Datasheet M74HCT652, M74HCT651 Datasheet (SGS Thomson Microelectronics)

Page 1
M74HCT651 M74HCT652
HCT651 OCTAL BUS TRANSCEIVER/REGISTER (3-STATE, INV.)
HCT652 OCTAL BUS TRANSCEIVER/REGISTER (3-STATE)
.HIGH SPEED
f
= 60 MHz (TYP.)AT VCC=5V
.COMPATIBLE WITHTTL OUTPUTS
VIH= 2 V (MIN.) AT VIL= 0.8V (MAX)
.LOWPOWER DISSIPATION
ICC=4µA(MAX) AT TA=25oC
.OUTPUTDRIVE CAPABILITY
15 LSTTL LOADS
.SYMMETRICAL OUTPUT IMPEDANCE
IOH =IOL= 6 mA (mIN.)
B1R
(PlasticPackage)
M1R
(MicroPackage)
.BALANCEDPROPAGATIONDELAYS
t
PLH=tPHL
.PIN ANDFUNCTION COMPATIBLE
WITH 54/74LS651/652
DESCRIPTION
M74HCT651/652 are high speed CMOS OCTAL BUS TRANSCEIVERS AND REGISTERS (3-STATE), fabricated in silicon gate C2MOS technology. They have the same high speed performance of LSTTL combined with true CMOS low power consumption. These devices consist of bustransceiver circuits, D-typeflip-flops, andcontrol circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal storage registers. Enable GAB and GBA are provided to control the transceiverfunctions. Select AB andSelect BA control pins are provided to select whether real-time orstored dataistransfered. A low input levelselectsreal-time data, anda high selects stored data. Data onthe A or B bus, or both,can be stored in the internal D flip-flops by low-to-high transitionsattheappropriate clock pins(CLOCKAB or CLOCK BA) regardless of the select or enable controlpins.When select ABand selectBAareinthe real-time transfer mode, it is also possible to store data without using the internal D-type flip-flops by simultaneously enabling GAB and GBA. In this configuration each outputreinforces its input. Thus, when all other data sources to the two sets of bus linesareat highimpedance, eachset ofbuslineswill remain at its last state. All inputs are equipped with protection circuits against static discharge and transient excess voltage.This integrated circuit has input and output characteristics that are fully compatible with 54/74 LSTTL logic families. M54/74HCT devices are designed to directly interface HSCMOS systems with TTL and NMOS components. Theyare also plugin replacements for LSTTL devices giving a reduction of power consumption.
M74HC X XXM1R M74HC XXXB1R
PIN CONNECTIONS (top view)
INPUT AND OUTPUT EQUIVALENT CIRCUIT
GAB,GAB, CAB, A, B SAB,SBA, CBA
ORDER CODES :
October 1993
1/12
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M74HCT651/652
LOGIC DIAGRAM (HCT651)
Note: Incase of 74HCT652 outputinvertermarked *at A busand B bus are eliminated.
TIMING CHART
2/12
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M74HCT651/652
TRUTH TABLE
HCT652 (The tru th table for HC T651 is the same as this, but with th e o utputs invert ed)
GAB GBA CAB CBA SAB SBA A B FUNCTION
INPUTS INPUTS Both the A bus and the B bus are inputs
LH
LL
HH
HL
X : DON’TCARE Z :HIGHIMPEDANCE Qn :THE DATA STOREDTO THE INTERNALFLIP-FLOPSBY MOST RECENTLOWTO HIGH TRANSITIONOF THECLOCK INPUTS * : THE DATAAT THE A AND B BUS WILLBE STORED TOTHE INTERNALFLIP-FLOPSON EVERY LOWTO HIGH TRANSITIONOF
THECLOCK INPUTS
X X X X Z Z The output functions of the A and B bus are disabled
X X INPUTS INPUTS Both the A and B bus are used for inputs to the
internal flip-flops. Data at the bus will be stored on low to high transition of the clock inputs
OUTPUTS INPUTS The A bus are outputs and the B bus are inputs
X* X X L L L The data at the B bus are displayed at the A bus
HH
X* X L L L The data at the B bus ar displayed at the A bus.
