuit much lower than the lowest expected data rate.
Note that a long string of zeros or ones can cause the
threshold to drift. This configuration works best if a coding scheme, such as Manchester coding, which has an
equal number of zeros and ones, is used.
To prevent continuous toggling of DATAOUT in the
absence of an RF signal due to noise, add hysteresis to
the data slicer as shown in Figure 4.
Peak Detector
The peak-detector output (PDOUT), in conjunction with
an external RC filter, creates a DC output voltage equal
to the peak value of the data signal. The resistor provides a path for the capacitor to discharge, allowing the
peak detector to dynamically follow peak changes of
the data-filter output voltage. For faster data slicer
response, use the circuit shown in Figure 5.
A properly designed PCB is an essential part of any
RF/microwave circuit. On high-frequency inputs and
outputs, use controlled-impedance lines and keep
them as short as possible to minimize losses and radiation. At high frequencies, trace lengths that are on the
order of λ/10 or longer act as antennas.
Keeping the traces short also reduces parasitic inductance. Generally, 1in of a PCB trace adds about 20nH
of parasitic inductance. The parasitic inductance can
have a dramatic effect on the effective inductance of a
passive component. For example, a 0.5in trace connecting a 100nH inductor adds an extra 10nH of inductance or 10%.
To reduce the parasitic inductance, use wider traces
and a solid ground or power plane below the signal
traces. Also, use low-inductance connections to
ground on all GND pins, and place decoupling capacitors close to all power-supply pins.
Control Interface Considerations
When operating the MAX7033 with a +4.5V to +5.5V
supply voltage, the SHDN and AC pins can be driven
by a microcontroller with either 3V or 5V interface logic
levels. When operating the MAX7033 with a +3.0V to
+3.6V supply, only 3V logic from the microcontroller is
allowed.
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE NO.
LAND
PATTERN NO.
28 TSSOPU28+1
21-0066
90-0171
32 TQFN-EPT3255+3
21-0140
90-0001
Page 16
MAX7033
315MHz/433MHz ASK Superheterodyne
Receiver with AGC Lock
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in
the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
16
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
Updated Ordering Information, Pin Configurations, Absolute Maximum Ratings,
DC Electrical Characteristics, AC Electrical Characteristics, Typical Operating
Characteristics, Pin Description, Functional Diagram, Voltage Regulator and
Layout Considerations sections, Typical Application Circuit, Chip Information,
and Package Information
Updated input impedance values in AC Electrical Characteristics table; updated
TOC3 and TOC4 labels in Typical Operating Characteristics; clarified equations
in Pin Description and Phase-Locked Loop and CrystalOscillator sections;
updated components in Table 1; and added new Control InterfaceConsiderations section
PAGES
CHANGED
1–9, 13, 14, 15
3–6, 11–14
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.