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DA1175.004
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MAS1175
IC FOR 10.00 – 20.00 MHz VCTCXO
• Low Cost
• Low Power
• Wide Supply Voltage Range
• True Sine Wave Output
• Very High Level of Integration
• Electrically Trimmable
• Very Low Phase Noise
DESCRIPTION
The MAS1175 is an integrated circuit well suited to
build VCTCXO for mobile communication. Only two
external components are needed. Temperature
calibration is achieved with three calibration points
only. The trimming is done by a serial bus and the
calibration information is stored in an internal
PROM.
To build a VCTCXO only two additional
components, a varactor and a crystal are needed.
The compensation method is fully analog. IC
compensation work is continuous without
generating any steps or other interferences.
FEATURES APPLICATIONS
• Very small size
• Minimum current draw
• Wide operating temperature range
• Phase noise <-130 dBc/Hz at 1 kHz offset
• VCTCXO for mobile phones
• VCTCXO for other telecommunications
systems
BLOCK DIAGRAM
This is preliminary information on a
new product under development.
Micro Analog Systems Oy reserves
the right to make any changes
without notice.
MAS1175A
TVrefTMux
Σ
DA
CLK
PV
VSS
VC
VDD
4
4
f(T)
f(T)
4
8
CUB
INF
SENS
LIN
8
CDAC1
CDAC2
TE1
TE2
X2
OUT
X1
2
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PIN DESCRIPTION
Pin Description Symbol x-coordinate y-coordinate
Power Supply Voltage VDD 263 1330
Programming Input PV 503 1326
Serial Bus Clock Input CLK 745 1321
Serial Bus Data Input DA 1001 1321
Temperature Output TE1 1246 1325
Test Multiplexer Output TE2 1454 1325
Voltage Control Input VC 190 231
Crystal Oscillator Output X1 398 231
Crystal/Varactor Oscillator Input X2 1355 231
Power Supply Ground VSS 1828 242
Buffer Output OUT 2031 231
Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Min Max Unit Note
Supply Voltage V
DD
- V
SS
-0.3 6.0 V
Input Voltage V
IN
V
SS
-0.3 VDD + 0.3 V 1)
Power Dissipation P
MAX
100 mW
Operating Temperature T
OP
-35 85
o
C
Storage Temperature T
ST
-40 120
o
C
Note: Not valid for programming pins PV
RECOMMENDED OPERATION CONDITIONS
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage V
DD
2.7 2.8 5.5 V
Supply Current I
CC
Vcc = 2.8 Volt 1.8 mA
Operable Temperature T
C
-30 +85
o
C
Storage Temperature T
S
Relative humidity =
15%…70%
-5 +40
o
C
Crystal Pulling Sensitivity S 30 ppm/pF
Load Capacitance C
L
10 pF
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ELECTRICAL CHARACTERISTICS
Parameter Symbol Min Typ Max Unit Note
Frequency range f
o
10.00 20.00 MHz
Voltage Control Range V
C
0Vdd
Voltage Control Sensitivity V
CSENS
10 ppm/V
Output Voltage (10kΩ // 10 pF)
V
out
1.0 Vpp
Compensation Range ± 2.5 ppm T
C
-30 85
o
C
Compensation Range ± 2.0 ppm T
C
-25 75
o
C
Compensation Range linear part a1 -0.7 0.0 ppm/K
Compensation Inflection Point INF 25 31
o
C
Compensation Range Cubic part a3 95 ppm2/K
3
Compensation CDAC1 (8 Bit) C
X1
C10 C10 + 18 pF 2)
Compensation CDAC2 (2 Bit) C
X2
C20 C20 + 4 pF 3)
Startup Time T
START
2ms
Note 2: typ C10 = 14pF
Note 3: typ C20 = 5pF (varactor capacitance has to be added)
IC OUTLINES
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DEVICE PACKAGE OUTLINES MSOP10
Dimension Min Typical Max Unit
A1.10mm
A1 0.05 0.10 0.15 mm
D 2.90 3.00 3.10 mm
E 4.75 4.90 5.05 mm
E1 2.90 3.00 3.10 mm
b 0.15 0.23 0.30 mm
L 0.40 0.55 0.70 mm
L1 0.95 BSC
e0.50BSC
S0.50BSC
L2 0.25 BSC
Dimensions according to JEDEC MO-187BA Standard
DEVICE OUTLINE CONFIGURATION
MSOP10
TE2
DA
CLK
PV
VDD
OUT
VSS
X2
X1
VC
Top View
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ORDERING INFORMATION
Product Code Product Package Comments
MAS1175ATB1 IC FOR VCTCXO Tested wafers, 480 µm Die Size 2.233x1.556 mm
MAS1175ASM1-T IC FOR VCTCXO MSOP10 Tape & Reel
Please contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
http://www.mas-oy.com
Tel. (09) 80 521
Tel. Int. +358 9 80 521
Telefax +358 9 805 3213
Email: info@mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make c hanges to the products contained in t hi s data sheet in order to improve the des i gn or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unl ess otherwise specified in this data sheet, and makes no
claim that the circ uits are free from patent infringement . Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy mak es no claim or warranty that such applications will be suitable for t he use specified without further testing or
modification.
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