HH
The data of the B bus are stored to the internal flip-flop on low to high transition of th clock pulse
X* X X H Qn X The data stored to the internal flip-flop are dispayed
at the A bus
X* X H L L The data at the B bus are stored to the internal flip-
HH
flop on low to high transition of the clock pulse. The states of the internal flip-flops output directly to the A bus
INPUTS OUTPUTS The A bus are inputs and the B bus are outputs
XX*L X
L L The data at the A bus are displayed at the B bus HH
X* L X L L The data at the A bus are displayed at the B bus.
HH
The data of the A bus are stored to the internal flip­flop on low to high transition of the clock pulse
X X* H X X Qn The data stored to the internal flip-flops are
displayed at the B bus
X* H X L L the data at the A bus are stored to the internal flip-
HH
flop on low to high transition of the clock pulse. The states of the internal flip-flops output directly to the B bus
OUTPUTS OUTPUTS Both the A bus and the B bus are outputs
X X H H Qn Qn The data stored to the internal flip-flops are
displayed at the A and B bus respactively
H H Qn Qn The output at the A bus are displayed at the B bus,
the output at the B bus are displayed at the A bus respectively
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M74HCT651/652
PIN DESCRIPTION
PIN No SYMBOL NAME AND FUNCTION
1 CLOCK AB A to B Clock Input (LOW to HIGH, Edge-Trigged) 2 SELECT AB Select A to B Source Input 3 GAB Direction Control Input
4, 5, 6, 7, 8, 9, 10, 11 A1 to A8 A data Inputs/Outputs
20, 19, 18, 17, 16, 15, 14, 13 B1 to B8 B Data Inputs/Outputs
21 GBA Output Enable Input (Active LOW) 22 SELECT BA Select B to A Source Input 23 CLOCK BA B to A Clock Input (LOW to HIGH, Edge-Triggered) 12 GND Ground (0V) 24 V
IEC LOGIC SYMBOLS
HCT651 HCT652
CC
Positive Supply Voltage
4/12
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M74HCT651/652
ABSOLU TE M AXIMU M R AT INGS
Symbol Parameter Value Unit
V
CC
V
V
O
I
IK
I
OK
I
O
I
or I
CC
P
D
T
stg
T
AbsoluteMaximumRatingsarethosevalues beyondwhichdamage tothedevicemayoccur.Functional operationunder theseconditionisnotimplied.
RECO MM ENDED OPERAT IN G CO NDITIO NS
Symbol Parameter Value Unit
V
CC
V
I
V
O
T
op
t
r,tf
Supply Voltage -0.5 to +7 V DC Input Voltage -0.5 to VCC+ 0.5 V
I
DC Output Voltage -0.5 to VCC+ 0.5 V DC Input Diode Current ± 20 mA DC Output Diode Current ± 20 mA DC Output Source Sink Current Per Output Pin ± 35 mA DC VCCor Ground Current ± 70 mA
GND
Power Dissipation 500 (*) mW Storage Temperature -65 to +150 Lead Temperature (10 sec) 300
L
Supply Voltage 4.5 to 5.5 V Input Voltage 0 to V Output Voltage 0 to V
CC CC
Operating Temperature: -40 to +85 Input Rise and Fall Time (VCC= 4.5 to 5.5V) 0 to 500 ns
o
C
o
C
V V
o
C
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M74HCT651/652
DC SPECIFICATIONS
Symbol Parameter
V
V
High Level Input Voltage 4.5
IH
Low Level Input
IL
Voltage
V
V
I I
I
High Level Output Voltage
OH
Low Level Output Voltage
OL
Input Leakage Current (*) 5.5 VI=VCCor GND ±0.1 ±1 µA
I
I
3 State Output Off State Current 5.5 VI=VCCor GND ±0.5 ±5.0 µA
OZ
Quiescent Supply Current 5.5 VI=VCCor GND 1 10 µA
CC
Additional worst case supply
CC
current
(*):Applicableonlyto GAB,GBA,CAB,CBA,SAB, SBAinput
V
Test Conditions Value
CC
(V)
TA=25oC -40 to 85oC
Min. Typ. Max. Min. Max.
