Datasheet MAS9142AUA1-T Datasheet (MAS-OY)

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MAS9142
Power Amplifier Controller (PAC) and
2.8 V, 50 mA LDO Voltage Regulator
Temperature Compensation of
Sensor Signal
Diodes
Applicable for a Wide Range of
Power Amplifiers
Low Noise LDO Regulator Included
DESCRIPTION
MAS9142 is designed for use in both the GSM900 and DCS1800 systems and particularly with Hitachi PF08103B power amplifier module. Other PA modules can be used with the MAS9142, but external compensation elements may be required to maintain the stability of the PA control loop. MAS9142 incorporates the power detector biasing components, RC-filtering for power ramping signal, operational amplifier with AC feedback and a low
dropout (LDO) voltage regulator. The regulator has the output voltage of 2.8 V and the maximum load current of 50 mA for generating supply voltage for VCO/Modulator in the radio channel of a mobile phone. The regulator’s output is short-circuit protected. Both the PA control loop and LDO voltage regulator have common thermal (over-temperature) protection with 10 °C hysteresis.
FEATURES APPLICATION
Two functional blocks: Power Amplifier Controller and LDO Voltage Regulator
Low current consumption
Temperature compensated biasing for external
RF power detection Schottky diodes
Both PAC loop and LDO voltage regulator have temperature-controlled power-down feature
LDO voltage regulator with short circuit current protection
Excellent ripple rejection in regulator
Various operating modes provide greater
flexibility
Dual- and Triple-Band Cellular Phones
PCMCIA GSM/DCS data communications
GSM based controller for vehicles
Other RF power controlling applications
NOT AVAILABLE IN THE USA AND CANADA
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BLOCK DIAGRAM
FB
OA
REF
GEN
Power
Down
Control
MAS9142
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OAMINUS
DTEMP
DRECT
PSENSE
VSS1
RAMP
CBYPASS
VRCTRL
OAOUT
VDD1
TXEN
VAPC
VROUT
ENREF
VDD2
VSS2
VOLTAGE
REGULATOR
Diode
bias
+
adder
PIN CONFIGURATION
PIN DESCRIPTION
Pin name Pin No Type Function
OAMINUS 1 I OA Inverting Input (for Optional External Feedback Components) DTEMP 2 I Schottky Diode for Temperature Compensation DRECT 3 I RF Rectifier Schottky Diode PSENSE 4 I Power Measurement Input (from Directional Coupler) VSS1 5 G Ground for Power Amplifier Controller RAMP 6 I GSM Power Ramping Signal Input CBYPASS 7 I Voltage Regulator Reference Voltage Bypass Capacitor VRCTRL (note 1) 8 I Voltage Regulator Enable VSS2 9 G Ground for Voltage Regulator VDD2 10 P Supply for Voltage Regulator ENREF (note 1) 11 I Voltage Reference Enable ('warm-up') VROUT 12 O Voltage Regulator Output VAPC 13 O Automatic Power Control Output Voltage (to PA) TXEN (note 1) 14 I Transmit Enable VDD1 15 P Supply for Power Amplifier Controller OAOUT 16 O OA Output (for Optional External Feedback Components)
NOTE 1:Digital control pads with pull-down resistor, Active-High, CMOS-compatible voltage levels. G = Ground, I = Input, O = Output, P = Power
DTEMP
OAMINUS
DRECT PSENSE VSS1 RAMP CBYPASS
VRCTRL
TXEN
OAOUT
VDD1
VAPC
VROUT
ENREF VDD2 VSS2
9142A
YYWW
Top Marking Definitions: YYWW = Year Week
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ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Conditions Min Max Unit Note
Supply Voltage V
DD
–0.3 6.5 V Voltage Range for All Pins –0.3 6.5 V 1) Voltage Range for Pins 2, 3 and 4 –6 6.5 V Storage Temperature T
S
–55 +125
o
C ESD Rating Human Body Model, HBM 1 kV Operating Ambient Temperature T
OP
–40 +95
o
C
NOTE: Except PSENSE (4), DRECT (3) and DTEMP (2) pins
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage V
DD
3.0 3.6 5.3 V
Supply Current I
DD
0.5 2.0 mA
Operating Temperature T
A
–30 +85
o
C
ELECTRICAL CHARACTERISTICS
For typical values TA = 27oC, for min/max values TA = -30oC to +85oC,CIN = 330 nF, CL = 1 µF, C
BYP
= 100 nF unless otherwise noted
Common Characteristics
u Thermal Protection
Parameter Symbol Conditions Min Typ Max Unit
Threshold High T
H
145 155 165
o
C
Threshold Low T
L
135 145 155
o
C
The hysteresis of 10°C prevents the device from turning on too soon after thermal shut-down.
