The MA4P1250 and MA4P1450 are square surface mountable PIN diodes in a non-rollable, metal electrode leadless faced (MELF) package. They incorporate passivated
PIN diode chips that are full face bonded to refractory
metal pins. These parts utilize M/A-COM’s HIPAX technology in a low inductance ceramic package with no ribbons or whisker wires. The package is hermetically
sealed at temperatures exceeding 300˚C.
Applications
The MA4P1250 is designed for use as a low loss switching element from HF through UHF. Its high power rating
allows performance in antenna switch elements at RF
power levels greater than 100 watts CW. It is designed to
meet the low distortion requirements of mobile radios.
MA4P1250, MA4P1450 SMQ™
V3.00
Size, Inches (mm)
CaseA(sq.)BC
Model No.StyleMin./Max.Min./Max.Min./Max.
MA4P12501072
MA4P14501091
FULL FACE
BOND
0.080/0.095 0.115/0.135
(2.03/2.41)(2.92/3.43)
0.138/0.155 0.180/0.200
(3.51/3.94)(4.57/5/08)
PASSIVATED
PIN DIODE CHIP
0.008/0.030
(0.203/0.762)
The MA4P1450 is a higher power diode. It has lower distortion at RF CW power greater than 10 watts and can
dissipate 7.5 watts.
Designed for Automated Assembly
These surface mount PIN diodes are designed for high
volume tape and reel assembly. The square package
CERAMIC
SOLDERABLE
SURFACES
eases automatic pick and place indexing and assembly.
The parallel flat surfaces are suitable for key jaw or vacuum pickup techniques. All solderable surfaces are tin
plated and compatible with reflow and vapor phase soldering methods.
Envir onmental Capability
These HIPAX diodes are applicable for use in industrial
and military applications. They can meet the environmental requirements of MIL-STD-750 and MIL-STD-202 or be
screened to JAN-TX and other high reliability standards.