2.0 2.0 V
to
5.5
4.5 to
5.5
VI=
IO=-20 µA 4.4 4.5 4.4
V
IH
I
=-6.0 mA 4.18 4.31 4.13
4.5
4.5
O
or
V
IL
VI=
IO=20µA 0.0 0.1 0.1
V
IH
I
= 6.0 mA 0.17 0.26 0.33
O
or
V
IL
5.5 Per Input pin
V
= 0.5V or
I
VI= 2.4V
Other Inputs at
VCCor GND
Unit
0.8 0.8 V
V
V
2.0 2.9 mA
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M74HCT651/652
AC ELECTRICAL CHARACTERISTICS (Inp ut tr=tf=6ns)
Test Conditions Value
Symbol Parameter
t
TLH
t
THL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PZL
t
PZH
t
PLZ
t
PHZ
f
MAX
t
W(H)
t
W(L)
C
C
C
PD
(*) CPDisdefined as the valueof the IC’s internal equivalent capacitance whichis calculated fromthe operatingcurrent consumption withoutload. (RefertoTest Circuit).Average operting currentcan be obtained by the followingequation. ICC(opr) = CPD•VCC•fIN+ICC/8(per Channel)
Output Transition Time 4.5 50 7 12 15 ns
Propagation Delay Time (BUS - BUS)
Propagation Delay Time (CLOCK - BUS)
Propagation Delay Time (SELECT - BUS)
3-State Output Enable Time (GAB,GBA - BUS)
Output Disable Time (GAB,GBA - BUS)
Maximum Clock Frequency 4.5 50 31 55 25 MHz Minimum Clock Pulse Width 4.5 50 8 15 19 ns
Minimum Set-up Time 4.5 50 3 10 13 ns
t
s
t
Minimum Hold Time 4.5 50 5 5 ns
h
Input Capacitance 5 10 10 pF
IN
Bus Terminal Capacitance 13 pF
I/O
(*) Power Dissipation Capacitance for HCT651
V
(V)
CC
C
(pF)
L
TA=25oC -40 to 85oC
Min. Typ. Max. Min. Max.
4.5 50 20 30 38 ns
4.5 150 25 38 48 ns
4.5 50 29 44 55 ns
4.5 150 34 52 65 ns
4.5 50 24 34 43 ns
4.5 150 29 42 53 ns
4.5 50 RL=1K 22 33 41 ns
4.5 150 R
=1K 27 41 51 ns
L
4.5 50 RL=1K 24 35 44 ns
38
for HCT652
39
Unit
pF
7/12
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M74HCT651/652
SWITCHING CHARACTERISTICS TEST CIRCUIT AND WAVEFORM
WAVEFORM 1 WAVEFORM 2
WAVEFORM3
GBA =”H”
WAVEFORM5
WAVEFORM 4
GAB= ”L”
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Page 9
TEST WAVEFORM ICC(Opr.)
INPUT TRANSITIONTIME IS THE SAME AS THAT INCASE OF SWITCHINGCHARACTERISTICSTEST.
M74HCT651/652
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M74HCT651/652
Plastic DIP24 (0.25) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.63 0.025
b 0.45 0.018
b1 0.23 0.31 0.009 0.012
b2 1.27 0.050
D 32.2 1.268
E 15.2 16.68 0.598 0.657
e 2.54 0.100
e3 27.94 1.100
F 14.1 0.555
I 4.445 0.175
L 3.3 0.130
mm inch
10/12
P043A
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SO24 MECHANICAL DATA
M74HCT651/652
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.65 0.104 a1 0.10 0.20 0.004 0.007 a2 2.45 0.096
b 0.35 0.49 0.013 0.019
b1 0.23 0.32 0.009 0.012
C 0.50 0.020 c1 45° (typ.)
D 15.20 15.60 0.598 0.614
E 10.00 10.65 0.393 0.420
e 1.27 0.05
e3 13.97 0.55
F 7.40 7.60 0.291 0.299 L 0.50 1.27 0.19 0.050
S8°(max.)
mm inch
L
A
a2
b
e3
D
24 13
112
e
F
s
a1
c1
b1
C
E
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M74HCT651/652
Information furnished is believed tobe accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringementof patents or other rights of third partieswhich mayresults from its use. No license isgranted by implicationor otherwise underany patent or patentrights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to changewithout notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorizedforuse ascritical componentsinlife supportdevices orsystems withoutexpress written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
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