u Digital Control Pin Parameters
Parameter Symbol Conditions Min Typ Max Unit
Input Voltage
HIGH-state LOW-state
V
IN
V
IN
(H)
V
IN
(L)
For Pin 8 (VRCTRL),
pin 11 (ENREF) and
pin 14 (TXEN)
0
2.0
V
DD
0.3
V
Input Current, in HIGH state I
IN,H
For Pin 8 (VRCTRL),
pin 11 (ENREF) and
pin 14 (TXEN)
3.8 4.5 7.8 µA
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u Current Parameters
Parameter Symbol Conditions Min Typ Max Unit
Total power down 0.01 5
(note 1)
µA
PAC on 0.9 1.8 mA
References ‘warm-up’ 190 300 µA
LDO Regulator on 320 450 µA
Quiescent Supply Currents I
DD
Whole chip on 1.1 2.0 mA
NOTE 1: Test limit. High value is used for speeding up production testing.
u Power Dissipation
Parameter Symbol Conditions Min Typ Max Unit
Power Dissipation P
d
VCC = 6.0 V, TA = 85 °C 285 mW
Power Dissipation P
d
VCC = 6.0 V, TA = 25 °C 700 mW
Maximum power dissipation is calculated from Pd=(Tj–TA)/R
TJA
, where R
TJA
is thermal resistance of TSSOP16 package, R
TJA
= 144 °C /W
and Tj is maximum allowed junction temperature, Tj = 125 °C.
Regulator
Parameter Symbol Conditions Min Typ Max Unit
Regulator Output Current I
OUT
0 50 mA
Output Current Limit I
MAX
75 150 340 mA
Ground Pin Current I
VSS2
No load for typical value,
I
OUT
= 50mA, T = 85 °C
320 µA
Regulator Output Voltage V
OUT
VDD = 3.6 V, I
OUT
= 0 mA 2.75 2.80 2.85 V
Regulator Dropout Voltage V
DROP
I
OUT
= 50 mA 0.14 0.17 V
Load Regulation ∆V
OUT
I
OUT
VDD = 3.6 V, I
OUT
from 0 to 50 mA 0.5 mV
mA
Line Regulation ∆V
OUT
I
OUT
= 50 mA, V
DD
from 6.0 V to
3.6 V
0.25 1.2 mV
PSRR f = 1 kHz
f = 10 kHz
f = 100 kHz
68 54 37
dB
Output Noise Voltage V
RMS
100 Hz < f < 100 kHz,
C
BYPASS
= 100 nF
CL = 1 µF,
I
OUT
= 50 mA
37 µVrms
Rise Time (V
OUT
from 10% to
90%)
t
r
CL = 1 µF, ENREF is ON
at least for 10 ms
14 26 µs
Delay Time (From V
RCTRL
50%
to V
OUT
50%)
t
d
CL = 1 µF, ENREF is ON
at least for 10 ms
15 35 µs
Overshoot CL = 1 µF 0.5 8 % Settling Time (from V
OUT
90% to max ±0.1%
fluctuation)
CL = 1 µF 70 µs
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u External Capacitors
Parameter Symbol Conditions Min Typ Max Unit
Output Capacitor for Regulator C
L
1 µF Effective Series Resistance ESR 0.05 1 3 Bypass Capacitor C
BYPASS
100 nF
Power Amplifier Controller
Parameter Symbol Conditions Min Typ Max Unit
Maximum Output Current (sink and source)
I
OUT
3 5 mA
Output Voltage Range V
OUT
I
OUT
= 3 mA 0 V
DD
-0.4 V V
RF input power range P
IN
At DRECT pin –14 20 dBm
RAMP lowpass filter corner frequency
f
–3dB
2nd order RC filter 40 160 kHz
Bias current for external Schottky diodes
I
DRECT
,
I
DTEMP
Independent of V
DD
21.5 28 43.6 µA
PSRR f = 1 kHz
f = 10 kHz
56 41
dB
u Parameters of Operational Amplifier
Parameter Symbol Conditions Min Typ Max Unit
Input Offset Voltage V
OS
0.2 1.2 mV
DC gain A
VOL
I
OUT
from 0 to 3 mA 100 dB
Unity Gain Bandwidth F
T
3.5 MHz
Phase margin Φ
m
Unity-Gain buffer configuration 55 65 80 deg
Gain margin A
m
Unity-Gain buffer configuration 13 15 26 dB
Small-signal Slew Rate SR
S
V– = 0.13 V, V+ = 0…0.135 V step 0.2 V/µs
Large-signal Slew Rate SR
L
V– = 0.13 V, V+ = 0…3 V step 1.5 V/µs
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FUNCTION DESCRIPTION
MAS9142 contains two functionally distinct parts – the radio frequency power amplifier controller (PAC) and low-dropout voltage regulator (LDOVR). Both blocks have separate power lines, which must be connected together on the system printed circuit board.
PAC and LDOVR use common thermal protection and reference voltage generator blocks. There are three power-down pins on MAS9142: TXEN for PA controller, VRCTRL for the voltage regulator and ENREF for the reference generator and thermal protection block. All power-down pins are pull-down type and use standard CMOS control voltage levels and positive logic. The operating modes of MAS9142 are listed in the table below:
VRCTRL ENREF TXEN Mode
0 0 0 Total power-down 0 0 1 PAC on 0 1 0 References 'warm-up' 0 1 1 PAC on 1 0 0 Voltage regulator on 1 0 1 Whole chip on 1 1 0 Voltage regulator on 1 1 1 Whole chip on
The ENREF control pin is included to provide flexibility: it can be used to switch on the voltage reference block in a sufficient amount of time before the regulator or PA controller. When not used, the two other signals will turn the internal reference generator on using a logical 'OR' operation. The start­up time of the reference generator is approximately 10 ms due to the large time constant generated by the external capacitor connected to CBYPASS pin and an on-chip resistor.
Power Amplifier Controller (PAC)
The PAC is an operational amplifier based controller for adjusting the output power of a radio frequency power amplifier. It takes a voltage input at the RAMP pin and adjusts the output power of the power amplifier to a known value. This power value depends on the external rectification diodes, the directional coupler and the power amplifier control curve.
The measurement results are obtained using MAS9142 PA controller, a Hitachi PF08103B RF power amplifier, an LDC15D type directional coupler with coupling attenuation of 14 dB and a Schottky diode pair BAT62 in a feedback loop. The
measurement results are shown in Figure 1. It can be seen that a ±3σ corridor is approximately 1 dB even at very low power levels. The measurements were carried out at room temperature with a supply voltage of 3.6 V and RF input frequency of 900 MHz.
Measured Pout vs. Vramp of MAS9142
0
5
10
15
20
25
30
35
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
VRAMP, V
Pout, dBm
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
standard deviation, dB
Mean Stdev
Figure 1. MAS9142 measurement results
To achieve a better power supply rejection ratio for the PAC, the rectification diode biasing is made using a on-chip 2.8 V voltage reference generator and biasing resistors. The bias current can vary from sample to sample, but is constant in the whole operating temperature and supply voltage range with accuracy of ±2%.
MAS9142 also guarantees that the radio power is ramped up and down properly, generating only few spurious frequency components. For that reason, the control signal that comes from a D/A converter to the PAC is first low-pass filtered inside MAS9142 chip. There are also other RC time constants on the chip, which help in assuring the stability of the PA control loop. An optional stabilising capacitor can be connected between the OAMINUS and OAOUT pins of MAS9142. In the measurement setup described above, the additional compensation capacitor was not used.
Low-Dropout Voltage Regulator (LDOVR)
The LDOVR is a high performance, low dropout voltage regulator including short circuit current and thermal protection. The circuit also contains necessary reference voltage and current generators, so minimum number of external components are required.
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APPLICATION INFORMATION
OAMINUS DTEMP DRECT PSENSE VSS1 RAMP CBYPASS VRCTRL VSS2
VDD2
ENREF
VROUT
VAPC
TXEN
VDD1
OAOUT
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
MAS9142
Power
Amplifier
RM 50
Directional coupler (–14 dB)
C
BST
100µF
C
APC
100 pF
C
REG
1µF
C
VD1
100 nF
C
VD2
68 pF
0–2.2V, max. 3 mA
C
VD3
330 nF
BAT62
C
BYP
100 nF
C
FB
(Note 4)
Power ramping signal
Battery voltage (V
BAT
)
Transmit signal
VRCTRL ENREF
TXEN
Digital signals from
System Controller
2.8V, 50 mA
Antenna
CRF 10 pF
Figure 2. Application diagram of MAS9142
The application circuit diagram is shown in Figure 2.
1. The VSS1 (ground for PAC, pin 5) and VSS2
(ground for regulator, pin 9) must be connected together.
2. The VDD1 (pin 15) and VDD2 (pin 10) must be
connected together.
3. There are no external biasing components
needed for the RF rectifier, they are on the chip.
4. Loop time constant adjusting capacitor C
FB
between the OAMINUS (pin 1) and OAOUT (pin
16) is optional and its recommended value is between 100 pF and 300 pF. This capacitor is not necessary when using Hitachi PF08103B power amplifier and Murata LDC15D type directional coupler.
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PACKAGE (TSSOP16) OUTLINES
Dimension Min Max Unit
A 6.40 BSC mm B 4.30 4.50 mm C 4.90 5.10 mm D 0.05 0.15 mm E 1.10 mm F 0.19 0.30 mm
G 0.65 BSC mm
H 0.18 0.28 mm
I 0.09 0.20 mm
I1 0.09 0.16 mm
J 0.19 0.30 mm
J1 0.19 0.25 mm
K 0° 8°
L 0.24 0.26 mm
M
(The length of a terminal for
soldering to a substrate)
0.50 0.75 mm
N 1.00 REF mm
O 12°
P 12°
Dimensions do not include mold flash, protrusions, or gate burrs. All dimensions are in accordance with JEDEC standard MO-153.
B
A
C
Pin 1
D
Seating Plane
E
HGF
B
BDetail A
L
K
M
N
P
O
Detail A
I I1
J
J1
Section B-B
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SOLDERING INFORMATION
Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220°C Maximum Reflow Temperature 235°C Maximum Number of Reflow Cycles 2 Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
Dimension Min Max Unit
A
0
6.50 6.70 mm
B
0
5.20 5.40 mm
D
0
1.50 +0.10 / -0.00 mm
D
1
1.50 mm
E
1
1.65 1.85 mm
F
1
7.20 7.30 mm
K
0
1.20 1.40 mm
P 11.90 12.10 mm
P
0
4.0 mm
P
2
1.95 2.05 mm
S
1
0.6 mm
T 0.25 0.35 mm
W 11.70 12.30 mm
All dimensions are in accordance with EIA-481 Standard.
P
0
P
P
2
A
0
D
1
D
0
A
A
Section A - A
E
1
F
1
W
Tape Feed Direction
B
0
T
K
0
S
1
Tape Feed Direction
Pin 1 Designator
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REEL SPECIFICATIONS
Dimension Min Max Unit
A 330 mm B 1.5 mm C 12.80 13.50 mm D 20.2 mm N 50 mm
W
1
(measured at hub)
12.4 14.4 mm
W
2
(measured at hub)
18.4 mm
Trailer 160 mm
Leader 390,
of which minimum 160mm
of empty carrier tape
sealed with cover tape
mm
Weight 1500 g
DA
B
C
N
W
1
W
2
Tape Slot for Tape Start
ComponentsTrailer
Leader
Carrier Tape
Cover Tape
Start
End
2000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static
Dissipative
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ORDERING INFORMATION
Product Code Product Package Comments
MAS9142AUA1-T PAC & 2.8 V LDO Regulator TSSOP16 Tape & Reel
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy Kamreerintie 2, P.O.Box 51 FIN-02771 Espoo, FINLAND www.mas-oy.com
Tel. (09) 80521 Tel. Int. +358 9 80521 Telefax +358 9 8053213 Email: info@mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
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